KR960015613A - 전사도체의 제조방법 및 적층용 그린시트의 제조방법 - Google Patents

전사도체의 제조방법 및 적층용 그린시트의 제조방법 Download PDF

Info

Publication number
KR960015613A
KR960015613A KR1019950033634A KR19950033634A KR960015613A KR 960015613 A KR960015613 A KR 960015613A KR 1019950033634 A KR1019950033634 A KR 1019950033634A KR 19950033634 A KR19950033634 A KR 19950033634A KR 960015613 A KR960015613 A KR 960015613A
Authority
KR
South Korea
Prior art keywords
transfer
conductor
forming
resist film
manufacturing
Prior art date
Application number
KR1019950033634A
Other languages
English (en)
Other versions
KR100276052B1 (ko
Inventor
에이이치 우리우
오사무 마키노
히로노부 치바
치사 요코타
Original Assignee
모리시타 요이찌
마쯔시다덴기산교 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 모리시타 요이찌, 마쯔시다덴기산교 가부시기가이샤 filed Critical 모리시타 요이찌
Publication of KR960015613A publication Critical patent/KR960015613A/ko
Application granted granted Critical
Publication of KR100276052B1 publication Critical patent/KR100276052B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F17/06—Fixed inductances of the signal type  with magnetic core with core substantially closed in itself, e.g. toroid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/042—Printed circuit coils by thin film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0117—Pattern shaped electrode used for patterning, e.g. plating or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

본 발명은, 적층칩인덕터등의 칩형전자부품을 형성하기 위한 전사도체의 제조방법 및 적층용그린시트의 제조방법에 관한 것으로서, 각종 적층형세라믹전자부품형성용의 그린시트위에, 전주법에 의해 형성한 미세패턴 이나 고밀도배선회로를 간단히 전사하는 것을 목적으로 한 것이며, 그 구성에 있어서, 베이스스테인레스판(1) 위에 형성되는 소망의 전사용도체(4)의 역패턴의 내약품성에 뛰어난 레지스트막(3)이 형성된 전주도체전사용형을 사용해서 전사용도체(4)를 전주법에 의해 형성하고, 또한 상기 레지스트막(3)을 박리하는 일없이 전사용도체(4)를 피진사체에 전사하고, 이 레지스트막(3)을 반복하여 재이용하여, 전사용도체(4)전주, 전사하는 것을 특징으로 한 것이다.

Description

전사도체의 제조방법 및 적층용 그린시트의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1의 실시예에 있어서의 전사용도체의 형성방법을 표시한 설명용 단면도,
제2도는 동 실시예에 있어서의 적층형 세라믹칩인덕터의 구조를 표시한 분해사시도,
제3도는 동 실시예에 있어서의 적층형 세라믹칩인덕터의 사시도.

Claims (6)

  1. 베이스금속판에, 소망의 도체패턴의 역패턴을 가지는 동시에 적어도 내산성 또는 내알칼리성을 가진 레지스트막을 형성하므로써 전주(電鑄)도체전사용형을 형성하는 제1공정과, 이 전주도체전사용형의 상기 레지스트를 형성하고 있지 않는 부분에, 전사용도체를 전주법(電鑄法)에 의해 형성하는 제2공정과, 상기 레지스트막을 박리하는 일없이 상기 전사용도체를 피전사체에 전사하는 제3의 공정을 가진 것을 특징으로 하는 전사도체의 제조방법.
  2. 제1항에 있어서, 베이스금속판위의 레지스트막을 형성하고 있지 않는 부분에, 도전성이형층을 형성하는 것을 특징으로 하는 전사도체의 제조방법.
  3. 제1항에 있어서, 레지스트막은 이형성을 가진 것 또는 이형성을 부여한 것의 어느 하나인 것을 특징으로 하는 전사도체의 제조방법.
  4. 베이스금속판에, 소망의 도체패턴의 역패턴을 가지는 동시에 적어도 내산성 또는 내알칼리성을 가진 레지스트막을 형성하므로써 전주(電鑄)도체전사용형을 형성하는 제1공정과, 이 전주도체전사용형의 상기 레지스트를 형성하고 있지 않는 부분에, 전사용도체를 전주법(電鑄法)에 의해 형성하는 제2의 공정과, 상기 레지스트막을 박리하는 일없이 상기 전사용도체를 열이형성 접착시트에 전사하는 제3공정과, 상기 열이형성접착시트에 전사한 전사용도체를 절연체 또는 유전체 또는 자성체그린시트에 전사하는 제4의 공정을 가진 것을 특징으로 하는 적층용그린시트의 제조방법.
  5. 베이스금속판에, 소망의 도체패턴의 역패턴을 가지는 동시에 적어도 내산성 또는 내알칼리성을 가진 레지스트막을 형성하므로써 전주(電鑄)도체전사용형을 형성하는 제1공정과, 이 전주도체전사용형의 상기 레지스트를 형성하고 있지 않는 부분에, 전사용도체를 전주법(電鑄法)에 의해 형성하는 제2의 공정과, 상기 레지스트 및 전사용도체위에 절연체 또는 유전체 또는 자성체페이스트를 인쇄 및 건조한 후, 상기 전사용도체와, 전주도체전사용형사이를 박리하는 제3의 공정을 가진 것을 특징으로 하는 적층용그린시트의 제조방법.
  6. 베이스금속판에, 적어도 내산성 또는 내알칼리성을 가진 레지스트막을 형성하고, 이 레지스트막에 엑사이머레이저를 조사하므로써, 소망의 도체패턴의 역패턴을 가진 전주도체전사형을 형성하는 제l의 공정과, 이 전주도체전사형의 상기 레지스트를 형성하고 있지 않는 부분에, 전사용도체를 전주법에 의해 형성하는 제2의 공정을 가진 것을 특징으로 하는 전사도체의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950033634A 1994-10-04 1995-10-02 전사도체의 제조방법 및 적층용 그린시트의 제조방법 KR100276052B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP24008394 1994-10-04
JP94-240083 1994-10-04

Publications (2)

Publication Number Publication Date
KR960015613A true KR960015613A (ko) 1996-05-22
KR100276052B1 KR100276052B1 (ko) 2000-12-15

Family

ID=17054236

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950033634A KR100276052B1 (ko) 1994-10-04 1995-10-02 전사도체의 제조방법 및 적층용 그린시트의 제조방법

Country Status (5)

Country Link
US (1) US5647966A (ko)
EP (2) EP1180919A3 (ko)
KR (1) KR100276052B1 (ko)
CN (1) CN1134798C (ko)
DE (1) DE69527334T2 (ko)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6911887B1 (en) * 1994-09-12 2005-06-28 Matsushita Electric Industrial Co., Ltd. Inductor and method for producing the same
EP1691411B1 (en) * 1996-05-27 2011-10-26 Dai Nippon Printing Co., Ltd. Process for producing a circuit member
JP3438859B2 (ja) * 1996-11-21 2003-08-18 ティーディーケイ株式会社 積層型電子部品とその製造方法
AU1677097A (en) * 1997-02-18 1998-09-08 Sandro Giovanni Giuseppe Ferronato Method of forming a high precision flexible abrasive member
US5940674A (en) * 1997-04-09 1999-08-17 Massachusetts Institute Of Technology Three-dimensional product manufacture using masks
JP3161362B2 (ja) * 1997-05-01 2001-04-25 富士ゼロックス株式会社 微小構造体、その製造方法、その製造装置、基板および成形型
US6136458A (en) 1997-09-13 2000-10-24 Kabushiki Kaisha Toshiba Ferrite magnetic film structure having magnetic anisotropy
US5922514A (en) * 1997-09-17 1999-07-13 Dale Electronics, Inc. Thick film low value high frequency inductor, and method of making the same
US6007758A (en) * 1998-02-10 1999-12-28 Lucent Technologies Inc. Process for forming device comprising metallized magnetic substrates
TW543052B (en) * 2001-03-05 2003-07-21 Nitto Denko Corp Manufacturing method of ceramic green sheet, manufacturing method of multilayer ceramic electronic components, and carrier sheet for ceramic green sheets
US6730857B2 (en) * 2001-03-13 2004-05-04 International Business Machines Corporation Structure having laser ablated features and method of fabricating
US6815709B2 (en) 2001-05-23 2004-11-09 International Business Machines Corporation Structure having flush circuitry features and method of making
US6663786B2 (en) 2001-06-14 2003-12-16 International Business Machines Corporation Structure having embedded flush circuitry features and method of fabricating
KR100571810B1 (ko) * 2003-04-25 2006-04-17 삼성코닝 주식회사 플라즈마 디스플레이 패널용 전자파 차폐 필터와, 이의제조 방법
JP3901133B2 (ja) * 2003-06-24 2007-04-04 住友電気工業株式会社 電鋳用溶融塩浴とこれを用いた金属製品の製造方法
US20060163073A1 (en) * 2003-06-27 2006-07-27 Nobuhiro Higashihara Process for producing metal plating film, process for producing electronic part and plating film forming apparatus
TWI258060B (en) * 2003-07-23 2006-07-11 Hon Hai Prec Ind Co Ltd Method for making cavity of light guide plate
FR2860642B1 (fr) * 2003-10-07 2006-02-24 Commissariat Energie Atomique Procede de realisation d'un multicouche composite.
JP2005236188A (ja) * 2004-02-23 2005-09-02 Alps Electric Co Ltd 導体パターンの製造方法
CN100536046C (zh) * 2005-02-25 2009-09-02 京瓷株式会社 复合生片的加工方法
WO2007043972A1 (en) * 2005-10-12 2007-04-19 Agency For Science, Technology And Research Device carrying an integrated circuit/components and method of producing the same
US20070125652A1 (en) * 2005-12-02 2007-06-07 Buckley Paul W Electroform, methods of making electroforms, and products made from electroforms
DE602006018521D1 (de) * 2005-12-23 2011-01-05 Murata Manufacturing Co Hren dafür
JP5029094B2 (ja) * 2007-03-29 2012-09-19 オムロン株式会社 電気鋳造方法
TWI375968B (en) 2008-06-02 2012-11-01 Delta Electronics Inc Conductive winding structure, the manufacturing method thereof and the magnetic device having the same
CN101599341B (zh) * 2008-06-05 2012-03-07 台达电子工业股份有限公司 导电绕组、其制造方法及应用该导电绕组的磁性元件
JP5470791B2 (ja) * 2008-09-29 2014-04-16 オムロン株式会社 電気鋳造方法
JP5073878B1 (ja) * 2011-11-15 2012-11-14 株式会社Ｌｅａｐ 転写金型の製造方法、それによって作製された転写金型、及びその転写金型によって作製された部品
JP5111687B1 (ja) * 2011-11-15 2013-01-09 株式会社Ｌｅａｐ 転写金型の製造方法、それによって作製された転写金型、及びその転写金型によって作製された部品
JP2013157344A (ja) 2012-01-26 2013-08-15 Alps Electric Co Ltd 配線パターンの製造方法
JP6038748B2 (ja) * 2013-08-30 2016-12-07 富士フイルム株式会社 金属部品の製造方法
CN105428035B (zh) * 2015-12-23 2017-08-25 深圳顺络电子股份有限公司 一种电子元件及其制造方法
CN106908871B (zh) * 2016-03-08 2019-02-26 宁波长阳科技股份有限公司 一种转印扩散膜的制备方法
JP6953279B2 (ja) * 2016-12-07 2021-10-27 日東電工株式会社 モジュールの製造方法
JP6967428B2 (ja) * 2016-12-07 2021-11-17 日東電工株式会社 モジュールの製造方法
CN108811354A (zh) * 2017-04-28 2018-11-13 鹏鼎控股(深圳)股份有限公司 电路板及其制作方法
CN108218404B (zh) * 2017-12-20 2021-02-02 深圳顺络电子股份有限公司 一种电子元件及其制造方法
KR102029582B1 (ko) * 2018-04-19 2019-10-08 삼성전기주식회사 코일부품 및 그 제조방법
CN110016696B (zh) * 2019-03-25 2023-04-07 广东工业大学 一种基于光致导电电极板的微电铸装置及其微电铸方法
JP7300949B2 (ja) * 2019-09-24 2023-06-30 株式会社ジャパンディスプレイ 表示装置の補修方法
CN112118687B (zh) * 2020-08-11 2022-03-08 光臻精密制造(苏州)有限公司 一种高精密超薄pcb制备方法
US11950378B2 (en) * 2021-08-13 2024-04-02 Harbor Electronics, Inc. Via bond attachment

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3247573A (en) * 1962-06-11 1966-04-26 Rca Corp Method of making magnetic ferrite sheet with embedded conductors
NL293840A (ko) * 1962-06-11
DE1279797B (de) * 1963-10-29 1968-10-10 Telefunken Patent Verfahren zur Herstellung gedruckter Schaltungen
US3414487A (en) * 1965-06-30 1968-12-03 Texas Instruments Inc Method of manufacturing printed circuits
US3798059A (en) * 1970-04-20 1974-03-19 Rca Corp Thick film inductor with ferromagnetic core
JPS5812315A (ja) * 1981-07-15 1983-01-24 Yokogawa Hokushin Electric Corp 薄膜コイルの製造方法
JPS6020919B2 (ja) * 1981-09-18 1985-05-24 住友電気工業株式会社 印刷配線板の製造方法
JPS59145009A (ja) * 1983-02-09 1984-08-20 Midori Watanabe 「ろ」過装置および「ろ」過濃縮方法
JPS60147192A (ja) * 1984-01-11 1985-08-03 株式会社日立製作所 プリント配線板の製造方法
JPS60167306A (ja) * 1984-02-09 1985-08-30 Matsushita Electric Ind Co Ltd プリントコイルの製造法
JPS60176208A (ja) * 1984-02-22 1985-09-10 Tdk Corp 積層部品およびその製造法
JPS60186004A (ja) * 1984-03-06 1985-09-21 Hitachi Ltd プリントコイル及びその製造方法
JPS61140115A (ja) * 1984-12-12 1986-06-27 Nec Corp 高周波回路装置
EP0185998A1 (en) * 1984-12-14 1986-07-02 Dynamics Research Corporation Interconnection circuits made from transfer electroforming
JPS61295617A (ja) * 1985-06-25 1986-12-26 Yokogawa Electric Corp インダクトシンパタ−ン形成法
JPS62276894A (ja) * 1986-02-21 1987-12-01 株式会社メイコー スル−ホ−ル付導体回路板の製造方法
US4753694A (en) * 1986-05-02 1988-06-28 International Business Machines Corporation Process for forming multilayered ceramic substrate having solid metal conductors
JPS63284886A (ja) * 1987-05-15 1988-11-22 Toobi:Kk 金属パタ−ン形成方法
JPS642394A (en) * 1987-06-25 1989-01-06 Matsushita Electric Works Ltd Jig for forming transferring wiring
US5063658A (en) * 1987-07-08 1991-11-12 Leonard Kurz Gmbh & Co. Embossing foil and a method of making
JPH0754780B2 (ja) * 1987-08-10 1995-06-07 株式会社村田製作所 積層セラミックコンデンサの製造方法
US4959631A (en) * 1987-09-29 1990-09-25 Kabushiki Kaisha Toshiba Planar inductor
JPH02228093A (ja) * 1989-03-01 1990-09-11 Mitsubishi Electric Corp めつき導体を有するプリント配線板の製造方法
JPH0377360A (ja) * 1989-08-18 1991-04-02 Mitsubishi Electric Corp 半導体装置
JPH03219605A (ja) * 1990-01-24 1991-09-27 Murata Mfg Co Ltd 積層型インダクタンス素子
JP3297429B2 (ja) * 1990-08-09 2002-07-02 ティーディーケイ株式会社 積層チップビーズ
US5233157A (en) * 1990-09-11 1993-08-03 Hughes Aircraft Company Laser pattern ablation of fine line circuitry masters
US5217550A (en) * 1990-09-28 1993-06-08 Dai Nippon Printing Co., Ltd Alignment transfer method
JP2990621B2 (ja) * 1990-11-05 1999-12-13 株式会社村田製作所 積層セラミック電子部品の製造方法
JPH07105420B2 (ja) * 1991-08-26 1995-11-13 ヒューズ・エアクラフト・カンパニー 成形された接点をもった電気接続
US5374469A (en) * 1991-09-19 1994-12-20 Nitto Denko Corporation Flexible printed substrate
US5470412A (en) * 1992-07-30 1995-11-28 Sumitomo Metal Ceramics Inc. Process for producing a circuit substrate
JPH0689811A (ja) * 1992-09-07 1994-03-29 Nippon Steel Corp 薄型インダクタ／トランスおよびその製造方法
US5358604A (en) * 1992-09-29 1994-10-25 Microelectronics And Computer Technology Corp. Method for producing conductive patterns
JPH0757961A (ja) * 1993-08-20 1995-03-03 Murata Mfg Co Ltd 積層セラミック電子部品の製造方法
JPH0775909A (ja) * 1993-09-08 1995-03-20 Seiko Seiki Co Ltd 加工装置
US5480503A (en) * 1993-12-30 1996-01-02 International Business Machines Corporation Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof

Also Published As

Publication number Publication date
EP0706310B1 (en) 2002-07-10
CN1130291A (zh) 1996-09-04
EP0706310A1 (en) 1996-04-10
US5647966A (en) 1997-07-15
EP1180919A2 (en) 2002-02-20
DE69527334T2 (de) 2002-11-14
EP1180919A3 (en) 2007-03-14
DE69527334D1 (de) 2002-08-14
CN1134798C (zh) 2004-01-14
KR100276052B1 (ko) 2000-12-15

Similar Documents

Publication Publication Date Title
KR960015613A (ko) 전사도체의 제조방법 및 적층용 그린시트의 제조방법
KR960012058A (ko) 적층형 세라믹칩 인덕터 및 그 제조방법
KR970019795A (ko) 다층 회로기판 및 그 제조방법
JPH07135376A (ja) 複合プリント回路板とその製造方法
KR830008634A (ko) 후막파인패턴(thick film fine pattern) 도전체(導電體)의 제조방법
EP0404177A3 (en) Transfer sheet for making printed-wiring board by injection molding and method for producing same
KR980007902A (ko) 레이저를 이용한 다층인쇄회로기판의 제조방법
CA2387012A1 (en) Method of manufacturing printed wiring board
US5595858A (en) Manufacturing method for double-sided wiring board
JPH04127492A (ja) プリント配線用材とその製造方法とプリント配線板
KR20020050720A (ko) 다층 플렉시블 배선판의 제조 방법
JPH05259639A (ja) プリント配線板の製造方法
MY138599A (en) Printed circuit boards having integrated inductor cores
EP0402811A3 (en) Method of manufacturing printed circuit boards
JP2001127409A (ja) メッキ転写原版およびその製造方法とそれを用いた電子部品の製造方法
JP3340752B2 (ja) フレキシブルプリント配線板の製造方法
JP2003324027A (ja) 積層型電子部品の製造方法
JPH10313152A (ja) 回路基板
JPS63280496A (ja) 多層回路板の製造方法
JP3582481B2 (ja) 電子部品の製造方法
KR950001266B1 (ko) 알루미늄 회로기판의 제조방법 및 그 회로기판
JPS593879B2 (ja) 印刷配線板の製造法
JPS6221297A (ja) 印刷配線板の製造法
KR960036874A (ko) 플렉시블 pcb의 제조방법
JPS59232495A (ja) 多層配線基板の製造方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application
J201 Request for trial against refusal decision
AMND Amendment
B601 Maintenance of original decision after re-examination before a trial
J301 Trial decision

Free format text: TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 19990828

Effective date: 20000728

S901 Examination by remand of revocation
GRNO Decision to grant (after opposition)
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20070920

Year of fee payment: 8

LAPS Lapse due to unpaid annual fee