KR910019218A - 보로실리케이트 유리스페이서를 갖는 반도체 디바이스 및 그 제조 방법 - Google Patents
보로실리케이트 유리스페이서를 갖는 반도체 디바이스 및 그 제조 방법 Download PDFInfo
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- KR910019218A KR910019218A KR1019910005082A KR910005082A KR910019218A KR 910019218 A KR910019218 A KR 910019218A KR 1019910005082 A KR1019910005082 A KR 1019910005082A KR 910005082 A KR910005082 A KR 910005082A KR 910019218 A KR910019218 A KR 910019218A
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- substrate
- borosilicate glass
- polysilicon
- sidewall
- Prior art date
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- 239000005388 borosilicate glass Substances 0.000 title claims 12
- 125000006850 spacer group Chemical group 0.000 title claims 7
- 239000004065 semiconductor Substances 0.000 title claims 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 claims 13
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims 9
- 229920005591 polysilicon Polymers 0.000 claims 9
- 238000000034 method Methods 0.000 claims 8
- 238000009792 diffusion process Methods 0.000 claims 6
- 239000002019 doping agent Substances 0.000 claims 6
- 238000000151 deposition Methods 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 2
- 230000005669 field effect Effects 0.000 claims 2
- 238000000137 annealing Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910021332 silicide Inorganic materials 0.000 claims 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/20—Resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
- H01L21/2251—Diffusion into or out of group IV semiconductors
- H01L21/2254—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides
- H01L21/2255—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides the applied layer comprising oxides only, e.g. P2O5, PSG, H3BO3, doped oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/28525—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table the conductive layers comprising semiconducting material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76897—Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8248—Combination of bipolar and field-effect technology
- H01L21/8249—Bipolar and MOS technology
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/66272—Silicon vertical transistors
- H01L29/6628—Inverse transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/665—Unipolar field-effect transistors with an insulated gate, i.e. MISFET using self aligned silicidation, i.e. salicide
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Bipolar Transistors (AREA)
- Formation Of Insulating Films (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 발명의 한 구체 예에 따른 BICMOS구조의 단면도이다.
Claims (11)
- 반도체 구조내에 P+확산 영역 및 측벽 스페이서 영역을 형성하는 방법에 있어서, 최소한 하나의 제 1 측벽부분을 각기 지니는 복수의 폴리실리콘 영역등을 기판 표면상에 제공하는 단계, 상기 복수의 폴리실리콘 영역중 최소한한 부분위에 보로 실리케이트 유리층을 데포지트 하는 단계, 상기 보로실리케이트 유리층의 선택 부분을 에칭하여 상기 최소한 하나의 측벽 부분에 인접한 보로실리케이트 유리 스페이서를 제공하는 단계, 상기 기판, 폴리실리콘 및 스페이서를 어닐링하여 상기 보로실리게이트 유리로부터 상기 기판의 인접 부분까지 P형 도판트의 확산을 야기하여 확산 영역을 형성하는 단계로 이루어지는 방법.
- 제 1 항에 있어서, 상기 기판 부분들을 선택적으로 도핑하여 바이폴과 디바이스의 에미터, 컬렉터 및 베이스 영역을 형성하는 단계를 또한 포함하며, 상기 확산 영역이 상기 베이스 영역의 최소한 일부분을 형성하는 방법.
- 제 1 항에 있어서, 상기 기판 부분들을 선택적으로 도핑하여 상기 기판에 소오스, 드레인 및 채널 영역을 형성하는 단계를 또한 포함하며, 상기 확산 영역은 하나의 최소한 일부분을 형성하는 방법.
- 최소한 일부분이 기판의 표면에 인접한 최소한 제 1 의 능동 영역을 가지는 기판을 제공하는 단계, 최소한 하나의 제1측벽 부분을 가지고 있는 상기 활성 영역의 노출 지역에 인접한 최소한 하나의 제1폴리실리콘 영역을 상기 능동 영역의 상기 부분에 인접하여 상기 기판의 표면상에 제공하는 단계, 최소한 일부가 상기 노출 지역의 최소한 일부를 덮어서 최소한 상기 기판, 상기 제 1 폴리실리콘 영역 및 보로실리케이트 유리의 상기 층의 상기 부분을 포함하는 구조를 형성하는 보로실리케이트 유리의 층을 데포지트 하는 단계 및, 상기 구조의 최소한 일부를 가열하여 P형 도판트를 상기 보로실리케이트 유리로부터 상기 보로실리케이트 유리층에 인접한 상기 능동영역의 최소한 일부분내로 확산시키고 P형 도판트의 확산을 수용하는 상기 능동 영역의 상기 부분이 도판트가 풍부해지는 단계를 포함하는 트랜지스터 형성방법.
- 제 4 항에 있어서, 상기 능동 영역이 바이폴라 디바이스의 베이스 영역인 방법.
- 제 4 항에 있어서, 상기 능동 영역이 전계 효과 디바이스의 소오스 영역과 드레인 영역중 한 영역인 방법.
- 제 4 항에 있어서, 상기 보로 실리케이트 유리층의 부분들을 에칭하여 상기 측벽 부분들중 최소한 한 부분상에 보로실리케이트 유리 스페이서를 제공하는 단계를 또한 포함하는 방법.
- 제 4 항에 있어서, 최소한 상기기판의 선택된 일부분 및 상기 제 1 폴리실리콘 영역과 제 2 폴리 실리콘 영역중 최소한 한 영역에 고융점 금속 실리사이드 층을 형성하는 단계를 또한 포함하는 방법.
- 표면에 인접하여 최소한 하나의 제 1 의 P도핑 영역을 가지는 기판, 상기 기판의 표면상에 형성되고 최소한 하나의 제 1 측벽을 가지는 도핑된 폴리실리콘 영역 및, 상기 폴리실리콘 측벽에 인접한 최소한 하나의 제1측벽 스페이서로서 보로 실리케이트 유리를 포함하고, 상기 P도핑 영역내의 도판트의 최소한 일부가 상기 측벽 스페이서로부터 확산된 도판트인 반도체 구조체.
- 제 9 항에 있어서, 상기 P도핑 영역이 바이폴라 트랜지스터의 베이스 영역인 구조체.
- 제 9 항에 있어서, 상기 P도핑 영역이 전계효과 트랜지스터의 소오스영역과 드레인 영역중 한 영역인 구조체.※ 참고사항 : 최초출원내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US50334690A | 1990-04-02 | 1990-04-02 | |
US503346 | 1990-04-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR910019218A true KR910019218A (ko) | 1991-11-30 |
KR100227874B1 KR100227874B1 (ko) | 1999-11-01 |
Family
ID=24001710
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1019910005082A KR100227874B1 (ko) | 1990-04-02 | 1991-03-30 | 보로실리케이트 유리 스페이서를 갖는 반도체 디바이스 및 그 제조방법 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5443994A (ko) |
EP (1) | EP0450503A3 (ko) |
JP (1) | JPH0645343A (ko) |
KR (1) | KR100227874B1 (ko) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3095564B2 (ja) * | 1992-05-29 | 2000-10-03 | 株式会社東芝 | 半導体装置及び半導体装置の製造方法 |
US6011283A (en) * | 1992-10-19 | 2000-01-04 | Hyundai Electronics America | Pillar emitter for BiCMOS devices |
JP2934738B2 (ja) * | 1994-03-18 | 1999-08-16 | セイコーインスツルメンツ株式会社 | 半導体装置およびその製造方法 |
JPH09129747A (ja) * | 1995-11-06 | 1997-05-16 | Toshiba Corp | 半導体装置の製造方法 |
TW302539B (en) * | 1996-08-26 | 1997-04-11 | Lin Horng Hyh | Manufacturing method of deep submicron PMOS device shallow junction |
WO2001004960A1 (fr) * | 1999-07-07 | 2001-01-18 | Matsushita Electric Industrial Co., Ltd. | Dispositif semi-conducteur et procede de fabrication correspondant |
JP2007512684A (ja) * | 2003-10-29 | 2007-05-17 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 部分的シリサイド化シリコン層を有する集積回路 |
KR100615218B1 (ko) * | 2004-04-29 | 2006-08-25 | 삼성에스디아이 주식회사 | 다결정 실리콘막을 채용한 박막 트랜지스터의 제조 방법,이에 따라 제조된 박막 트랜지스터 및 상기 박막트랜지스터를 구비한 평판 표시장치 |
JP3998677B2 (ja) * | 2004-10-19 | 2007-10-31 | 株式会社東芝 | 半導体ウェハの製造方法 |
US7095239B2 (en) * | 2004-11-09 | 2006-08-22 | Hitachi Global Storage Technologies Netherlands B.V. | Method for detecting defects that exhibit repetitive patterns |
US8847196B2 (en) * | 2011-05-17 | 2014-09-30 | Micron Technology, Inc. | Resistive memory cell |
US10840381B2 (en) | 2016-08-10 | 2020-11-17 | International Business Machines Corporation | Nanosheet and nanowire MOSFET with sharp source/drain junction |
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US3955269A (en) * | 1975-06-19 | 1976-05-11 | International Business Machines Corporation | Fabricating high performance integrated bipolar and complementary field effect transistors |
US4209350A (en) * | 1978-11-03 | 1980-06-24 | International Business Machines Corporation | Method for forming diffusions having narrow dimensions utilizing reactive ion etching |
US4507847A (en) * | 1982-06-22 | 1985-04-02 | Ncr Corporation | Method of making CMOS by twin-tub process integrated with a vertical bipolar transistor |
JPS58225663A (ja) * | 1982-06-23 | 1983-12-27 | Toshiba Corp | 半導体装置の製造方法 |
US4536945A (en) * | 1983-11-02 | 1985-08-27 | National Semiconductor Corporation | Process for producing CMOS structures with Schottky bipolar transistors |
US4609568A (en) * | 1984-07-27 | 1986-09-02 | Fairchild Camera & Instrument Corporation | Self-aligned metal silicide process for integrated circuits having self-aligned polycrystalline silicon electrodes |
US4764480A (en) * | 1985-04-01 | 1988-08-16 | National Semiconductor Corporation | Process for making high performance CMOS and bipolar integrated devices on one substrate with reduced cell size |
JPS61290761A (ja) * | 1985-06-19 | 1986-12-20 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
JPS6260220A (ja) * | 1985-09-09 | 1987-03-16 | Seiko Epson Corp | 半導体装置の製造方法 |
US4737472A (en) * | 1985-12-17 | 1988-04-12 | Siemens Aktiengesellschaft | Process for the simultaneous production of self-aligned bipolar transistors and complementary MOS transistors on a common silicon substrate |
JPS62210677A (ja) * | 1986-03-12 | 1987-09-16 | Oki Electric Ind Co Ltd | 半導体装置の製造方法 |
US4795722A (en) * | 1987-02-05 | 1989-01-03 | Texas Instruments Incorporated | Method for planarization of a semiconductor device prior to metallization |
US4829025A (en) * | 1987-10-02 | 1989-05-09 | Advanced Micro Devices, Inc. | Process for patterning films in manufacture of integrated circuit structures |
US5006476A (en) * | 1988-09-07 | 1991-04-09 | North American Philips Corp., Signetics Division | Transistor manufacturing process using three-step base doping |
US4897364A (en) * | 1989-02-27 | 1990-01-30 | Motorola, Inc. | Method for locos isolation using a framed oxidation mask and a polysilicon buffer layer |
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1991
- 1991-03-28 EP EP19910104947 patent/EP0450503A3/en not_active Withdrawn
- 1991-03-30 KR KR1019910005082A patent/KR100227874B1/ko not_active IP Right Cessation
- 1991-04-02 JP JP3144275A patent/JPH0645343A/ja active Pending
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1994
- 1994-09-23 US US08/311,837 patent/US5443994A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0450503A3 (en) | 1992-05-20 |
JPH0645343A (ja) | 1994-02-18 |
US5443994A (en) | 1995-08-22 |
KR100227874B1 (ko) | 1999-11-01 |
EP0450503A2 (en) | 1991-10-09 |
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