JP6240069B2 - エポキシ樹脂組成物、およびその硬化物、並びに、硬化性樹脂組成物 - Google Patents

エポキシ樹脂組成物、およびその硬化物、並びに、硬化性樹脂組成物 Download PDF

Info

Publication number
JP6240069B2
JP6240069B2 JP2014520060A JP2014520060A JP6240069B2 JP 6240069 B2 JP6240069 B2 JP 6240069B2 JP 2014520060 A JP2014520060 A JP 2014520060A JP 2014520060 A JP2014520060 A JP 2014520060A JP 6240069 B2 JP6240069 B2 JP 6240069B2
Authority
JP
Japan
Prior art keywords
resin composition
curable resin
epoxy resin
epoxy
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014520060A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2013183736A1 (ja
Inventor
政隆 中西
政隆 中西
清二 江原
清二 江原
一真 井上
一真 井上
香津美 小淵
香津美 小淵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Kayaku Co Ltd
Original Assignee
Nippon Kayaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Co Ltd filed Critical Nippon Kayaku Co Ltd
Priority to JP2014520060A priority Critical patent/JP6240069B2/ja
Publication of JPWO2013183736A1 publication Critical patent/JPWO2013183736A1/ja
Application granted granted Critical
Publication of JP6240069B2 publication Critical patent/JP6240069B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/26Di-epoxy compounds heterocyclic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/681Metal alcoholates, phenolates or carboxylates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/02Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterized by the type of post-polymerisation functionalisation
    • C08G2650/20Cross-linking

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2014520060A 2012-06-07 2013-06-06 エポキシ樹脂組成物、およびその硬化物、並びに、硬化性樹脂組成物 Active JP6240069B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014520060A JP6240069B2 (ja) 2012-06-07 2013-06-06 エポキシ樹脂組成物、およびその硬化物、並びに、硬化性樹脂組成物

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2012129406 2012-06-07
JP2012129406 2012-06-07
JP2012129408 2012-06-07
JP2012129408 2012-06-07
PCT/JP2013/065756 WO2013183736A1 (ja) 2012-06-07 2013-06-06 エポキシ樹脂組成物、およびその硬化物、並びに、硬化性樹脂組成物
JP2014520060A JP6240069B2 (ja) 2012-06-07 2013-06-06 エポキシ樹脂組成物、およびその硬化物、並びに、硬化性樹脂組成物

Publications (2)

Publication Number Publication Date
JPWO2013183736A1 JPWO2013183736A1 (ja) 2016-02-01
JP6240069B2 true JP6240069B2 (ja) 2017-11-29

Family

ID=49712123

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014520060A Active JP6240069B2 (ja) 2012-06-07 2013-06-06 エポキシ樹脂組成物、およびその硬化物、並びに、硬化性樹脂組成物

Country Status (7)

Country Link
JP (1) JP6240069B2 (zh)
KR (1) KR101913603B1 (zh)
CN (1) CN104395371B (zh)
MY (1) MY169102A (zh)
SG (1) SG11201408155RA (zh)
TW (2) TW201412804A (zh)
WO (1) WO2013183736A1 (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6239599B2 (ja) * 2013-04-25 2017-11-29 日本化薬株式会社 フェノール樹脂、該フェノール樹脂を含有するエポキシ樹脂組成物、およびその硬化物
JP6550843B2 (ja) * 2014-03-31 2019-07-31 三菱ケミカル株式会社 エポキシ樹脂、エポキシ樹脂組成物、硬化物及び電気・電子回路用積層板
US10233295B2 (en) 2014-04-15 2019-03-19 Mitsubishi Gas Chemical Company, Inc. Fiber-reinforced composite material
JP2015209509A (ja) * 2014-04-28 2015-11-24 京セラケミカル株式会社 エポキシ樹脂組成物および樹脂封止型電子部品装置
KR102327347B1 (ko) 2014-08-22 2021-11-16 닛뽄 가야쿠 가부시키가이샤 에폭시(메타)아크릴레이트 화합물 및 그것을 함유하는 수지 조성물 그리고 그의 경화물, 컬러 필터 및 표시 소자
CN106604947B (zh) * 2014-08-26 2019-08-06 日本化药株式会社 反应性聚酯化合物、使用该化合物的活性能量射线固化型树脂组合物
JP6428147B2 (ja) * 2014-10-22 2018-11-28 味の素株式会社 樹脂組成物
WO2016147735A1 (ja) * 2015-03-18 2016-09-22 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート、及びプリント配線板
JP2017071706A (ja) * 2015-10-08 2017-04-13 日本化薬株式会社 エポキシ樹脂組成物、硬化性樹脂組成物およびその硬化物
KR102593694B1 (ko) * 2015-11-04 2023-10-24 린텍 가부시키가이샤 경화성 수지 필름 및 제1 보호막 형성용 시트
CN105714857A (zh) * 2016-02-03 2016-06-29 袁根木 最长的跨海江底的管段预制用钢丝网片代替模板方法
JP7385344B2 (ja) * 2016-03-28 2023-11-22 積水化学工業株式会社 熱硬化性樹脂組成物及び多層基板
US10487077B1 (en) 2018-06-14 2019-11-26 Sabic Global Technologies B.V. Bis(benzoxazinyl)phthalimidine and associated curable composition and composite
CN109401707B (zh) * 2018-11-01 2020-12-08 烟台信友新材料有限公司 一种单组份高耐温抗冲击阻燃型结构胶黏剂及其制备方法
JP7184002B2 (ja) * 2019-09-13 2022-12-06 味の素株式会社 樹脂組成物
JP7491741B2 (ja) 2020-05-27 2024-05-28 住友化学株式会社 エポキシ樹脂組成物及びその硬化物
CN112379546B (zh) * 2020-11-23 2022-08-19 珠海兴业新材料科技有限公司 聚合物分散染料液晶材料、电致变色调光薄膜及制备方法
WO2024024620A1 (ja) * 2022-07-26 2024-02-01 三井化学株式会社 表示装置用封止材、封止材、有機elディスプレイおよびledディスプレイ

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH496021A (de) * 1966-03-10 1970-09-15 Ciba Geigy Verfahren zur Herstellung von neuen Polyglycidyläthern
JPH01108218A (ja) * 1987-10-21 1989-04-25 Mitsui Petrochem Ind Ltd エポキシ樹脂の精製方法
JPH01108217A (ja) * 1987-10-21 1989-04-25 Mitsui Petrochem Ind Ltd エポキシ樹脂の精製方法
JP2556366B2 (ja) * 1988-11-25 1996-11-20 日本化薬株式会社 高純度エポキシ樹脂及びその製造方法
JPH0892231A (ja) * 1994-09-22 1996-04-09 Mitsui Toatsu Chem Inc スピロビインダンジグリシジルエーテルおよびその製造方法
JPH11255864A (ja) * 1998-03-09 1999-09-21 Toshiba Corp 液状エポキシ樹脂組成物および樹脂封止型半導体装置
JP2000007757A (ja) * 1998-04-22 2000-01-11 Asahi Chiba Kk 新規エポキシ樹脂
JP2002114835A (ja) * 2000-10-06 2002-04-16 Asahi Denka Kogyo Kk エポキシ樹脂用硬化剤組成物及び塗料組成物
JP2004099744A (ja) * 2002-09-10 2004-04-02 Mitsui Chemicals Inc エポキシ樹脂の精製方法
CN1816580B (zh) * 2003-02-03 2010-04-28 新日铁化学株式会社 环氧树脂、其制造方法、使用该环氧树脂的环氧树脂组合物以及固化物
JP2005154719A (ja) 2003-04-25 2005-06-16 Mitsui Chemicals Inc エポキシ樹脂組成物およびその用途
JP2007063565A (ja) * 2006-10-17 2007-03-15 Sumitomo Bakelite Co Ltd 半導体用樹脂ペースト及び半導体装置
KR101458240B1 (ko) * 2007-05-08 2014-11-04 미츠비시 가스 가가쿠 가부시키가이샤 테트라글리시딜아미노 화합물의 제조 방법
KR101383434B1 (ko) * 2008-07-31 2014-04-08 세키스이가가쿠 고교가부시키가이샤 에폭시 수지 조성물, 프리프레그, 경화체, 시트상 성형체, 적층판 및 다층 적층판
JP5153000B2 (ja) * 2009-04-01 2013-02-27 新日鉄住金化学株式会社 エポキシ樹脂、その製造方法、エポキシ樹脂組成物および硬化物
WO2010119960A1 (ja) * 2009-04-17 2010-10-21 日本化薬株式会社 オレフィン樹脂、エポキシ樹脂、硬化性樹脂組成物及びその硬化物
JPWO2011114687A1 (ja) * 2010-03-15 2013-06-27 住友ベークライト株式会社 半導体封止用樹脂組成物およびこれを用いた半導体装置
JP5404514B2 (ja) * 2010-04-19 2014-02-05 日本化薬株式会社 エポキシ樹脂の製造法、エポキシ樹脂、および硬化性樹脂組成物
JP5732774B2 (ja) * 2010-08-16 2015-06-10 Dic株式会社 エポキシ樹脂組成物、硬化性樹脂組成物、その硬化物、及びプリント配線基板
JP5745248B2 (ja) * 2010-10-08 2015-07-08 株式会社ダイセル エポキシ樹脂用硬化剤組成物、硬化性樹脂組成物及びその硬化物

Also Published As

Publication number Publication date
TWI647248B (zh) 2019-01-11
TW201809054A (zh) 2018-03-16
JPWO2013183736A1 (ja) 2016-02-01
CN104395371B (zh) 2017-03-15
KR101913603B1 (ko) 2018-10-31
MY169102A (en) 2019-02-18
WO2013183736A1 (ja) 2013-12-12
SG11201408155RA (en) 2015-01-29
CN104395371A (zh) 2015-03-04
KR20150030645A (ko) 2015-03-20
TW201412804A (zh) 2014-04-01

Similar Documents

Publication Publication Date Title
JP6240069B2 (ja) エポキシ樹脂組成物、およびその硬化物、並びに、硬化性樹脂組成物
JP5517237B2 (ja) エポキシ化合物の製造方法、エポキシ化合物、硬化性樹脂組成物及びその硬化物
JP5559154B2 (ja) オレフィン樹脂、エポキシ樹脂、硬化性樹脂組成物及びその硬化物
JP6090765B2 (ja) フェノール樹脂、エポキシ樹脂、および硬化性樹脂組成物
JP5430337B2 (ja) ジオレフィン化合物、エポキシ樹脂、硬化性樹脂組成物及びその硬化物
KR102226437B1 (ko) 에폭시 수지, 경화성 수지 조성물 및 그 경화물
JP5780627B2 (ja) エポキシ化合物の製造方法
JP5505960B2 (ja) ジオレフィン化合物、エポキシ樹脂、硬化性樹脂組成物及びその硬化物
JP5367065B2 (ja) オレフィン化合物、エポキシ樹脂、硬化性樹脂組成物及びその硬化物、led装置
JP6016647B2 (ja) エポキシ樹脂、および硬化性樹脂組成物
JP6284732B2 (ja) エポキシ樹脂混合物、および硬化性樹脂組成物
JP5878865B2 (ja) ジオレフィン化合物、エポキシ樹脂、硬化性樹脂組成物及びその硬化物
JP6403554B2 (ja) フェノール樹脂、エポキシ樹脂、エポキシ樹脂組成物、およびその硬化物
JP2007204604A (ja) 液状エポキシ樹脂、エポキシ樹脂組成物、および硬化物
JP5196663B2 (ja) ジオレフィン化合物、エポキシ樹脂、硬化性樹脂組成物及びその硬化物
JPWO2015083748A1 (ja) フェノール樹脂、エポキシ樹脂、エポキシ樹脂組成物、およびその硬化物
JP5660778B2 (ja) ジオレフィン化合物、エポキシ化合物、及び該組成物
JP2010254628A (ja) ジオレフィン化合物、エポキシ化合物、硬化性樹脂組成物及びその硬化物

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160115

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160614

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160809

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20161011

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20161209

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20170509

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170808

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20170817

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20171024

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20171102

R150 Certificate of patent or registration of utility model

Ref document number: 6240069

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250