MX9305603A - Metodo y aparato para producir dispositivos de circuito integrado. - Google Patents
Metodo y aparato para producir dispositivos de circuito integrado.Info
- Publication number
- MX9305603A MX9305603A MX9305603A MX9305603A MX9305603A MX 9305603 A MX9305603 A MX 9305603A MX 9305603 A MX9305603 A MX 9305603A MX 9305603 A MX9305603 A MX 9305603A MX 9305603 A MX9305603 A MX 9305603A
- Authority
- MX
- Mexico
- Prior art keywords
- integrated circuit
- circuit devices
- producing integrated
- producing
- multiplicity
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06551—Conductive connections on the side of the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06579—TAB carriers; beam leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06589—Thermal management, e.g. cooling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00013—Fully indexed content
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Abstract
Se describe y reivindica un método para producir dispositivos de circuito integrado que incluye los pasos de producir una pluralidad de circuitos integrados sobre una pastilla, incluyendo cada uno de los circuitos integrados una multiplicidad de terminales hembra y rebanar posteriormente la pastilla, para definir de esa manera una pluralidad de elementos de circuito integrado; y en donde el paso de rebanar expone superficies seccionales de la multiplicidad terminales hembra. También se describe y reivindica un aparato para llevar a cabo el método así como los dispositivos de circuito integrado.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP1992/002134 WO1994007267A1 (en) | 1992-09-14 | 1992-09-14 | Methods and apparatus for producing integrated circuit devices |
Publications (1)
Publication Number | Publication Date |
---|---|
MX9305603A true MX9305603A (es) | 1994-05-31 |
Family
ID=8165681
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX9305603A MX9305603A (es) | 1992-09-14 | 1992-09-14 | Metodo y aparato para producir dispositivos de circuito integrado. |
Country Status (23)
Country | Link |
---|---|
US (2) | US5455455A (es) |
EP (1) | EP0660967B1 (es) |
JP (1) | JP3621093B2 (es) |
KR (1) | KR100310220B1 (es) |
AT (1) | ATE200593T1 (es) |
AU (1) | AU2554192A (es) |
BG (1) | BG99554A (es) |
CA (1) | CA2144323C (es) |
DE (1) | DE69231785T2 (es) |
DK (1) | DK0660967T3 (es) |
EC (1) | ECSP930975A (es) |
FI (1) | FI951142A (es) |
GT (1) | GT199300053A (es) |
HU (1) | HUT73312A (es) |
IL (1) | IL106710A (es) |
MA (1) | MA25277A1 (es) |
MX (1) | MX9305603A (es) |
MY (1) | MY129454A (es) |
NO (1) | NO950960L (es) |
PL (1) | PL169823B1 (es) |
PT (1) | PT101354A (es) |
WO (1) | WO1994007267A1 (es) |
ZA (1) | ZA936039B (es) |
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-
1992
- 1992-09-14 DE DE69231785T patent/DE69231785T2/de not_active Expired - Fee Related
- 1992-09-14 EP EP92919323A patent/EP0660967B1/en not_active Expired - Lifetime
- 1992-09-14 US US07/962,222 patent/US5455455A/en not_active Expired - Lifetime
- 1992-09-14 HU HU9500783A patent/HUT73312A/hu unknown
- 1992-09-14 JP JP50772194A patent/JP3621093B2/ja not_active Expired - Lifetime
- 1992-09-14 PL PL92308140A patent/PL169823B1/pl unknown
- 1992-09-14 KR KR1019950700986A patent/KR100310220B1/ko not_active IP Right Cessation
- 1992-09-14 MX MX9305603A patent/MX9305603A/es not_active IP Right Cessation
- 1992-09-14 AT AT92919323T patent/ATE200593T1/de active
- 1992-09-14 CA CA002144323A patent/CA2144323C/en not_active Expired - Fee Related
- 1992-09-14 AU AU25541/92A patent/AU2554192A/en not_active Abandoned
- 1992-09-14 WO PCT/EP1992/002134 patent/WO1994007267A1/en active IP Right Grant
- 1992-09-14 DK DK92919323T patent/DK0660967T3/da active
-
1993
- 1993-08-16 IL IL10671093A patent/IL106710A/xx not_active IP Right Cessation
- 1993-08-18 ZA ZA936039A patent/ZA936039B/xx unknown
- 1993-08-20 EC EC1993000975A patent/ECSP930975A/es unknown
- 1993-09-02 PT PT101354A patent/PT101354A/pt not_active Application Discontinuation
- 1993-09-09 GT GT199300053A patent/GT199300053A/es unknown
- 1993-09-13 MA MA23286A patent/MA25277A1/fr unknown
- 1993-09-14 MY MYPI93001866A patent/MY129454A/en unknown
-
1994
- 1994-07-13 US US08/274,251 patent/US5547906A/en not_active Expired - Lifetime
-
1995
- 1995-03-10 FI FI951142A patent/FI951142A/fi not_active Application Discontinuation
- 1995-03-13 NO NO950960A patent/NO950960L/no unknown
- 1995-04-10 BG BG99554A patent/BG99554A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
DE69231785T2 (de) | 2001-11-15 |
PT101354A (pt) | 1994-07-29 |
GT199300053A (es) | 1995-03-03 |
JP3621093B2 (ja) | 2005-02-16 |
DE69231785D1 (de) | 2001-05-17 |
IL106710A0 (en) | 1993-12-08 |
EP0660967A1 (en) | 1995-07-05 |
NO950960D0 (no) | 1995-03-13 |
ATE200593T1 (de) | 2001-04-15 |
DK0660967T3 (da) | 2001-08-13 |
EP0660967B1 (en) | 2001-04-11 |
IL106710A (en) | 1997-01-10 |
ECSP930975A (es) | 1994-04-20 |
KR100310220B1 (ko) | 2001-12-17 |
WO1994007267A1 (en) | 1994-03-31 |
BG99554A (en) | 1996-03-29 |
FI951142A (fi) | 1995-05-10 |
FI951142A0 (fi) | 1995-03-10 |
ZA936039B (en) | 1994-03-10 |
MA25277A1 (fr) | 2001-12-31 |
HUT73312A (en) | 1996-07-29 |
HU9500783D0 (en) | 1995-05-29 |
NO950960L (no) | 1995-05-10 |
US5455455A (en) | 1995-10-03 |
PL169823B1 (pl) | 1996-09-30 |
MY129454A (en) | 2007-04-30 |
CA2144323C (en) | 2005-06-28 |
US5547906A (en) | 1996-08-20 |
AU2554192A (en) | 1994-04-12 |
CA2144323A1 (en) | 1994-03-31 |
JPH08503813A (ja) | 1996-04-23 |
PL308140A1 (en) | 1995-07-24 |
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