KR101561132B1 - 프린트 배선판용 쉴드 필름 및 프린트 배선판 - Google Patents
프린트 배선판용 쉴드 필름 및 프린트 배선판 Download PDFInfo
- Publication number
- KR101561132B1 KR101561132B1 KR1020147017354A KR20147017354A KR101561132B1 KR 101561132 B1 KR101561132 B1 KR 101561132B1 KR 1020147017354 A KR1020147017354 A KR 1020147017354A KR 20147017354 A KR20147017354 A KR 20147017354A KR 101561132 B1 KR101561132 B1 KR 101561132B1
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- printed wiring
- wiring board
- metal layer
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 235
- 239000002184 metal Substances 0.000 claims abstract description 235
- 239000010410 layer Substances 0.000 claims description 324
- 239000012790 adhesive layer Substances 0.000 claims description 82
- 239000002923 metal particle Substances 0.000 claims description 41
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 32
- 239000000853 adhesive Substances 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 26
- 230000001070 adhesive effect Effects 0.000 claims description 26
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 23
- 229910052709 silver Inorganic materials 0.000 claims description 23
- 239000004332 silver Substances 0.000 claims description 23
- 229910052802 copper Inorganic materials 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 19
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 18
- 229910052759 nickel Inorganic materials 0.000 claims description 17
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- 239000011148 porous material Substances 0.000 claims description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 10
- 239000011135 tin Substances 0.000 claims description 10
- 229910052718 tin Inorganic materials 0.000 claims description 10
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 9
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 9
- 229910045601 alloy Inorganic materials 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 9
- 229910052804 chromium Inorganic materials 0.000 claims description 9
- 239000011651 chromium Substances 0.000 claims description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 9
- 229910052763 palladium Inorganic materials 0.000 claims description 9
- 229910052719 titanium Inorganic materials 0.000 claims description 9
- 239000010936 titanium Substances 0.000 claims description 9
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 8
- 229910052725 zinc Inorganic materials 0.000 claims description 8
- 239000011701 zinc Substances 0.000 claims description 8
- 239000011800 void material Substances 0.000 claims description 4
- 238000005452 bending Methods 0.000 abstract description 22
- 239000010408 film Substances 0.000 description 183
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- 239000010409 thin film Substances 0.000 description 25
- 239000000945 filler Substances 0.000 description 22
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- 238000010438 heat treatment Methods 0.000 description 13
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- -1 polypropylene Polymers 0.000 description 10
- 238000009413 insulation Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 229920000728 polyester Polymers 0.000 description 8
- 229920001187 thermosetting polymer Polymers 0.000 description 8
- 239000013039 cover film Substances 0.000 description 7
- 229910000765 intermetallic Inorganic materials 0.000 description 7
- 239000004734 Polyphenylene sulfide Substances 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 229920000069 polyphenylene sulfide Polymers 0.000 description 6
- 229920005992 thermoplastic resin Polymers 0.000 description 6
- 239000004743 Polypropylene Substances 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 229920001155 polypropylene Polymers 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 101100163433 Drosophila melanogaster armi gene Proteins 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 238000005566 electron beam evaporation Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 229920006351 engineering plastic Polymers 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
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- 229920000877 Melamine resin Polymers 0.000 description 2
- 239000004693 Polybenzimidazole Substances 0.000 description 2
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- 229920000180 alkyd Polymers 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 229920003020 cross-linked polyethylene Polymers 0.000 description 2
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- 239000003822 epoxy resin Substances 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920002480 polybenzimidazole Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
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- 229920002050 silicone resin Polymers 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
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- 238000001035 drying Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000001227 electron beam curing Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007202709A JP4974803B2 (ja) | 2007-08-03 | 2007-08-03 | プリント配線板用シールドフィルム及びプリント配線板 |
| JPJP-P-2007-202709 | 2007-08-03 | ||
| PCT/JP2008/062844 WO2009019963A1 (ja) | 2007-08-03 | 2008-07-16 | プリント配線板用シールドフィルム及びプリント配線板 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020107004573A Division KR101510173B1 (ko) | 2007-08-03 | 2008-07-16 | 프린트 배선판용 쉴드 필름 및 프린트 배선판 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20140093738A KR20140093738A (ko) | 2014-07-28 |
| KR101561132B1 true KR101561132B1 (ko) | 2015-10-19 |
Family
ID=40341200
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020147017354A Active KR101561132B1 (ko) | 2007-08-03 | 2008-07-16 | 프린트 배선판용 쉴드 필름 및 프린트 배선판 |
| KR1020147027932A Active KR101553282B1 (ko) | 2007-08-03 | 2008-07-16 | 프린트 배선판용 쉴드 필름 및 프린트 배선판 |
| KR1020107004573A Active KR101510173B1 (ko) | 2007-08-03 | 2008-07-16 | 프린트 배선판용 쉴드 필름 및 프린트 배선판 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020147027932A Active KR101553282B1 (ko) | 2007-08-03 | 2008-07-16 | 프린트 배선판용 쉴드 필름 및 프린트 배선판 |
| KR1020107004573A Active KR101510173B1 (ko) | 2007-08-03 | 2008-07-16 | 프린트 배선판용 쉴드 필름 및 프린트 배선판 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4974803B2 (https=) |
| KR (3) | KR101561132B1 (https=) |
| CN (1) | CN101772996B (https=) |
| TW (4) | TWI477229B (https=) |
| WO (1) | WO2009019963A1 (https=) |
Families Citing this family (65)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5150534B2 (ja) * | 2009-03-06 | 2013-02-20 | 信越ポリマー株式会社 | カバーレイフィルム、その製造方法およびフレキシブルプリント配線板 |
| JP5355478B2 (ja) * | 2010-04-07 | 2013-11-27 | 株式会社フジクラ | フレキシブルプリント基板及びその製造方法 |
| US20110284268A1 (en) * | 2010-05-20 | 2011-11-24 | 3M Innovative Properties Company | Flexible circuit coverfilm adhesion enhancement |
| JP5940279B2 (ja) * | 2011-10-27 | 2016-06-29 | 藤森工業株式会社 | Fpc用電磁波シールド材の製造方法 |
| US10015915B2 (en) * | 2011-11-24 | 2018-07-03 | Tatsuta Electric Wire & Cable Co., Ltd. | Shield film, shielded printed wiring board, and method for manufacturing shield film |
| TWI444132B (zh) * | 2011-12-08 | 2014-07-01 | Ind Tech Res Inst | 電磁波屏蔽複合膜及具有該複合膜之軟性印刷電路板 |
| CN104350816A (zh) * | 2012-06-07 | 2015-02-11 | 大自达电线股份有限公司 | 屏蔽膜及屏蔽印刷布线板 |
| CN102711428B (zh) * | 2012-06-21 | 2015-11-18 | 广州方邦电子有限公司 | 一种高屏蔽效能的极薄屏蔽膜及其制作方法 |
| JP6152557B2 (ja) * | 2012-11-30 | 2017-06-28 | 国立研究開発法人産業技術総合研究所 | フレキシブル電力センサー |
| JP2014123630A (ja) * | 2012-12-20 | 2014-07-03 | Tatsuta Electric Wire & Cable Co Ltd | シールドプリント配線板の製造方法、シールドフィルム、及び、シールドプリント配線板 |
| KR102026751B1 (ko) * | 2013-05-28 | 2019-09-30 | 타츠타 전선 주식회사 | 형상 유지 필름, 및 이 형상 유지 필름을 구비한 형상 유지형 플렉시블 배선판 |
| JP2015088658A (ja) * | 2013-10-31 | 2015-05-07 | 積水ナノコートテクノロジー株式会社 | シート状電磁波シールド材 |
| CN103763893B (zh) * | 2014-01-14 | 2016-04-13 | 广州方邦电子股份有限公司 | 电磁波屏蔽膜以及包含屏蔽膜的线路板的制作方法 |
| CN105101761A (zh) * | 2014-05-06 | 2015-11-25 | 昆山雅森电子材料科技有限公司 | 高传输薄型化电磁干扰屏蔽膜及其制造方法和应用 |
| WO2015186624A1 (ja) * | 2014-06-02 | 2015-12-10 | タツタ電線株式会社 | 導電性接着フィルム、プリント回路基板、及び、電子機器 |
| CN108728005B (zh) * | 2014-09-01 | 2020-03-06 | 江苏斯迪克新材料科技股份有限公司 | 高导热型吸波贴膜 |
| WO2016080174A1 (ja) | 2014-11-19 | 2016-05-26 | 帝人デュポンフィルム株式会社 | 二軸配向ポリエステルフィルム |
| JP6511473B2 (ja) * | 2014-12-05 | 2019-05-15 | タツタ電線株式会社 | 電磁波シールドフィルム |
| JP6520133B2 (ja) * | 2015-01-16 | 2019-05-29 | 大日本印刷株式会社 | 積層体ならびにそれを用いた導電性基材の製造方法および電子デバイスの製造方法 |
| JP6520143B2 (ja) * | 2015-01-23 | 2019-05-29 | 大日本印刷株式会社 | 積層体、それを用いた導電性基材の製造方法、電子デバイスの製造方法、および転写具 |
| JP6481864B2 (ja) * | 2015-12-25 | 2019-03-13 | 東レKpフィルム株式会社 | 金属化フィルムおよびその製造方法 |
| TWI748975B (zh) * | 2015-12-25 | 2021-12-11 | 日商拓自達電線股份有限公司 | 電磁波屏蔽膜及其製造方法 |
| JP6202177B1 (ja) * | 2016-01-21 | 2017-09-27 | 東洋インキScホールディングス株式会社 | 電磁波シールドシートおよびプリント配線板 |
| CN108702863B (zh) | 2016-03-23 | 2021-04-13 | 拓自达电线株式会社 | 电磁波屏蔽膜 |
| JP2017212274A (ja) * | 2016-05-24 | 2017-11-30 | タツタ電線株式会社 | 電磁波シールドフィルム、およびそれを備えたシールドプリント配線板 |
| CN105960157A (zh) * | 2016-07-06 | 2016-09-21 | 武汉华星光电技术有限公司 | 电磁屏蔽保护膜与fpc |
| CN106231885B (zh) * | 2016-08-13 | 2018-12-14 | 深圳市超梦智能科技有限公司 | 导航路径显示方法 |
| CN106393882A (zh) * | 2016-08-30 | 2017-02-15 | 联泓(江苏)新材料研究院有限公司 | 一种可防电磁辐射的绝缘功能薄膜及其制备方法 |
| US10825839B2 (en) * | 2016-12-02 | 2020-11-03 | Innolux Corporation | Touch display device |
| JP6959948B2 (ja) * | 2017-02-13 | 2021-11-05 | タツタ電線株式会社 | シールドフィルム、シールドプリント配線板及びシールドプリント配線板の製造方法 |
| JP6872567B2 (ja) * | 2017-02-13 | 2021-05-19 | タツタ電線株式会社 | シールドプリント配線板及びシールドプリント配線板の製造方法 |
| JPWO2018147424A1 (ja) * | 2017-02-13 | 2019-12-12 | タツタ電線株式会社 | プリント配線板 |
| WO2019012590A1 (ja) | 2017-07-10 | 2019-01-17 | タツタ電線株式会社 | 電磁波シールドフィルム、およびそれを備えたシールドプリント配線板 |
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| WO2009019963A1 (ja) | 2009-02-12 |
| TWI700984B (zh) | 2020-08-01 |
| KR20140125458A (ko) | 2014-10-28 |
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| KR20140093738A (ko) | 2014-07-28 |
| TW200922456A (en) | 2009-05-16 |
| CN101772996A (zh) | 2010-07-07 |
| TW201844077A (zh) | 2018-12-16 |
| TWI477229B (zh) | 2015-03-11 |
| TWI700983B (zh) | 2020-08-01 |
| CN101772996B (zh) | 2012-11-28 |
| JP4974803B2 (ja) | 2012-07-11 |
| TW201742544A (zh) | 2017-12-01 |
| JP2009038278A (ja) | 2009-02-19 |
| TW201438560A (zh) | 2014-10-01 |
| KR20100051699A (ko) | 2010-05-17 |
| KR101553282B1 (ko) | 2015-09-15 |
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