KR880005678A - 반도체장치용 리드프레임 - Google Patents

반도체장치용 리드프레임 Download PDF

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Publication number
KR880005678A
KR880005678A KR1019870008766A KR870008766A KR880005678A KR 880005678 A KR880005678 A KR 880005678A KR 1019870008766 A KR1019870008766 A KR 1019870008766A KR 870008766 A KR870008766 A KR 870008766A KR 880005678 A KR880005678 A KR 880005678A
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South Korea
Prior art keywords
semiconductor devices
lead frame
thin film
lead frames
film metal
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KR1019870008766A
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English (en)
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KR900007230B1 (ko
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도시아끼 시노하라
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시기모리야
미쓰비시 뎅끼 가부시끼가이샤
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Publication of KR880005678A publication Critical patent/KR880005678A/ko
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Publication of KR900007230B1 publication Critical patent/KR900007230B1/ko

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    • H—ELECTRICITY
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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    • H01L23/495—Lead-frames or other flat leads
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    • H01L23/495—Lead-frames or other flat leads
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T29/00—Metal working
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    • Y10T29/49121—Beam lead frame or beam lead device

Abstract

내용 없음

Description

반도체 장치용 리드프래임
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도∼제 3 도는 본 발명의 일실시예를 표시단 것으로서,
제 1 도는 러드프레임의 사시도.
제 2 도는 요부의 단면도.
제 3a 도, 제 3b 도는 수지봉지공정을 표시한 설명도.
* 도면의 주요부분에 대한 부호의 설명
1 : 타이 바 2 : 아우터리드
3 : 인너리드 4 : 다이패드
8 : 수지 13 : 납도금층

Claims (3)

  1. 수지봉지령 반도체장치의 조립공정에 사용되는 리드프레임애 있어서 봉지수지에서 외부의 아우터리드및 타이 바 부에 난용용성이면서 변형하기 쉬운 엷은 막 금속층을 형성한 것을 특정으로 하는 반도체장치용 리드프레임 .
  2. 제 1 항에 있어서 엷은막 금속층은 납도금에 의하여 형성된 반도체장치용 리드프레임.
  3. 제 1 항 또는 제 2 항에 있어서 엶은막 금속출의 두께는1μ∼20μ으로 된 반도체창치용 리드프레임.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870008766A 1986-10-13 1987-08-10 반도체 장치용 리드프레임 KR900007230B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP61-243612 1986-10-13
JP61243612A JPS6396947A (ja) 1986-10-13 1986-10-13 半導体装置用リ−ドフレ−ム
JP243612 1986-10-13

Publications (2)

Publication Number Publication Date
KR880005678A true KR880005678A (ko) 1988-06-30
KR900007230B1 KR900007230B1 (ko) 1990-10-05

Family

ID=17106405

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870008766A KR900007230B1 (ko) 1986-10-13 1987-08-10 반도체 장치용 리드프레임

Country Status (5)

Country Link
US (2) US4942455A (ko)
JP (1) JPS6396947A (ko)
KR (1) KR900007230B1 (ko)
GB (1) GB2195826B (ko)
SG (1) SG52991G (ko)

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SG52991G (en) 1991-08-23
GB2195826B (en) 1990-01-10
GB8724006D0 (en) 1987-11-18
US4942455A (en) 1990-07-17
GB2195826A (en) 1988-04-13
JPS6396947A (ja) 1988-04-27
KR900007230B1 (ko) 1990-10-05

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