DE602006018521D1 - Hren dafür - Google Patents

Hren dafür

Info

Publication number
DE602006018521D1
DE602006018521D1 DE602006018521T DE602006018521T DE602006018521D1 DE 602006018521 D1 DE602006018521 D1 DE 602006018521D1 DE 602006018521 T DE602006018521 T DE 602006018521T DE 602006018521 T DE602006018521 T DE 602006018521T DE 602006018521 D1 DE602006018521 D1 DE 602006018521D1
Authority
DE
Germany
Prior art keywords
hren
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006018521T
Other languages
English (en)
Inventor
Tatsuya Mizuno
Hideaki Matsushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of DE602006018521D1 publication Critical patent/DE602006018521D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H01F2017/002—Details of via holes for interconnecting the layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49071—Electromagnet, transformer or inductor by winding or coiling

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
DE602006018521T 2005-12-23 2006-09-06 Hren dafür Active DE602006018521D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005371196 2005-12-23
PCT/JP2006/317615 WO2007072612A1 (ja) 2005-12-23 2006-09-06 積層コイル部品及びその製造方法

Publications (1)

Publication Number Publication Date
DE602006018521D1 true DE602006018521D1 (de) 2011-01-05

Family

ID=38188396

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006018521T Active DE602006018521D1 (de) 2005-12-23 2006-09-06 Hren dafür

Country Status (6)

Country Link
US (1) US7944336B2 (de)
EP (1) EP1965395B1 (de)
JP (1) JP4100459B2 (de)
CN (1) CN101331564B (de)
DE (1) DE602006018521D1 (de)
WO (1) WO2007072612A1 (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8385043B2 (en) * 2006-08-28 2013-02-26 Avago Technologies ECBU IP (Singapoare) Pte. Ltd. Galvanic isolator
KR101282143B1 (ko) * 2008-10-30 2013-07-04 가부시키가이샤 무라타 세이사쿠쇼 전자 부품
CN102265360B (zh) * 2008-12-26 2013-03-06 株式会社村田制作所 陶瓷电子元器件的制造方法及陶瓷电子元器件
CN101834050B (zh) * 2010-04-27 2011-12-28 深圳顺络电子股份有限公司 一种线圈电导体器件的制作方法及线圈电导体器件
CN102360718B (zh) * 2010-05-24 2014-05-21 三星电机株式会社 多层式电感器
CN103069514A (zh) * 2010-08-18 2013-04-24 株式会社村田制作所 电子部件及其制造方法
KR101218985B1 (ko) * 2011-05-31 2013-01-04 삼성전기주식회사 칩형 코일 부품
JP5834207B2 (ja) * 2011-09-29 2015-12-16 パナソニックＩｐマネジメント株式会社 積層インダクタ
JP5516552B2 (ja) * 2011-11-25 2014-06-11 株式会社村田製作所 電子部品及びその製造方法
JP2013145869A (ja) 2011-12-15 2013-07-25 Taiyo Yuden Co Ltd 積層電子部品及びその製造方法
CN104756207B (zh) * 2012-11-01 2017-04-05 株式会社村田制作所 层叠型电感元件
WO2014125930A1 (ja) * 2013-02-14 2014-08-21 株式会社村田製作所 セラミック電子部品およびその製造方法
JP5900373B2 (ja) 2013-02-15 2016-04-06 株式会社村田製作所 電子部品
JP5761248B2 (ja) * 2013-04-11 2015-08-12 株式会社村田製作所 電子部品
KR101832546B1 (ko) * 2014-10-16 2018-02-26 삼성전기주식회사 칩 전자부품 및 칩 전자부품의 실장 기판
KR101832547B1 (ko) 2014-12-12 2018-02-26 삼성전기주식회사 칩 전자부품 및 그 제조방법
JP6332114B2 (ja) * 2015-04-06 2018-05-30 株式会社村田製作所 積層コイル部品、その製造方法およびスクリーン印刷版
JP6575198B2 (ja) * 2015-07-24 2019-09-18 Tdk株式会社 積層コイル部品
JP6528636B2 (ja) * 2015-10-08 2019-06-12 Tdk株式会社 積層コイル部品
US10847299B2 (en) * 2015-10-26 2020-11-24 Quanten Technologies Limited Magnetic structures with self-enclosed magnetic paths
JP6555417B2 (ja) * 2016-05-19 2019-08-07 株式会社村田製作所 多層基板及び多層基板の製造方法
JP6962100B2 (ja) * 2017-09-25 2021-11-05 Tdk株式会社 積層コイル部品
JP6962129B2 (ja) 2017-10-20 2021-11-05 Tdk株式会社 積層コイル部品及びその製造方法
JP6780629B2 (ja) * 2017-11-27 2020-11-04 株式会社村田製作所 積層型コイル部品
JP7306541B2 (ja) * 2019-05-24 2023-07-11 株式会社村田製作所 バイアスティー回路
JP7111060B2 (ja) * 2019-05-24 2022-08-02 株式会社村田製作所 積層型コイル部品
JP7167971B2 (ja) * 2020-10-14 2022-11-09 株式会社村田製作所 積層型コイル部品

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59189212U (ja) * 1983-05-18 1984-12-15 株式会社村田製作所 チツプ型インダクタ
US4554553A (en) * 1984-06-15 1985-11-19 Fay Grim Polarized signal receiver probe
JP2561643B2 (ja) * 1993-09-30 1996-12-11 太陽誘電株式会社 セラミック電子部品用グリーンシートのレーザ加工法および積層セラミック電子部品の製造方法
JP2003017351A (ja) * 1994-10-04 2003-01-17 Matsushita Electric Ind Co Ltd 転写導体の製造方法およびグリーンシート積層体の製造方法
US5647966A (en) * 1994-10-04 1997-07-15 Matsushita Electric Industrial Co., Ltd. Method for producing a conductive pattern and method for producing a greensheet lamination body including the same
JP3346124B2 (ja) * 1994-10-04 2002-11-18 松下電器産業株式会社 転写導体の製造方法およびグリーンシート積層体の製造方法
JPH1012455A (ja) * 1996-06-24 1998-01-16 Tdk Corp 積層型コイル部品とその製造方法
US5781093A (en) * 1996-08-05 1998-07-14 International Power Devices, Inc. Planar transformer
JP3438859B2 (ja) * 1996-11-21 2003-08-18 ティーディーケイ株式会社 積層型電子部品とその製造方法
US6147409A (en) * 1998-06-15 2000-11-14 Lsi Logic Corporation Modified multilayered metal line structure for use with tungsten-filled vias in integrated circuit structures
JP2976971B1 (ja) * 1998-07-10 1999-11-10 株式会社村田製作所 同相型インダクタ
JP3259686B2 (ja) * 1998-07-27 2002-02-25 株式会社村田製作所 セラミック電子部品
JP2001176725A (ja) * 1999-12-15 2001-06-29 Tdk Corp 積層電子部品
JP2001274021A (ja) * 2000-03-24 2001-10-05 Murata Mfg Co Ltd コイル部品
JP3610881B2 (ja) * 2000-05-22 2005-01-19 株式会社村田製作所 積層セラミック電子部品の製造方法及び積層セラミック電子部品
JP3554784B2 (ja) * 2000-06-13 2004-08-18 株式会社村田製作所 積層セラミック電子部品及びその製造方法
JP3791406B2 (ja) * 2001-01-19 2006-06-28 株式会社村田製作所 積層型インピーダンス素子
JP2002273851A (ja) * 2001-03-19 2002-09-25 Murata Mfg Co Ltd 電極のスクリーン印刷方法及びスクリーン印刷装置
JP4789348B2 (ja) * 2001-05-31 2011-10-12 リンテック株式会社 面状コイル部品、面状コイル部品の特性調整方法、ｉｄタグ、及び、ｉｄタグの共振周波数の調整方法
JP2003209016A (ja) * 2002-01-15 2003-07-25 Tdk Corp 積層インダクタ
JP2004087596A (ja) * 2002-08-23 2004-03-18 Murata Mfg Co Ltd 積層電子部品
TWI264969B (en) * 2003-11-28 2006-10-21 Murata Manufacturing Co Multilayer ceramic electronic component and its manufacturing method

Also Published As

Publication number Publication date
US7944336B2 (en) 2011-05-17
CN101331564A (zh) 2008-12-24
JP4100459B2 (ja) 2008-06-11
EP1965395A1 (de) 2008-09-03
WO2007072612A1 (ja) 2007-06-28
EP1965395B1 (de) 2010-11-24
EP1965395A4 (de) 2008-12-24
US20080246579A1 (en) 2008-10-09
JPWO2007072612A1 (ja) 2009-05-28
CN101331564B (zh) 2014-04-09

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