KR101203017B1 - 전기 장치, 접속 방법 및 접착 필름 - Google Patents
전기 장치, 접속 방법 및 접착 필름 Download PDFInfo
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- KR101203017B1 KR101203017B1 KR1020097000461A KR20097000461A KR101203017B1 KR 101203017 B1 KR101203017 B1 KR 101203017B1 KR 1020097000461 A KR1020097000461 A KR 1020097000461A KR 20097000461 A KR20097000461 A KR 20097000461A KR 101203017 B1 KR101203017 B1 KR 101203017B1
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- uncured adhesive
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- wiring board
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/325—Material
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- H—ELECTRICITY
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
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- H01L2924/01004—Beryllium [Be]
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- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
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- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Combinations Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JPJP-P-2007-137921 | 2007-05-24 | ||
JP2007137921 | 2007-05-24 | ||
PCT/JP2008/059666 WO2008146793A1 (ja) | 2007-05-24 | 2008-05-26 | 電気装置、接続方法及び接着フィルム |
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KR20090085017A KR20090085017A (ko) | 2009-08-06 |
KR101203017B1 true KR101203017B1 (ko) | 2012-11-20 |
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KR1020097000461A KR101203017B1 (ko) | 2007-05-24 | 2008-05-26 | 전기 장치, 접속 방법 및 접착 필름 |
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KR (1) | KR101203017B1 (xx) |
CN (1) | CN101681855B (xx) |
HK (1) | HK1139506A1 (xx) |
TW (2) | TWI422294B (xx) |
WO (2) | WO2008146793A1 (xx) |
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JP5608504B2 (ja) * | 2010-10-06 | 2014-10-15 | デクセリアルズ株式会社 | 接続方法及び接続構造体 |
KR101712043B1 (ko) * | 2010-10-14 | 2017-03-03 | 삼성전자주식회사 | 적층 반도체 패키지, 상기 적층 반도체 패키지를 포함하는 반도체 장치 및 상기 적층 반도체 패키지의 제조 방법 |
CN103828493A (zh) * | 2011-09-12 | 2014-05-28 | 名幸电子有限公司 | 元器件内置基板的制造方法及使用该制造方法的元器件内置基板 |
JP5926590B2 (ja) * | 2012-03-23 | 2016-05-25 | デクセリアルズ株式会社 | 接続体の製造方法、及び電子部品の接続方法 |
WO2014034102A1 (ja) * | 2012-09-03 | 2014-03-06 | シャープ株式会社 | 表示装置及びその製造方法 |
JP6307308B2 (ja) * | 2014-03-06 | 2018-04-04 | デクセリアルズ株式会社 | 接続構造体の製造方法、及び回路接続材料 |
JP6241326B2 (ja) * | 2014-03-07 | 2017-12-06 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
JP2016001574A (ja) * | 2014-06-12 | 2016-01-07 | 株式会社デンソー | ラミネート外装電池 |
JP6759578B2 (ja) * | 2014-12-22 | 2020-09-23 | デクセリアルズ株式会社 | 異方導電性フィルム及び接続構造体 |
US11667817B2 (en) * | 2016-10-03 | 2023-06-06 | Showa Denko Materials Co., Ltd. | Electroconductive film, roll, connected structure, and process for producing connected structure |
TWI763750B (zh) * | 2016-12-01 | 2022-05-11 | 日商迪睿合股份有限公司 | 異向性導電膜 |
WO2018101108A1 (ja) * | 2016-12-01 | 2018-06-07 | デクセリアルズ株式会社 | 異方性導電フィルム |
KR102066934B1 (ko) * | 2018-07-11 | 2020-01-16 | 주식회사 비에이치 | Pen fpcb를 이용한 접합 방법 및 이를 이용해 제조된 대면적 pen fpcb 조립체 |
TWI724911B (zh) * | 2020-05-26 | 2021-04-11 | 友達光電股份有限公司 | 發光裝置及其製造方法 |
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KR100780956B1 (ko) | 2006-08-17 | 2007-12-03 | 삼성전자주식회사 | 이종 언더필 반도체 패키지 및 그의 제조 방법 |
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JP2830681B2 (ja) * | 1993-03-08 | 1998-12-02 | ソニーケミカル株式会社 | Icチップ実装方法 |
JP3225800B2 (ja) * | 1995-08-09 | 2001-11-05 | 三菱電機株式会社 | 半導体装置 |
JP2891184B2 (ja) * | 1996-06-13 | 1999-05-17 | 日本電気株式会社 | 半導体装置及びその製造方法 |
JP4030220B2 (ja) * | 1998-04-07 | 2008-01-09 | 新光電気工業株式会社 | 半導体チップの実装構造 |
JP3506003B2 (ja) * | 1998-05-19 | 2004-03-15 | ソニーケミカル株式会社 | 異方性導電接着材 |
MY124944A (en) * | 2000-02-09 | 2006-07-31 | Hitachi Chemical Co Ltd | Resin composition, adhesives prepared therewith for bonding circuit members,and circuits boards |
JP2003086633A (ja) * | 2001-09-13 | 2003-03-20 | Canon Inc | 配線基板及びこれを備えた表示装置 |
JP2004071857A (ja) * | 2002-08-07 | 2004-03-04 | Sharp Corp | 基板接続部の構造、並びに該構造を有する電子部品及び液晶表示装置 |
JP5076292B2 (ja) * | 2005-08-08 | 2012-11-21 | パナソニック株式会社 | 異方導電膜貼付装置及び方法 |
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JP2009004768A (ja) | 2009-01-08 |
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