DE69527334T2 - Verfahren zur Herstellung eines leitfähigen Musters und Verfahren zur Herstellung eines dasselbe enthaltenden Grünfolie-Laminierungskörpers - Google Patents
Verfahren zur Herstellung eines leitfähigen Musters und Verfahren zur Herstellung eines dasselbe enthaltenden Grünfolie-LaminierungskörpersInfo
- Publication number
- DE69527334T2 DE69527334T2 DE69527334T DE69527334T DE69527334T2 DE 69527334 T2 DE69527334 T2 DE 69527334T2 DE 69527334 T DE69527334 T DE 69527334T DE 69527334 T DE69527334 T DE 69527334T DE 69527334 T2 DE69527334 T2 DE 69527334T2
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- same
- conductive pattern
- green sheet
- body containing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 2
- 238000010030 laminating Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F17/06—Fixed inductances of the signal type with magnetic core with core substantially closed in itself, e.g. toroid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/042—Printed circuit coils by thin film techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0117—Pattern shaped electrode used for patterning, e.g. plating or etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Coils Or Transformers For Communication (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24008394 | 1994-10-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69527334D1 DE69527334D1 (de) | 2002-08-14 |
DE69527334T2 true DE69527334T2 (de) | 2002-11-14 |
Family
ID=17054236
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69527334T Expired - Fee Related DE69527334T2 (de) | 1994-10-04 | 1995-10-04 | Verfahren zur Herstellung eines leitfähigen Musters und Verfahren zur Herstellung eines dasselbe enthaltenden Grünfolie-Laminierungskörpers |
Country Status (5)
Country | Link |
---|---|
US (1) | US5647966A (de) |
EP (2) | EP1180919A3 (de) |
KR (1) | KR100276052B1 (de) |
CN (1) | CN1134798C (de) |
DE (1) | DE69527334T2 (de) |
Families Citing this family (42)
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---|---|---|---|---|
US6911887B1 (en) * | 1994-09-12 | 2005-06-28 | Matsushita Electric Industrial Co., Ltd. | Inductor and method for producing the same |
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JP3438859B2 (ja) * | 1996-11-21 | 2003-08-18 | ティーディーケイ株式会社 | 積層型電子部品とその製造方法 |
AU1677097A (en) * | 1997-02-18 | 1998-09-08 | Sandro Giovanni Giuseppe Ferronato | Method of forming a high precision flexible abrasive member |
US5940674A (en) * | 1997-04-09 | 1999-08-17 | Massachusetts Institute Of Technology | Three-dimensional product manufacture using masks |
JP3161362B2 (ja) * | 1997-05-01 | 2001-04-25 | 富士ゼロックス株式会社 | 微小構造体、その製造方法、その製造装置、基板および成形型 |
US6136458A (en) | 1997-09-13 | 2000-10-24 | Kabushiki Kaisha Toshiba | Ferrite magnetic film structure having magnetic anisotropy |
US5922514A (en) * | 1997-09-17 | 1999-07-13 | Dale Electronics, Inc. | Thick film low value high frequency inductor, and method of making the same |
US6007758A (en) * | 1998-02-10 | 1999-12-28 | Lucent Technologies Inc. | Process for forming device comprising metallized magnetic substrates |
TW543052B (en) * | 2001-03-05 | 2003-07-21 | Nitto Denko Corp | Manufacturing method of ceramic green sheet, manufacturing method of multilayer ceramic electronic components, and carrier sheet for ceramic green sheets |
US6730857B2 (en) * | 2001-03-13 | 2004-05-04 | International Business Machines Corporation | Structure having laser ablated features and method of fabricating |
US6815709B2 (en) | 2001-05-23 | 2004-11-09 | International Business Machines Corporation | Structure having flush circuitry features and method of making |
US6663786B2 (en) | 2001-06-14 | 2003-12-16 | International Business Machines Corporation | Structure having embedded flush circuitry features and method of fabricating |
KR100571810B1 (ko) * | 2003-04-25 | 2006-04-17 | 삼성코닝 주식회사 | 플라즈마 디스플레이 패널용 전자파 차폐 필터와, 이의제조 방법 |
JP3901133B2 (ja) * | 2003-06-24 | 2007-04-04 | 住友電気工業株式会社 | 電鋳用溶融塩浴とこれを用いた金属製品の製造方法 |
US20060163073A1 (en) * | 2003-06-27 | 2006-07-27 | Nobuhiro Higashihara | Process for producing metal plating film, process for producing electronic part and plating film forming apparatus |
TWI258060B (en) * | 2003-07-23 | 2006-07-11 | Hon Hai Prec Ind Co Ltd | Method for making cavity of light guide plate |
FR2860642B1 (fr) * | 2003-10-07 | 2006-02-24 | Commissariat Energie Atomique | Procede de realisation d'un multicouche composite. |
JP2005236188A (ja) * | 2004-02-23 | 2005-09-02 | Alps Electric Co Ltd | 導体パターンの製造方法 |
CN100536046C (zh) * | 2005-02-25 | 2009-09-02 | 京瓷株式会社 | 复合生片的加工方法 |
WO2007043972A1 (en) * | 2005-10-12 | 2007-04-19 | Agency For Science, Technology And Research | Device carrying an integrated circuit/components and method of producing the same |
US20070125652A1 (en) * | 2005-12-02 | 2007-06-07 | Buckley Paul W | Electroform, methods of making electroforms, and products made from electroforms |
DE602006018521D1 (de) * | 2005-12-23 | 2011-01-05 | Murata Manufacturing Co | Hren dafür |
JP5029094B2 (ja) * | 2007-03-29 | 2012-09-19 | オムロン株式会社 | 電気鋳造方法 |
TWI375968B (en) | 2008-06-02 | 2012-11-01 | Delta Electronics Inc | Conductive winding structure, the manufacturing method thereof and the magnetic device having the same |
CN101599341B (zh) * | 2008-06-05 | 2012-03-07 | 台达电子工业股份有限公司 | 导电绕组、其制造方法及应用该导电绕组的磁性元件 |
JP5470791B2 (ja) * | 2008-09-29 | 2014-04-16 | オムロン株式会社 | 電気鋳造方法 |
JP5073878B1 (ja) * | 2011-11-15 | 2012-11-14 | 株式会社Leap | 転写金型の製造方法、それによって作製された転写金型、及びその転写金型によって作製された部品 |
JP5111687B1 (ja) * | 2011-11-15 | 2013-01-09 | 株式会社Leap | 転写金型の製造方法、それによって作製された転写金型、及びその転写金型によって作製された部品 |
JP2013157344A (ja) | 2012-01-26 | 2013-08-15 | Alps Electric Co Ltd | 配線パターンの製造方法 |
JP6038748B2 (ja) * | 2013-08-30 | 2016-12-07 | 富士フイルム株式会社 | 金属部品の製造方法 |
CN105428035B (zh) * | 2015-12-23 | 2017-08-25 | 深圳顺络电子股份有限公司 | 一种电子元件及其制造方法 |
CN106908871B (zh) * | 2016-03-08 | 2019-02-26 | 宁波长阳科技股份有限公司 | 一种转印扩散膜的制备方法 |
JP6953279B2 (ja) * | 2016-12-07 | 2021-10-27 | 日東電工株式会社 | モジュールの製造方法 |
JP6967428B2 (ja) * | 2016-12-07 | 2021-11-17 | 日東電工株式会社 | モジュールの製造方法 |
CN108811354A (zh) * | 2017-04-28 | 2018-11-13 | 鹏鼎控股(深圳)股份有限公司 | 电路板及其制作方法 |
CN108218404B (zh) * | 2017-12-20 | 2021-02-02 | 深圳顺络电子股份有限公司 | 一种电子元件及其制造方法 |
KR102029582B1 (ko) * | 2018-04-19 | 2019-10-08 | 삼성전기주식회사 | 코일부품 및 그 제조방법 |
CN110016696B (zh) * | 2019-03-25 | 2023-04-07 | 广东工业大学 | 一种基于光致导电电极板的微电铸装置及其微电铸方法 |
JP7300949B2 (ja) * | 2019-09-24 | 2023-06-30 | 株式会社ジャパンディスプレイ | 表示装置の補修方法 |
CN112118687B (zh) * | 2020-08-11 | 2022-03-08 | 光臻精密制造(苏州)有限公司 | 一种高精密超薄pcb制备方法 |
US11950378B2 (en) * | 2021-08-13 | 2024-04-02 | Harbor Electronics, Inc. | Via bond attachment |
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US3247573A (en) * | 1962-06-11 | 1966-04-26 | Rca Corp | Method of making magnetic ferrite sheet with embedded conductors |
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US3414487A (en) * | 1965-06-30 | 1968-12-03 | Texas Instruments Inc | Method of manufacturing printed circuits |
US3798059A (en) * | 1970-04-20 | 1974-03-19 | Rca Corp | Thick film inductor with ferromagnetic core |
JPS5812315A (ja) * | 1981-07-15 | 1983-01-24 | Yokogawa Hokushin Electric Corp | 薄膜コイルの製造方法 |
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JPS59145009A (ja) * | 1983-02-09 | 1984-08-20 | Midori Watanabe | 「ろ」過装置および「ろ」過濃縮方法 |
JPS60147192A (ja) * | 1984-01-11 | 1985-08-03 | 株式会社日立製作所 | プリント配線板の製造方法 |
JPS60167306A (ja) * | 1984-02-09 | 1985-08-30 | Matsushita Electric Ind Co Ltd | プリントコイルの製造法 |
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JPS61295617A (ja) * | 1985-06-25 | 1986-12-26 | Yokogawa Electric Corp | インダクトシンパタ−ン形成法 |
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US4753694A (en) * | 1986-05-02 | 1988-06-28 | International Business Machines Corporation | Process for forming multilayered ceramic substrate having solid metal conductors |
JPS63284886A (ja) * | 1987-05-15 | 1988-11-22 | Toobi:Kk | 金属パタ−ン形成方法 |
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JPH0754780B2 (ja) * | 1987-08-10 | 1995-06-07 | 株式会社村田製作所 | 積層セラミックコンデンサの製造方法 |
US4959631A (en) * | 1987-09-29 | 1990-09-25 | Kabushiki Kaisha Toshiba | Planar inductor |
JPH02228093A (ja) * | 1989-03-01 | 1990-09-11 | Mitsubishi Electric Corp | めつき導体を有するプリント配線板の製造方法 |
JPH0377360A (ja) * | 1989-08-18 | 1991-04-02 | Mitsubishi Electric Corp | 半導体装置 |
JPH03219605A (ja) * | 1990-01-24 | 1991-09-27 | Murata Mfg Co Ltd | 積層型インダクタンス素子 |
JP3297429B2 (ja) * | 1990-08-09 | 2002-07-02 | ティーディーケイ株式会社 | 積層チップビーズ |
US5233157A (en) * | 1990-09-11 | 1993-08-03 | Hughes Aircraft Company | Laser pattern ablation of fine line circuitry masters |
US5217550A (en) * | 1990-09-28 | 1993-06-08 | Dai Nippon Printing Co., Ltd | Alignment transfer method |
JP2990621B2 (ja) * | 1990-11-05 | 1999-12-13 | 株式会社村田製作所 | 積層セラミック電子部品の製造方法 |
JPH07105420B2 (ja) * | 1991-08-26 | 1995-11-13 | ヒューズ・エアクラフト・カンパニー | 成形された接点をもった電気接続 |
US5374469A (en) * | 1991-09-19 | 1994-12-20 | Nitto Denko Corporation | Flexible printed substrate |
US5470412A (en) * | 1992-07-30 | 1995-11-28 | Sumitomo Metal Ceramics Inc. | Process for producing a circuit substrate |
JPH0689811A (ja) * | 1992-09-07 | 1994-03-29 | Nippon Steel Corp | 薄型インダクタ/トランスおよびその製造方法 |
US5358604A (en) * | 1992-09-29 | 1994-10-25 | Microelectronics And Computer Technology Corp. | Method for producing conductive patterns |
JPH0757961A (ja) * | 1993-08-20 | 1995-03-03 | Murata Mfg Co Ltd | 積層セラミック電子部品の製造方法 |
JPH0775909A (ja) * | 1993-09-08 | 1995-03-20 | Seiko Seiki Co Ltd | 加工装置 |
US5480503A (en) * | 1993-12-30 | 1996-01-02 | International Business Machines Corporation | Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof |
-
1995
- 1995-10-02 KR KR1019950033634A patent/KR100276052B1/ko not_active IP Right Cessation
- 1995-10-02 US US08/537,512 patent/US5647966A/en not_active Expired - Fee Related
- 1995-10-04 CN CNB951095536A patent/CN1134798C/zh not_active Expired - Fee Related
- 1995-10-04 DE DE69527334T patent/DE69527334T2/de not_active Expired - Fee Related
- 1995-10-04 EP EP01119752A patent/EP1180919A3/de not_active Withdrawn
- 1995-10-04 EP EP95115632A patent/EP0706310B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0706310B1 (de) | 2002-07-10 |
KR960015613A (ko) | 1996-05-22 |
CN1130291A (zh) | 1996-09-04 |
EP0706310A1 (de) | 1996-04-10 |
US5647966A (en) | 1997-07-15 |
EP1180919A2 (de) | 2002-02-20 |
EP1180919A3 (de) | 2007-03-14 |
DE69527334D1 (de) | 2002-08-14 |
CN1134798C (zh) | 2004-01-14 |
KR100276052B1 (ko) | 2000-12-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |