DE3485684D1 - Vorrichtung fuer die kontrolle von masken fuer die herstellung von integrierten schaltungen. - Google Patents

Vorrichtung fuer die kontrolle von masken fuer die herstellung von integrierten schaltungen.

Info

Publication number
DE3485684D1
DE3485684D1 DE8484308134T DE3485684T DE3485684D1 DE 3485684 D1 DE3485684 D1 DE 3485684D1 DE 8484308134 T DE8484308134 T DE 8484308134T DE 3485684 T DE3485684 T DE 3485684T DE 3485684 D1 DE3485684 D1 DE 3485684D1
Authority
DE
Germany
Prior art keywords
integrated circuits
manufacturing integrated
masks
controlling
controlling masks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8484308134T
Other languages
English (en)
Inventor
Osamu C O Patent Divis Ikenaga
Ryoichi C O Patent D Yoshikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE3485684D1 publication Critical patent/DE3485684D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G03F1/86—Inspecting by charged particle beam [CPB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
DE8484308134T 1983-11-24 1984-11-23 Vorrichtung fuer die kontrolle von masken fuer die herstellung von integrierten schaltungen. Expired - Lifetime DE3485684D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22098083A JPH061370B2 (ja) 1983-11-24 1983-11-24 マスク欠陥検査装置

Publications (1)

Publication Number Publication Date
DE3485684D1 true DE3485684D1 (de) 1992-06-04

Family

ID=16759577

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484308134T Expired - Lifetime DE3485684D1 (de) 1983-11-24 1984-11-23 Vorrichtung fuer die kontrolle von masken fuer die herstellung von integrierten schaltungen.

Country Status (4)

Country Link
US (1) US4623256A (de)
EP (1) EP0143004B1 (de)
JP (1) JPH061370B2 (de)
DE (1) DE3485684D1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2152658A (en) * 1984-01-09 1985-08-07 Philips Electronic Associated Object sorting system
KR900001976B1 (ko) * 1984-11-01 1990-03-30 가부시끼가이샤 히다찌세이사꾸쇼 다수 개의 패턴 발생기를 포함하는 패턴 검사 장치
JP2602201B2 (ja) * 1985-04-12 1997-04-23 株式会社日立製作所 被検査パターンの欠陥検査方法
US4783826A (en) * 1986-08-18 1988-11-08 The Gerber Scientific Company, Inc. Pattern inspection system
US4949390A (en) * 1987-04-16 1990-08-14 Applied Vision Systems, Inc. Interconnect verification using serial neighborhood processors
JP2569057B2 (ja) * 1987-07-10 1997-01-08 株式会社日立製作所 Ｘ線マスクの欠陥修正方法
US5235400A (en) * 1988-10-12 1993-08-10 Hitachi, Ltd. Method of and apparatus for detecting defect on photomask
US5231675A (en) * 1990-08-31 1993-07-27 The Boeing Company Sheet metal inspection system and apparatus
US5576829A (en) * 1990-10-08 1996-11-19 Nikon Corporation Method and apparatus for inspecting a phase-shifted mask
JPH04177111A (ja) * 1990-11-13 1992-06-24 Mitsubishi Electric Corp 位相シフトマスク検査装置
US6002792A (en) * 1993-11-16 1999-12-14 Hamamatsu Photonics Kk Semiconductor device inspection system
US5917588A (en) * 1996-11-04 1999-06-29 Kla-Tencor Corporation Automated specimen inspection system for and method of distinguishing features or anomalies under either bright field or dark field illumination
US6483937B1 (en) * 1999-06-17 2002-11-19 International Business Machines Corporation Process for inspecting an object
JP2003287875A (ja) * 2002-01-24 2003-10-10 Hitachi Ltd マスクの製造方法および半導体集積回路装置の製造方法
JP4274784B2 (ja) * 2002-05-28 2009-06-10 新光電気工業株式会社 配線形成システムおよびその方法
US6850321B1 (en) * 2002-07-09 2005-02-01 Kla-Tencor Technologies Corporation Dual stage defect region identification and defect detection method and apparatus
TWI229894B (en) * 2002-09-05 2005-03-21 Toshiba Corp Mask defect inspecting method, semiconductor device manufacturing method, mask defect inspecting apparatus, generating method of defect influence map, and computer program product
JP5178079B2 (ja) * 2007-07-23 2013-04-10 株式会社日立ハイテクノロジーズ 欠陥検査方法およびその装置
DE102008048660B4 (de) * 2008-09-22 2015-06-18 Carl Zeiss Sms Gmbh Verfahren und Vorrichtung zur Vermessung von Strukturen auf Photolithographiemasken
US8994918B2 (en) 2010-10-21 2015-03-31 Nikon Corporation Apparatus and methods for measuring thermally induced reticle distortion
US9363899B2 (en) * 2012-01-02 2016-06-07 Mutracx International B.V. Inkjet system for printing a printed circuit board
JP6353913B2 (ja) * 2014-04-24 2018-07-04 エーエスエムエル ホールディング エヌ．ブイ． コンパクトな両側レチクル検査システム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3963354A (en) * 1975-05-05 1976-06-15 Bell Telephone Laboratories, Incorporated Inspection of masks and wafers by image dissection
JPS5242790A (en) * 1975-10-01 1977-04-02 Hitachi Ltd Method of inspecting appearance of objects
US4218142A (en) * 1978-03-08 1980-08-19 Aerodyne Research, Inc. Mask analysis
EP0054596B1 (de) * 1980-12-18 1985-05-29 International Business Machines Corporation Verfahren für die Inspektion und die automatische Sortierung von Objekten, die Konfigurationen mit dimensionellen Toleranzen aufweisen und platzabhängige Kriterien für die Verwerfung, Anlage und Schaltung dafür
JPS57157378A (en) * 1981-03-25 1982-09-28 Hitachi Ltd Setting method of binary-coded threshold level
US4441207A (en) * 1982-01-19 1984-04-03 Environmental Research Institute Of Michigan Design rule checking using serial neighborhood processors
JPS5963725A (ja) * 1982-10-05 1984-04-11 Toshiba Corp パタ−ン検査装置
US4555798A (en) * 1983-06-20 1985-11-26 Kla Instruments Corporation Automatic system and method for inspecting hole quality

Also Published As

Publication number Publication date
JPH061370B2 (ja) 1994-01-05
EP0143004A3 (en) 1987-12-16
EP0143004A2 (de) 1985-05-29
US4623256A (en) 1986-11-18
JPS60113426A (ja) 1985-06-19
EP0143004B1 (de) 1992-04-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee