|
AU2554192A
(en)
*
|
1992-09-14 |
1994-04-12 |
Pierre Badehi |
Methods and apparatus for producing integrated circuit devices
|
|
IL106892A0
(en)
*
|
1993-09-02 |
1993-12-28 |
Pierre Badehi |
Methods and apparatus for producing integrated circuit devices
|
|
IL108359A
(en)
*
|
1994-01-17 |
2001-04-30 |
Shellcase Ltd |
Method and apparatus for producing integrated circuit devices
|
|
US6117707A
(en)
*
|
1994-07-13 |
2000-09-12 |
Shellcase Ltd. |
Methods of producing integrated circuit devices
|
|
US5851845A
(en)
*
|
1995-12-18 |
1998-12-22 |
Micron Technology, Inc. |
Process for packaging a semiconductor die using dicing and testing
|
|
US5637916A
(en)
*
|
1996-02-02 |
1997-06-10 |
National Semiconductor Corporation |
Carrier based IC packaging arrangement
|
|
US5904546A
(en)
*
|
1996-02-12 |
1999-05-18 |
Micron Technology, Inc. |
Method and apparatus for dicing semiconductor wafers
|
|
US5952725A
(en)
*
|
1996-02-20 |
1999-09-14 |
Micron Technology, Inc. |
Stacked semiconductor devices
|
|
US5682065A
(en)
*
|
1996-03-12 |
1997-10-28 |
Micron Technology, Inc. |
Hermetic chip and method of manufacture
|
|
FR2748350B1
(fr)
*
|
1996-05-06 |
2000-07-13 |
Solaic Sa |
Composant electronique sous forme de circuit integre pour insertion a chaud dans un substrat et procedes pour sa fabrication
|
|
US6784023B2
(en)
*
|
1996-05-20 |
2004-08-31 |
Micron Technology, Inc. |
Method of fabrication of stacked semiconductor devices
|
|
US5930652A
(en)
*
|
1996-05-28 |
1999-07-27 |
Motorola, Inc. |
Semiconductor encapsulation method
|
|
AU6003696A
(en)
*
|
1996-05-30 |
1998-01-05 |
Pierre Badehi |
I.c. device with concealed conductor lines
|
|
EP1189271A3
(en)
*
|
1996-07-12 |
2003-07-16 |
Fujitsu Limited |
Wiring boards and mounting of semiconductor devices thereon
|
|
US6881611B1
(en)
*
|
1996-07-12 |
2005-04-19 |
Fujitsu Limited |
Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device
|
|
US5956605A
(en)
|
1996-09-20 |
1999-09-21 |
Micron Technology, Inc. |
Use of nitrides for flip-chip encapsulation
|
|
US6184063B1
(en)
*
|
1996-11-26 |
2001-02-06 |
Texas Instruments Incorporated |
Method and apparatus for breaking and separating a wafer into die using a multi-radii dome
|
|
US5953588A
(en)
*
|
1996-12-21 |
1999-09-14 |
Irvine Sensors Corporation |
Stackable layers containing encapsulated IC chips
|
|
US5903437A
(en)
*
|
1997-01-17 |
1999-05-11 |
International Business Machines Corporation |
High density edge mounting of chips
|
|
US5818107A
(en)
*
|
1997-01-17 |
1998-10-06 |
International Business Machines Corporation |
Chip stacking by edge metallization
|
|
CN1106036C
(zh)
*
|
1997-05-15 |
2003-04-16 |
日本电气株式会社 |
芯片型半导体装置的制造方法
|
|
US5863813A
(en)
*
|
1997-08-20 |
1999-01-26 |
Micron Communications, Inc. |
Method of processing semiconductive material wafers and method of forming flip chips and semiconductor chips
|
|
US6096576A
(en)
|
1997-09-02 |
2000-08-01 |
Silicon Light Machines |
Method of producing an electrical interface to an integrated circuit device having high density I/O count
|
|
DE19739684B4
(de)
*
|
1997-09-10 |
2006-04-13 |
Robert Bosch Gmbh |
Verfahren zur Herstellung von Chipstapeln
|
|
JP3526731B2
(ja)
*
|
1997-10-08 |
2004-05-17 |
沖電気工業株式会社 |
半導体装置およびその製造方法
|
|
KR100273704B1
(ko)
*
|
1997-12-20 |
2000-12-15 |
윤종용 |
반도체기판제조방법
|
|
JP3514101B2
(ja)
*
|
1998-01-28 |
2004-03-31 |
セイコーエプソン株式会社 |
半導体装置及びその製造方法並びに電子機器
|
|
IL123207A0
(en)
|
1998-02-06 |
1998-09-24 |
Shellcase Ltd |
Integrated circuit device
|
|
US6008070A
(en)
*
|
1998-05-21 |
1999-12-28 |
Micron Technology, Inc. |
Wafer level fabrication and assembly of chip scale packages
|
|
JP2000012745A
(ja)
*
|
1998-06-24 |
2000-01-14 |
Nec Corp |
半導体パッケージおよびその製造方法
|
|
US6303986B1
(en)
|
1998-07-29 |
2001-10-16 |
Silicon Light Machines |
Method of and apparatus for sealing an hermetic lid to a semiconductor die
|
|
US6872984B1
(en)
|
1998-07-29 |
2005-03-29 |
Silicon Light Machines Corporation |
Method of sealing a hermetic lid to a semiconductor die at an angle
|
|
US6903451B1
(en)
|
1998-08-28 |
2005-06-07 |
Samsung Electronics Co., Ltd. |
Chip scale packages manufactured at wafer level
|
|
KR100269540B1
(ko)
*
|
1998-08-28 |
2000-10-16 |
윤종용 |
웨이퍼 상태에서의 칩 스케일 패키지 제조 방법
|
|
US6339251B2
(en)
|
1998-11-10 |
2002-01-15 |
Samsung Electronics Co., Ltd |
Wafer grooves for reducing semiconductor wafer warping
|
|
US7157314B2
(en)
|
1998-11-16 |
2007-01-02 |
Sandisk Corporation |
Vertically stacked field programmable nonvolatile memory and method of fabrication
|
|
US6227941B1
(en)
*
|
1998-11-17 |
2001-05-08 |
Advanced Micro Devices, Inc. |
Support structure with multi-layer support material for use during package removal from a multi-layer integrated circuit device
|
|
FR2788375B1
(fr)
*
|
1999-01-11 |
2003-07-18 |
Gemplus Card Int |
Procede de protection de puce de circuit integre
|
|
JP3556503B2
(ja)
*
|
1999-01-20 |
2004-08-18 |
沖電気工業株式会社 |
樹脂封止型半導体装置の製造方法
|
|
US6182342B1
(en)
|
1999-04-02 |
2001-02-06 |
Andersen Laboratories, Inc. |
Method of encapsulating a saw device
|
|
US6544880B1
(en)
*
|
1999-06-14 |
2003-04-08 |
Micron Technology, Inc. |
Method of improving copper interconnects of semiconductor devices for bonding
|
|
US6168965B1
(en)
|
1999-08-12 |
2001-01-02 |
Tower Semiconductor Ltd. |
Method for making backside illuminated image sensor
|
|
JP2001094005A
(ja)
*
|
1999-09-22 |
2001-04-06 |
Oki Electric Ind Co Ltd |
半導体装置及び半導体装置の製造方法
|
|
IL133453A0
(en)
*
|
1999-12-10 |
2001-04-30 |
Shellcase Ltd |
Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby
|
|
US6452265B1
(en)
|
2000-01-28 |
2002-09-17 |
International Business Machines Corporation |
Multi-chip module utilizing a nonconductive material surrounding the chips that has a similar coefficient of thermal expansion
|
|
US6956878B1
(en)
|
2000-02-07 |
2005-10-18 |
Silicon Light Machines Corporation |
Method and apparatus for reducing laser speckle using polarization averaging
|
|
JP5231701B2
(ja)
*
|
2000-02-15 |
2013-07-10 |
オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング |
放射線を発する半導体デバイス及びその製造方法
|
|
DE10006738C2
(de)
*
|
2000-02-15 |
2002-01-17 |
Osram Opto Semiconductors Gmbh |
Lichtemittierendes Bauelement mit verbesserter Lichtauskopplung und Verfahren zu seiner Herstellung
|
|
SG106050A1
(en)
*
|
2000-03-13 |
2004-09-30 |
Megic Corp |
Method of manufacture and identification of semiconductor chip marked for identification with internal marking indicia and protection thereof by non-black layer and device produced thereby
|
|
JP4403631B2
(ja)
*
|
2000-04-24 |
2010-01-27 |
ソニー株式会社 |
チップ状電子部品の製造方法、並びにその製造に用いる擬似ウエーハの製造方法
|
|
JP2001313350A
(ja)
*
|
2000-04-28 |
2001-11-09 |
Sony Corp |
チップ状電子部品及びその製造方法、並びにその製造に用いる疑似ウエーハ及びその製造方法
|
|
JP3631956B2
(ja)
|
2000-05-12 |
2005-03-23 |
富士通株式会社 |
半導体チップの実装方法
|
|
DE20111659U1
(de)
*
|
2000-05-23 |
2001-12-13 |
OSRAM Opto Semiconductors GmbH & Co. oHG, 93049 Regensburg |
Bauelement für die Optoelektronik
|
|
US6875640B1
(en)
*
|
2000-06-08 |
2005-04-05 |
Micron Technology, Inc. |
Stereolithographic methods for forming a protective layer on a semiconductor device substrate and substrates including protective layers so formed
|
|
JP2002043251A
(ja)
*
|
2000-07-25 |
2002-02-08 |
Fujitsu Ltd |
半導体装置の製造方法及び半導体装置
|
|
CN100358147C
(zh)
|
2000-08-14 |
2007-12-26 |
矩阵半导体公司 |
密集阵列和电荷存储器件及其制造方法
|
|
US6524881B1
(en)
|
2000-08-25 |
2003-02-25 |
Micron Technology, Inc. |
Method and apparatus for marking a bare semiconductor die
|
|
KR100855015B1
(ko)
*
|
2000-12-21 |
2008-08-28 |
테쎄라 테크놀로지스 헝가리 케이에프티. |
패키징된 집적회로 및 그 제조 방법
|
|
US20020117753A1
(en)
*
|
2001-02-23 |
2002-08-29 |
Lee Michael G. |
Three dimensional packaging
|
|
US7177081B2
(en)
|
2001-03-08 |
2007-02-13 |
Silicon Light Machines Corporation |
High contrast grating light valve type device
|
|
US6897514B2
(en)
|
2001-03-28 |
2005-05-24 |
Matrix Semiconductor, Inc. |
Two mask floating gate EEPROM and method of making
|
|
US7498196B2
(en)
|
2001-03-30 |
2009-03-03 |
Megica Corporation |
Structure and manufacturing method of chip scale package
|
|
US6707591B2
(en)
|
2001-04-10 |
2004-03-16 |
Silicon Light Machines |
Angled illumination for a single order light modulator based projection system
|
|
US6865346B1
(en)
|
2001-06-05 |
2005-03-08 |
Silicon Light Machines Corporation |
Fiber optic transceiver
|
|
US6747781B2
(en)
|
2001-06-25 |
2004-06-08 |
Silicon Light Machines, Inc. |
Method, apparatus, and diffuser for reducing laser speckle
|
|
US6782205B2
(en)
|
2001-06-25 |
2004-08-24 |
Silicon Light Machines |
Method and apparatus for dynamic equalization in wavelength division multiplexing
|
|
US6841813B2
(en)
|
2001-08-13 |
2005-01-11 |
Matrix Semiconductor, Inc. |
TFT mask ROM and method for making same
|
|
US6525953B1
(en)
|
2001-08-13 |
2003-02-25 |
Matrix Semiconductor, Inc. |
Vertically-stacked, field-programmable, nonvolatile memory and method of fabrication
|
|
US6829092B2
(en)
|
2001-08-15 |
2004-12-07 |
Silicon Light Machines, Inc. |
Blazed grating light valve
|
|
US6930364B2
(en)
|
2001-09-13 |
2005-08-16 |
Silicon Light Machines Corporation |
Microelectronic mechanical system and methods
|
|
US6797537B2
(en)
*
|
2001-10-30 |
2004-09-28 |
Irvine Sensors Corporation |
Method of making stackable layers containing encapsulated integrated circuit chips with one or more overlaying interconnect layers
|
|
DE10164800B4
(de)
|
2001-11-02 |
2005-03-31 |
Infineon Technologies Ag |
Verfahren zur Herstellung eines elektronischen Bauelements mit mehreren übereinander gestapelten und miteinander kontaktierten Chips
|
|
DE10153609C2
(de)
*
|
2001-11-02 |
2003-10-16 |
Infineon Technologies Ag |
Verfahren zur Herstellung eines elektronischen Bauelements mit mehreren übereinander gestapelten und miteinander kontaktierten Chips
|
|
US6956995B1
(en)
|
2001-11-09 |
2005-10-18 |
Silicon Light Machines Corporation |
Optical communication arrangement
|
|
US6800238B1
(en)
|
2002-01-15 |
2004-10-05 |
Silicon Light Machines, Inc. |
Method for domain patterning in low coercive field ferroelectrics
|
|
US7169685B2
(en)
|
2002-02-25 |
2007-01-30 |
Micron Technology, Inc. |
Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive
|
|
US20060146172A1
(en)
*
|
2002-03-18 |
2006-07-06 |
Jacobsen Stephen C |
Miniaturized utility device having integrated optical capabilities
|
|
US7787939B2
(en)
|
2002-03-18 |
2010-08-31 |
Sterling Lc |
Miniaturized imaging device including utility aperture and SSID
|
|
US7591780B2
(en)
|
2002-03-18 |
2009-09-22 |
Sterling Lc |
Miniaturized imaging device with integrated circuit connector system
|
|
US8614768B2
(en)
|
2002-03-18 |
2013-12-24 |
Raytheon Company |
Miniaturized imaging device including GRIN lens optically coupled to SSID
|
|
US7152291B2
(en)
|
2002-04-15 |
2006-12-26 |
Avx Corporation |
Method for forming plated terminations
|
|
KR20050007459A
(ko)
*
|
2002-04-16 |
2005-01-18 |
엑스룸 포토닉스 리미티드 |
통합 커넥터를 구비한 전자 광학 회로 및 그 제조 방법
|
|
US20040021214A1
(en)
*
|
2002-04-16 |
2004-02-05 |
Avner Badehi |
Electro-optic integrated circuits with connectors and methods for the production thereof
|
|
EP1540728B1
(en)
*
|
2002-05-20 |
2010-12-29 |
ImagerLabs, Inc. |
Forming a multi segment integrated circuit with isolated substrates
|
|
US6767751B2
(en)
|
2002-05-28 |
2004-07-27 |
Silicon Light Machines, Inc. |
Integrated driver process flow
|
|
US6728023B1
(en)
|
2002-05-28 |
2004-04-27 |
Silicon Light Machines |
Optical device arrays with optimized image resolution
|
|
US7054515B1
(en)
|
2002-05-30 |
2006-05-30 |
Silicon Light Machines Corporation |
Diffractive light modulator-based dynamic equalizer with integrated spectral monitor
|
|
US6822797B1
(en)
|
2002-05-31 |
2004-11-23 |
Silicon Light Machines, Inc. |
Light modulator structure for producing high-contrast operation using zero-order light
|
|
US6829258B1
(en)
|
2002-06-26 |
2004-12-07 |
Silicon Light Machines, Inc. |
Rapidly tunable external cavity laser
|
|
US6813059B2
(en)
|
2002-06-28 |
2004-11-02 |
Silicon Light Machines, Inc. |
Reduced formation of asperities in contact micro-structures
|
|
US6908201B2
(en)
|
2002-06-28 |
2005-06-21 |
Silicon Light Machines Corporation |
Micro-support structures
|
|
US7057795B2
(en)
|
2002-08-20 |
2006-06-06 |
Silicon Light Machines Corporation |
Micro-structures with individually addressable ribbon pairs
|
|
US6801354B1
(en)
|
2002-08-20 |
2004-10-05 |
Silicon Light Machines, Inc. |
2-D diffraction grating for substantially eliminating polarization dependent losses
|
|
US6712480B1
(en)
|
2002-09-27 |
2004-03-30 |
Silicon Light Machines |
Controlled curvature of stressed micro-structures
|
|
US7033664B2
(en)
|
2002-10-22 |
2006-04-25 |
Tessera Technologies Hungary Kft |
Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby
|
|
US7265045B2
(en)
|
2002-10-24 |
2007-09-04 |
Megica Corporation |
Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging
|
|
US6928207B1
(en)
|
2002-12-12 |
2005-08-09 |
Silicon Light Machines Corporation |
Apparatus for selectively blocking WDM channels
|
|
US6987600B1
(en)
|
2002-12-17 |
2006-01-17 |
Silicon Light Machines Corporation |
Arbitrary phase profile for better equalization in dynamic gain equalizer
|
|
US7057819B1
(en)
|
2002-12-17 |
2006-06-06 |
Silicon Light Machines Corporation |
High contrast tilting ribbon blazed grating
|
|
US6934070B1
(en)
|
2002-12-18 |
2005-08-23 |
Silicon Light Machines Corporation |
Chirped optical MEM device
|
|
US6927891B1
(en)
|
2002-12-23 |
2005-08-09 |
Silicon Light Machines Corporation |
Tilt-able grating plane for improved crosstalk in 1×N blaze switches
|
|
US7068372B1
(en)
|
2003-01-28 |
2006-06-27 |
Silicon Light Machines Corporation |
MEMS interferometer-based reconfigurable optical add-and-drop multiplexor
|
|
US7286764B1
(en)
|
2003-02-03 |
2007-10-23 |
Silicon Light Machines Corporation |
Reconfigurable modulator-based optical add-and-drop multiplexer
|
|
US6947613B1
(en)
|
2003-02-11 |
2005-09-20 |
Silicon Light Machines Corporation |
Wavelength selective switch and equalizer
|
|
US6922272B1
(en)
|
2003-02-14 |
2005-07-26 |
Silicon Light Machines Corporation |
Method and apparatus for leveling thermal stress variations in multi-layer MEMS devices
|
|
US6922273B1
(en)
|
2003-02-28 |
2005-07-26 |
Silicon Light Machines Corporation |
PDL mitigation structure for diffractive MEMS and gratings
|
|
US7391973B1
(en)
|
2003-02-28 |
2008-06-24 |
Silicon Light Machines Corporation |
Two-stage gain equalizer
|
|
US6829077B1
(en)
|
2003-02-28 |
2004-12-07 |
Silicon Light Machines, Inc. |
Diffractive light modulator with dynamically rotatable diffraction plane
|
|
US6806997B1
(en)
|
2003-02-28 |
2004-10-19 |
Silicon Light Machines, Inc. |
Patterned diffractive light modulator ribbon for PDL reduction
|
|
US7027202B1
(en)
|
2003-02-28 |
2006-04-11 |
Silicon Light Machines Corp |
Silicon substrate as a light modulator sacrificial layer
|
|
US7042611B1
(en)
|
2003-03-03 |
2006-05-09 |
Silicon Light Machines Corporation |
Pre-deflected bias ribbons
|
|
DE10342980B3
(de)
*
|
2003-09-17 |
2005-01-05 |
Disco Hi-Tec Europe Gmbh |
Verfahren zur Bildung von Chip-Stapeln
|
|
US7713841B2
(en)
*
|
2003-09-19 |
2010-05-11 |
Micron Technology, Inc. |
Methods for thinning semiconductor substrates that employ support structures formed on the substrates
|
|
US20050064683A1
(en)
*
|
2003-09-19 |
2005-03-24 |
Farnworth Warren M. |
Method and apparatus for supporting wafers for die singulation and subsequent handling
|
|
US20050064679A1
(en)
*
|
2003-09-19 |
2005-03-24 |
Farnworth Warren M. |
Consolidatable composite materials, articles of manufacture formed therefrom, and fabrication methods
|
|
EP1676160A4
(en)
*
|
2003-10-15 |
2008-04-09 |
Xloom Photonics Ltd |
ELECTROOPTICAL CIRCUITS WITH INTEGRATED CONNECTORS AND METHOD FOR THE PRODUCTION THEREOF
|
|
TWI233170B
(en)
*
|
2004-02-05 |
2005-05-21 |
United Microelectronics Corp |
Ultra-thin wafer level stack packaging method and structure using thereof
|
|
DE102004009742B4
(de)
*
|
2004-02-25 |
2010-03-04 |
Infineon Technologies Ag |
Verfahren zum Herstellen rückseitenbeschichteter Halbleiterchips
|
|
US7244665B2
(en)
*
|
2004-04-29 |
2007-07-17 |
Micron Technology, Inc. |
Wafer edge ring structures and methods of formation
|
|
US7547978B2
(en)
*
|
2004-06-14 |
2009-06-16 |
Micron Technology, Inc. |
Underfill and encapsulation of semiconductor assemblies with materials having differing properties
|
|
US7235431B2
(en)
|
2004-09-02 |
2007-06-26 |
Micron Technology, Inc. |
Methods for packaging a plurality of semiconductor dice using a flowable dielectric material
|
|
US20060138626A1
(en)
*
|
2004-12-29 |
2006-06-29 |
Tessera, Inc. |
Microelectronic packages using a ceramic substrate having a window and a conductive surface region
|
|
US7566853B2
(en)
*
|
2005-08-12 |
2009-07-28 |
Tessera, Inc. |
Image sensor employing a plurality of photodetector arrays and/or rear-illuminated architecture
|
|
TWI303870B
(en)
*
|
2005-12-30 |
2008-12-01 |
Advanced Semiconductor Eng |
Structure and mtehod for packaging a chip
|
|
FR2905198B1
(fr)
*
|
2006-08-22 |
2008-10-17 |
3D Plus Sa Sa |
Procede de fabrication collective de modules electroniques 3d
|
|
US7935568B2
(en)
*
|
2006-10-31 |
2011-05-03 |
Tessera Technologies Ireland Limited |
Wafer-level fabrication of lidded chips with electrodeposited dielectric coating
|
|
US7807508B2
(en)
*
|
2006-10-31 |
2010-10-05 |
Tessera Technologies Hungary Kft. |
Wafer-level fabrication of lidded chips with electrodeposited dielectric coating
|
|
TW200842998A
(en)
*
|
2007-04-18 |
2008-11-01 |
Siliconware Precision Industries Co Ltd |
Semiconductor device and manufacturing method thereof
|
|
TWI331371B
(en)
*
|
2007-04-19 |
2010-10-01 |
Siliconware Precision Industries Co Ltd |
Semiconductor device and manufacturing method thereof
|
|
US7835074B2
(en)
|
2007-06-05 |
2010-11-16 |
Sterling Lc |
Mini-scope for multi-directional imaging
|
|
US7923298B2
(en)
*
|
2007-09-07 |
2011-04-12 |
Micron Technology, Inc. |
Imager die package and methods of packaging an imager die on a temporary carrier
|
|
US20090093137A1
(en)
*
|
2007-10-08 |
2009-04-09 |
Xloom Communications, (Israel) Ltd. |
Optical communications module
|
|
US7969659B2
(en)
|
2008-01-11 |
2011-06-28 |
Sterling Lc |
Grin lens microscope system
|
|
US7952834B2
(en)
*
|
2008-02-22 |
2011-05-31 |
Seagate Technology Llc |
Flex circuit assembly with thermal energy dissipation
|
|
EP2299894B1
(en)
|
2008-06-18 |
2020-09-02 |
Sarcos LC |
Transparent endoscope head defining a focal length
|
|
WO2010014792A2
(en)
|
2008-07-30 |
2010-02-04 |
Sterling Lc |
Method and device for incremental wavelength variation to analyze tissue
|
|
WO2010053916A2
(en)
|
2008-11-04 |
2010-05-14 |
Sterling Lc |
Method and device for wavelength shifted imaging
|
|
US9082438B2
(en)
|
2008-12-02 |
2015-07-14 |
Panasonic Corporation |
Three-dimensional structure for wiring formation
|
|
EP2207200A1
(en)
*
|
2008-12-24 |
2010-07-14 |
Nxp B.V. |
Stack of molded integrated circuit dies with side surface contact tracks
|
|
EP2202789A1
(en)
*
|
2008-12-24 |
2010-06-30 |
Nxp B.V. |
Stack of molded integrated circuit dies with side surface contact tracks
|
|
KR20130091794A
(ko)
|
2009-01-27 |
2013-08-19 |
파나소닉 주식회사 |
반도체 칩의 실장 방법, 그 방법을 이용하여 얻어진 반도체 장치 및 반도체 칩의 접속 방법, 및, 표면에 배선이 설치된 입체 구조물 및 그 제법
|
|
US9070393B2
(en)
|
2009-01-27 |
2015-06-30 |
Panasonic Corporation |
Three-dimensional structure in which wiring is provided on its surface
|
|
US8569877B2
(en)
*
|
2009-03-12 |
2013-10-29 |
Utac Thai Limited |
Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide
|
|
US8232140B2
(en)
*
|
2009-03-27 |
2012-07-31 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Method for ultra thin wafer handling and processing
|
|
US8717428B2
(en)
|
2009-10-01 |
2014-05-06 |
Raytheon Company |
Light diffusion apparatus
|
|
US9144664B2
(en)
|
2009-10-01 |
2015-09-29 |
Sarcos Lc |
Method and apparatus for manipulating movement of a micro-catheter
|
|
WO2011041728A2
(en)
|
2009-10-01 |
2011-04-07 |
Jacobsen Stephen C |
Needle delivered imaging device
|
|
WO2011045836A1
(ja)
|
2009-10-14 |
2011-04-21 |
国立大学法人東北大学 |
センサ装置およびセンサ装置の製造方法
|
|
US8828028B2
(en)
|
2009-11-03 |
2014-09-09 |
Raytheon Company |
Suture device and method for closing a planar opening
|
|
DE102010009015A1
(de)
*
|
2010-02-24 |
2011-08-25 |
OSRAM Opto Semiconductors GmbH, 93055 |
Verfahren zum Herstellen einer Mehrzahl von optoelektronischen Halbleiterchips
|
|
WO2011110900A1
(en)
*
|
2010-03-12 |
2011-09-15 |
Nxp B.V. |
Stack of molded integrated circuit dies with side surface contact tracks
|
|
US8669777B2
(en)
|
2010-10-27 |
2014-03-11 |
Seagate Technology Llc |
Assessing connection joint coverage between a device and a printed circuit board
|
|
JP6022792B2
(ja)
|
2012-03-30 |
2016-11-09 |
国立大学法人東北大学 |
集積化デバイス及び集積化デバイスの製造方法
|
|
US9087821B2
(en)
|
2013-07-16 |
2015-07-21 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Hybrid bonding with through substrate via (TSV)
|
|
US9299640B2
(en)
|
2013-07-16 |
2016-03-29 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Front-to-back bonding with through-substrate via (TSV)
|
|
US8860229B1
(en)
|
2013-07-16 |
2014-10-14 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Hybrid bonding with through substrate via (TSV)
|
|
US9929050B2
(en)
|
2013-07-16 |
2018-03-27 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Mechanisms for forming three-dimensional integrated circuit (3DIC) stacking structure
|
|
US10242953B1
(en)
|
2015-05-27 |
2019-03-26 |
Utac Headquarters PTE. Ltd |
Semiconductor package with plated metal shielding and a method thereof
|
|
US10242934B1
(en)
|
2014-05-07 |
2019-03-26 |
Utac Headquarters Pte Ltd. |
Semiconductor package with full plating on contact side surfaces and methods thereof
|
|
TWI657510B
(zh)
*
|
2014-10-02 |
2019-04-21 |
日商住友電木股份有限公司 |
半導體裝置之製造方法及半導體裝置
|
|
KR101712396B1
(ko)
|
2014-12-30 |
2017-03-13 |
주식회사 유림기계 |
목재 파쇄기용 파쇄유닛의 칼날 고정장치
|
|
CN106469689B
(zh)
*
|
2015-08-21 |
2019-10-11 |
安世有限公司 |
电子元件及其形成方法
|
|
KR20180090494A
(ko)
|
2017-02-03 |
2018-08-13 |
삼성전자주식회사 |
기판 구조체 제조 방법
|
|
KR20230012468A
(ko)
|
2020-05-19 |
2023-01-26 |
인텔 코포레이션 |
집적 회로용 유기 스페이서
|
|
CN115148589B
(zh)
*
|
2021-03-29 |
2025-08-29 |
力特半导体(无锡)有限公司 |
半导体台面器件形成方法
|