IT1186165B - Dispositivo a semiconduttore di tipo eprom cancellabile con raggi ultravioletti e suo processo di fabbricazione - Google Patents

Dispositivo a semiconduttore di tipo eprom cancellabile con raggi ultravioletti e suo processo di fabbricazione

Info

Publication number
IT1186165B
IT1186165B IT23335/85A IT2333585A IT1186165B IT 1186165 B IT1186165 B IT 1186165B IT 23335/85 A IT23335/85 A IT 23335/85A IT 2333585 A IT2333585 A IT 2333585A IT 1186165 B IT1186165 B IT 1186165B
Authority
IT
Italy
Prior art keywords
canceled
semiconductor device
manufacturing process
type semiconductor
ultraviolet rays
Prior art date
Application number
IT23335/85A
Other languages
English (en)
Other versions
IT8523335A0 (it
Inventor
Marzio Fusaroli
Laura Ceriati
Original Assignee
Sgs Microelettronica Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sgs Microelettronica Spa filed Critical Sgs Microelettronica Spa
Priority to IT23335/85A priority Critical patent/IT1186165B/it
Publication of IT8523335A0 publication Critical patent/IT8523335A0/it
Priority to JP61300212A priority patent/JPH07120732B2/ja
Application granted granted Critical
Publication of IT1186165B publication Critical patent/IT1186165B/it
Priority to US07/224,202 priority patent/US4971930A/en

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/06—Auxiliary circuits, e.g. for writing into memory
    • G11C16/10—Programming or data input circuits
    • G11C16/18—Circuits for erasing optically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
IT23335/85A 1985-12-20 1985-12-20 Dispositivo a semiconduttore di tipo eprom cancellabile con raggi ultravioletti e suo processo di fabbricazione IT1186165B (it)

Priority Applications (3)

Application Number Priority Date Filing Date Title
IT23335/85A IT1186165B (it) 1985-12-20 1985-12-20 Dispositivo a semiconduttore di tipo eprom cancellabile con raggi ultravioletti e suo processo di fabbricazione
JP61300212A JPH07120732B2 (ja) 1985-12-20 1986-12-18 紫外線による消去の可能なｅｐｒｏｍ型半導体装置とその製造方法
US07/224,202 US4971930A (en) 1985-12-20 1988-07-21 EPROM semiconductor device erasable with ultraviolet rays and manufacturing process thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT23335/85A IT1186165B (it) 1985-12-20 1985-12-20 Dispositivo a semiconduttore di tipo eprom cancellabile con raggi ultravioletti e suo processo di fabbricazione

Publications (2)

Publication Number Publication Date
IT8523335A0 IT8523335A0 (it) 1985-12-20
IT1186165B true IT1186165B (it) 1987-11-18

Family

ID=11206191

Family Applications (1)

Application Number Title Priority Date Filing Date
IT23335/85A IT1186165B (it) 1985-12-20 1985-12-20 Dispositivo a semiconduttore di tipo eprom cancellabile con raggi ultravioletti e suo processo di fabbricazione

Country Status (3)

Country Link
US (1) US4971930A (it)
JP (1) JPH07120732B2 (it)
IT (1) IT1186165B (it)

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KR940002444B1 (ko) * 1990-11-13 1994-03-24 금성일렉트론 주식회사 반도체 소자의 패키지 어셈블리 방법
US5256598A (en) * 1992-04-15 1993-10-26 Micron Technology, Inc. Shrink accommodating lead frame
DE69231785T2 (de) * 1992-09-14 2001-11-15 Shellcase Ltd Verfahren zum herstellen integrierte schaltungsanordnungen
IL106892A0 (en) * 1993-09-02 1993-12-28 Pierre Badehi Methods and apparatus for producing integrated circuit devices
US6117707A (en) * 1994-07-13 2000-09-12 Shellcase Ltd. Methods of producing integrated circuit devices
IL123207A0 (en) * 1998-02-06 1998-09-24 Shellcase Ltd Integrated circuit device
US6483101B1 (en) * 1999-12-08 2002-11-19 Amkor Technology, Inc. Molded image sensor package having lens holder
US6483030B1 (en) * 1999-12-08 2002-11-19 Amkor Technology, Inc. Snap lid image sensor package
US6455774B1 (en) 1999-12-08 2002-09-24 Amkor Technology, Inc. Molded image sensor package
US6389687B1 (en) 1999-12-08 2002-05-21 Amkor Technology, Inc. Method of fabricating image sensor packages in an array
US6526653B1 (en) 1999-12-08 2003-03-04 Amkor Technology, Inc. Method of assembling a snap lid image sensor package
DE10023539B4 (de) * 2000-05-13 2009-04-09 Micronas Gmbh Verfahren zum Herstellen eines Bauteils
US6686588B1 (en) 2001-01-16 2004-02-03 Amkor Technology, Inc. Optical module with lens integral holder
US7059040B1 (en) 2001-01-16 2006-06-13 Amkor Technology, Inc. Optical module with lens integral holder fabrication method
US6987034B1 (en) 2002-01-09 2006-01-17 Bridge Semiconductor Corporation Method of making a semiconductor package device that includes singulating and trimming a lead
US6936495B1 (en) 2002-01-09 2005-08-30 Bridge Semiconductor Corporation Method of making an optoelectronic semiconductor package device
US6891276B1 (en) 2002-01-09 2005-05-10 Bridge Semiconductor Corporation Semiconductor package device
US7190060B1 (en) 2002-01-09 2007-03-13 Bridge Semiconductor Corporation Three-dimensional stacked semiconductor package device with bent and flat leads and method of making same
US7095621B2 (en) * 2003-02-24 2006-08-22 Avago Technologies Sensor Ip (Singapore) Pte. Ltd. Leadless leadframe electronic package and sensor module incorporating same
US20050009239A1 (en) * 2003-07-07 2005-01-13 Wolff Larry Lee Optoelectronic packaging with embedded window
DE10361650A1 (de) * 2003-12-30 2005-08-04 Osram Opto Semiconductors Gmbh Optoelektronisches Modul und Verfahren zu dessen Herstellung
US7273767B2 (en) * 2004-12-31 2007-09-25 Carsem (M) Sdn. Bhd. Method of manufacturing a cavity package
JP2009000276A (ja) * 2007-06-21 2009-01-08 Olympus Medical Systems Corp 医療用チューブ、医療用器具、ステントセット及び内視鏡装置
US7582954B1 (en) * 2008-02-25 2009-09-01 National Semiconductor Corporation Optical leadless leadframe package
US7728399B2 (en) * 2008-07-22 2010-06-01 National Semiconductor Corporation Molded optical package with fiber coupling feature
US7915717B2 (en) * 2008-08-18 2011-03-29 Eastman Kodak Company Plastic image sensor packaging for image sensors
US20140377915A1 (en) * 2013-06-20 2014-12-25 Infineon Technologies Ag Pre-mold for a magnet semiconductor assembly group and method of producing the same
MY184608A (en) * 2013-12-10 2021-04-07 Carsem M Sdn Bhd Pre-molded integrated circuit packages
JP2019050338A (ja) * 2017-09-12 2019-03-28 ソニーセミコンダクタソリューションズ株式会社 撮像素子および撮像素子の製造方法、撮像装置、並びに電子機器

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Publication number Priority date Publication date Assignee Title
US3622419A (en) * 1969-10-08 1971-11-23 Motorola Inc Method of packaging an optoelectrical device
JPS5541748A (en) * 1978-09-18 1980-03-24 Mitsubishi Electric Corp Semiconductor memory device
JPS5776867A (en) * 1980-10-30 1982-05-14 Nec Corp Semiconductor device
JPS5834934A (ja) * 1981-08-26 1983-03-01 Toshiba Corp 半導体装置
US4460915A (en) * 1981-12-28 1984-07-17 Intel Corporation Plastic package for radiation sensitive semiconductor devices
US4491857A (en) * 1982-03-23 1985-01-01 Texas Instruments Incorporated Avalanche fuse element with isolated emitter
JPS6083337A (ja) * 1983-10-14 1985-05-11 Oki Electric Ind Co Ltd 半導体装置の製造方法
US4644384A (en) * 1984-02-02 1987-02-17 National Semiconductor Corporation Apparatus and method for packaging eprom integrated circuits
JPS60239043A (ja) * 1984-05-14 1985-11-27 Oki Electric Ind Co Ltd 半導体装置用パツケ−ジの製造方法
JPS60257546A (ja) * 1984-06-04 1985-12-19 Mitsubishi Electric Corp 半導体装置及びその製造方法
US4665426A (en) * 1985-02-01 1987-05-12 Advanced Micro Devices, Inc. EPROM with ultraviolet radiation transparent silicon nitride passivation layer
JPH0642518B2 (ja) * 1985-09-30 1994-06-01 三菱電機株式会社 半導体装置

Also Published As

Publication number Publication date
JPS62156842A (ja) 1987-07-11
IT8523335A0 (it) 1985-12-20
US4971930A (en) 1990-11-20
JPH07120732B2 (ja) 1995-12-20

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