KR910020858A - 수지봉지형(封止型) 반도체장치 및 그 제조방법 - Google Patents
수지봉지형(封止型) 반도체장치 및 그 제조방법 Download PDFInfo
- Publication number
- KR910020858A KR910020858A KR1019910004310A KR910004310A KR910020858A KR 910020858 A KR910020858 A KR 910020858A KR 1019910004310 A KR1019910004310 A KR 1019910004310A KR 910004310 A KR910004310 A KR 910004310A KR 910020858 A KR910020858 A KR 910020858A
- Authority
- KR
- South Korea
- Prior art keywords
- resin
- semiconductor element
- electrode
- lead frame
- manufacturing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 이 발명의 한실시예에 의한 수지봉지형(樹脂封止型)반도체 장치를 표시하는 사시도.
Claims (2)
- 반도체 소자와, 이 반도체 소자를 얹어놓는 다이패드를 포함하는 리드플레임과, 상기 반도체 소자의 전극상에 복수개 설치된 외부전극과, 이 외부전극이 상부에 돌출하도록 상기 반도체소자, 리드플레임 및 외부전극을 봉지하는 봉지수지와를 구비한 것을 특징으로 하는 수지봉지형 반도체장치.
- 반도체 소자의 전극상에 코팅수지를 시행하고, 이 반도체 소자를 리드플레임의 다이패드에 얹어놓고, 상기 코팅수지의 표면에 접촉하는 금형을 사용하여 상기 반도체 소자 및 리드 플레임을 봉지수지로 봉지하고, 수지봉지한 반도 체소자 전극상의 코팅수지를 용제로 제거하여 전극상의 봉지수지에 구멍을 형성하고, 계속해서, 이 구멍내에 금속을 매설하는 것에 의하여 외부전극을 형성하는 것을 특징으로 하는 수지봉지형 반도체장치의 제조방법.※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2138278A JP2809478B2 (ja) | 1990-05-30 | 1990-05-30 | 樹脂封止型半導体装置の製造方法 |
| JP2-138278 | 1990-05-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR910020858A true KR910020858A (ko) | 1991-12-20 |
| KR940007948B1 KR940007948B1 (ko) | 1994-08-29 |
Family
ID=15218179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019910004310A KR940007948B1 (ko) | 1990-05-30 | 1991-03-19 | 수지봉지형(封止型) 반도체장치 및 그 제조방법 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2809478B2 (ko) |
| KR (1) | KR940007948B1 (ko) |
-
1990
- 1990-05-30 JP JP2138278A patent/JP2809478B2/ja not_active Expired - Fee Related
-
1991
- 1991-03-19 KR KR1019910004310A patent/KR940007948B1/ko not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR940007948B1 (ko) | 1994-08-29 |
| JPH0433358A (ja) | 1992-02-04 |
| JP2809478B2 (ja) | 1998-10-08 |
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| FPAY | Annual fee payment |
Payment date: 20080825 Year of fee payment: 15 |
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| LAPS | Lapse due to unpaid annual fee |