KR970003435A - 기판 처리장치에서 에지증착을 제어하기 위한 제거 링 - Google Patents

기판 처리장치에서 에지증착을 제어하기 위한 제거 링 Download PDF

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KR970003435A
KR970003435A KR1019960020233A KR19960020233A KR970003435A KR 970003435 A KR970003435 A KR 970003435A KR 1019960020233 A KR1019960020233 A KR 1019960020233A KR 19960020233 A KR19960020233 A KR 19960020233A KR 970003435 A KR970003435 A KR 970003435A
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ring
substrate support
substrate
support
temperature range
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피. 유모토이 살바도르
에프. 모리슨 아란
에이. 리튜 칼
에이. 마쉬 리챠드
청-라이 레이 로우렌스
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제임스 조셉 드롱
어플라이드 머티어리얼스, 인코포레이티드
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Publication of KR970003435A publication Critical patent/KR970003435A/ko

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    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4585—Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds
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    • C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
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Abstract

기판 처리장치는 상기 기판지지체가 배설되도록 처리챔버를 구성하고 있으며, 상기 기판지지체는 가열받침대의 형태로 이루어져 있으며, 상기 기판을 수용하도록 구획된 면을 구비하고 있으며, 상기 받침대 사이에 있는 환형상부를 한정하는 제거가능한 세척링(24)에 의해 둘러쌓여 있다. 상기 받침대의 외부에지에서 세척가스 매니폴드는 상기 세척링(24)과 받침대 사이에 있는 공동부의 형태로 되어 있다. 상기 매니폴드의 하단부는 상기 받침대가 가열로부터 팽창되고 상기 세척링(24)의 하부에지에 접촉됨에 따라서 공정온도를 유지하도록 메카니칼 실에 의해서 밀봉되어 있다. 상기 매니폴드의 상단부는 상기 세척링(24)과 받침대에 의해 한정된 환형상부에서 개방된다.
상기 매니폴드는 공정중에, 상기 세척가스가 상기 매니폴드내로 분사되고 상기 받침대 면위에 수용된 기판에지 쪽으로 돌출되도록 정렬되어 있다. 이러한 가스는 상기 세척링(24)과 기판지지체 사이에 한정되어 있는 상기 환형상에 통해서 상방향으로 이동된다. 결국, 처리가스는 상기 기판의 최단 에지부와 접촉되지 않게 한다. 이러한 것을 상기 기판의 저면과 주변에지 위에서 불필요한 증착을 감소시킨다.

Description

기판 처리장치에서 에지증착을 제어하기 위한 제거 링
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명의 가열 받침대의 평면도이며, 제3도는 제2도의 선 3 - 3을 따른 단면도이다.

Claims (20)

  1. 공정유체가 기판 일단부와 접촉되지 못하게 하는 장치에 있어서, (a) 처리챔버내에 있는 기판을 지지하는 기판지지체와, (b) 특정 온도범위 내에서 상기 기판지지체의 주변부로부터 이격되도록 형성되어 상기 기판과 상기 기판지지체를 에워싸는 링과, (c) 세척유체가 상기 링 및 기판 사이로 이송되도록 상기 링과 기판 지지체에 의해 한정되는 세척가스 매니폴드로 구성된 것을 특징으로 하는 장치.
  2. 제1항에 있어서, 상기 특성온도범위는 공정온도범위와 다른 것을 특징으로 하는 장치.
  3. 제2항에 있어서, 상기 세척가스 매니폴드는 (a) 상기 링과 기판 사이의 영역과 연통되는 제1세척유 출구와, (b) 공정온도범위 내에서, 상기 링의 주변과 접촉되는 기판지지체에 의해서 폐쇄되도록 형성된 제2세척유출구로 구성되어 있는 것을 특징으로 하는 장치.
  4. 제3항에 있어서, 상기 특정온도범위는 공정온도범위 이하인 것을 특징으로 하는 장치.
  5. 제3항에 있어서, 상기 링은 상기 기판지지체의 열팽창률과 다른 열팽창률을 가지는 재료로 이루어져 있는 것을 특징으로 하는 장치.
  6. 제5항에 있어서, 상기 재료는 상기 기판지지체의 열전도 계수보다 적은 것을 특징으로 하는 장치.
  7. 제3항에 있어서, 상기 기판지지체와 링 사이의 열전단을 감소시키도록 적어도 하나의 링지지체를 더 구성하고 있는 것을 특징으로 하는 장치.
  8. 제7항에 있어서, 상기 링지지체와 적어도 하나의 링과 기판지지체 사이의 접촉면은 적어도 하나의 링지지체의 단면적 보다 적은 것을 특징으로 하는 장치.
  9. 제7항에 있어서, 상기 링지지체는 상기 기판지지체의 열전도성 보다 낮은 것을 특징으로 하는 장치.
  10. 제7항에 있어서, 상기 링지지체는 상기 기판지지체에 따라서 상기 링을 조정하도록 형성되어 있는 것을 특징으로 하는 장치.
  11. 공정유체가 처리챔버내에 있는 기판지지체 위에서 지지되는 기판의 일단부와 접촉되지 못하게 하는 방법에 있어서, (a) 특성온도범위 내에 있는 기판지지체로부터 외주면에 이격되도록 형성된 링을 구비하고 있는 기판지지체 및 기판을 에워싸는 단계와, (b) 공정유체가 상기 링과 기판 사이에 있는 영역으로 유입되지 못하게 하도록 상기 링과 기판지지체 사이에 있는 영역으로 세척유가 이송되는 단계로 이루어져 있는 것을 특징으로 하는 방법.
  12. 제11항에 있어서, 상기 특성온도범위는 공정온도범위와 다른 것을 특징으로 하는 방법.
  13. 제12항에 있어서, 상기 기판지지체를 에워싸는 공정은 공정온도범위 내에서 상기 링과 기판지지체가 접촉함으로서 상기 링과 기판지지체 사이에 있는 개구부를 밀봉하는 단계를 포함하는 것을 특징으로 하는 방법.
  14. 제13항에 있어서,상기 특성온도범위는 상기 공정온도범위 이하에 있는 것을 특징으로 하는 방법.
  15. 제13항에 있어서, 상기 링과 기판지지체가 접촉되는 단계는 열적으로 상기 링과 기판지지체를 접촉시키는 단계를 포함하는 것을 특징으로 하는 방법.
  16. 제15항에 있어서, 상기 링과 기판지지체를 열적으로 결착하는 단계를 포함하는 것을 특징으로 하는 방법.
  17. 제13항에 있어서, 상기 기판지지체와 링 사이의 열전달을 억제하도록 상기 링을 지지하는 단계를 포함하는 것을 특징으로 하는 방법.
  18. 제17항에 있어서, 상기 링을 지지하는 단계는 링지지체와 적어도 하나의 링과 기판지지체 사이에, 적어도 하나의 링지지체의 단면적 보다 적은 기판지지체 사이에 접촉면을 구비하는 단계를 포함하는 것을 특징으로 하는 방법.
  19. 제17항에 있어서, 상기 링을 지지하는 단계는 상기 기판지지체 보다 열전도성이 적은 것을 특징으로 하는 방법.
  20. 제17항에 있어서, 상기 링을 지지하는 단계는 상기 기판지지체에 따라서 상기 링을 조정하는 단계를 포함하는 것을 특징으로 하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960020233A 1995-06-07 1996-06-07 기판 처리장치에서 에지증착을 제어하기 위한 제거 링 KR970003435A (ko)

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US08/472,220 US5766365A (en) 1994-02-23 1995-06-07 Removable ring for controlling edge deposition in substrate processing apparatus

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