TW200850094A - Electric device, connecting method and adhesive film - Google Patents

Electric device, connecting method and adhesive film Download PDF

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Publication number
TW200850094A
TW200850094A TW097119331A TW97119331A TW200850094A TW 200850094 A TW200850094 A TW 200850094A TW 097119331 A TW097119331 A TW 097119331A TW 97119331 A TW97119331 A TW 97119331A TW 200850094 A TW200850094 A TW 200850094A
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TW
Taiwan
Prior art keywords
connection
film
terminal
adhesive layer
layer
Prior art date
Application number
TW097119331A
Other languages
Chinese (zh)
Other versions
TWI422294B (en
Inventor
Misao Konishi
Original Assignee
Sony Chem & Inf Device Corp
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Publication date
Application filed by Sony Chem & Inf Device Corp filed Critical Sony Chem & Inf Device Corp
Publication of TW200850094A publication Critical patent/TW200850094A/en
Application granted granted Critical
Publication of TWI422294B publication Critical patent/TWI422294B/en

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
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    • H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
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    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
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    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

An electric device (40) is provided with land sections (63, 64) arranged on a wiring board (60); and connecting sections (41, 42), which have connecting terminals (67, 68) of the electric component (65) facing each other and are electrically connected by conductive particles (59) of an anisotropic conductive adhesive agent. The electric device is provided with, as connecting sections, the first connecting section (41), and the second connecting section (42), which has a conductive particle content rate smaller than that of the first connecting section.

Description

200850094 九、發明說明： 【發明所屬之技術領域】 本發明關於一種電氣零件與半導體元件之連接方法。 【先前技術】 自以往’為了將如半導體元件之電氣零件連接於配線 二板上係一直使用黏合樹脂中分散有導電性粒子的異向 導電性接著劑。 ^右°兒明用以連接電氣零件與配線基板之步驟一例，則 係以配線基板與電氣零件夾持異向導f性接著劑，然後加 ^ 藉此以電氣零件之連接端子的前端部分、及配 、^基，之平台（land)部分夾持導電性粒子，且將黏合樹脂 接加以壓塗，而將電氣零件電連接於配線基板。 —當接著劑具有熱硬化性時，在進行上述抵壓時，係進 …抵[，使接著劑熱硬化，而將電氣零件固定於配線 :板以此方式’若使用異向導電性接著劑，則可將電氣 令件電連接且機械連接於配線基板上。 ^兩近年來，隨著半導體元件之成本降低、細間距化、電 件本身之乍框化等，半導體元件之狹長化持續發展， ::在半導體元件之前端部分面積小的情形，由於該前端 平σ部分夾持有導電性粒子的機率降低，故連接端 子與平台部分容易發生導通不良。 相對於&，若提高異向㈣性接著劑所含有之導電性 /的含有率，雖然可提高連接端子與平台部分炎持有導 5 200850094 電性粒子的機率，但是亦會提 成本。 高異向導電性接著劑的製造 > 口此以習知技術難以在抑制成本下製造導通可靠度 咼的電氣裝置。 【發明内容】 f 本^月係為了解決上述習知技術之不良情形所完成 其目的在於以低成本提供一種具備有導通可靠度高之 連接的电乳裝置，且提供一種連接方法及該連接方法所使 用之接著膜。 為了解決上述課題，本發明提供一種電氣裝置，其具 有配置在配線基板上之平台部分、與電氣零件之連接端子 互相對向’且藉由異向導電性接著劑之導電性粒子電連接 之連接部分，該連接部分具有第一連接部分及導電性粒子 含有率少於第一連接部分之第二連接部分。 “又，本發明提供-種使用於製造上述電氣裝置之接著 :係將3有$電性粒子之第i異向導電性接著劑層、及 導電性粒子之含有率低於第】異向導電性接著劑層之第2 異向導電性接著劑層設置於帶狀剝離膜上的不同位置。 並且’本發明提供一種使用於製造上述電氣裝置之連 接方法，係透過異向導電性接著劑層將配置於配線基板上 之平台部分、及電氣零件之連接端子對向配置，然後對配 7板與電氣零件之其中一者或兩者進行抵厂聖，而將配線 土板之平台部分及電氣零件之連接端子加以電連接，使得 6 200850094 在第1連接端子、及與該第1連接端子相對向配置之平二 ==異向導電性接著劑層的導電性粒子含有率“ 在弟2連接端子、及與該第2連接端子相對向配置 部分之㈣異向導電性接著劑層料電性粒子含有率。口 本發明之電氣裝置，係藉由導 不同之第i、帛2連接邱… 粒子之含有率彼此 / 2連接#’來將f氣零件連接於配線基 板。故於電機零件之連接端子的連接面積有大小時，由於 f =導電性粒子含有率高的帛1連接部分，將連接面積小 :弟1連接端子加以連接在所對應的平台 :㈣：靠度。又’由於可以導電性粒子含有率低的第2 接h ’將連接面積小的帛2連接端子加以連接 應的平台，因此可降低導電性 ， 所需之成本。 +的使用里，可抑制連接 又，根據本發明之連接方法，即可製造本發明之 =行根據本發明之接著膜，即可使本發明之連接方二 【實施方式】 各圖中，相同 例的俯視圖， 以下，根據圖式具體說明本發明。另 符號係表示相同或相等的構成要素。 圖1 ( a )係顯示本發明之接著膜5 〇之 同圖（b)則是顯示其b_b剖線之剖面圖 200850094 作為m電性接著劑層52，係以相同種類之黏合樹脂56 的为’並將導電性粒子59之含有率（重量％)不 異向導電性接著劑層，亦即，將導電性粒子59 之率㈣第1接著部55、及導電性粒子59之 低於第1接著部55的第 jZ按者邵5 8没置在不同位置。 合樹脂56’ ▼使用環氧樹脂、三聚氛胺樹脂、 尿素樹脂等各種熱硬化性樹脂，此等樹脂可單獨 或 合2種以上使用。 又’黏合樹脂56所使用之樹脂並非限定於以埶硬化性 樹脂為主成分者，介叮*丄 f 々 亦可為在熱硬化性樹脂中添加有熱可塑 性樹脂等其他樹脂者，又， …、 藉由紫外線、可見光等之/ 光硬化性樹脂（係 見先專之光照射使其硬化）為主成分者。 種以導電性粒子59,可使其含有單獨-種或兩200850094 IX. Description of the Invention: [Technical Field] The present invention relates to a method of connecting an electrical component to a semiconductor component. [Prior Art] Conventionally, in order to connect an electrical component such as a semiconductor element to a wiring board, an anisotropic conductive adhesive in which conductive particles are dispersed in an adhesive resin has been used. ^An example of the procedure for connecting an electric component and a wiring board is to hold a front-end portion of the connection terminal of the electric component with the wiring substrate and the electric component. The conductive layer is sandwiched between the land portion and the land portion, and the adhesive resin is bonded to the wiring substrate to electrically connect the electrical component to the wiring substrate. - When the adhesive has thermosetting properties, when the above-mentioned pressing is performed, the bonding is performed, and the adhesive is thermally cured, and the electrical component is fixed to the wiring: the board is in this manner, if an anisotropic conductive adhesive is used. The electrical component can be electrically and mechanically connected to the wiring substrate. In recent years, with the reduction of the cost of semiconductor components, the fine pitch, the squaring of the components themselves, and the like, the narrowing of semiconductor components has continued to develop, :: in the case where the area of the front end portion of the semiconductor component is small, due to the front end The probability that the flat σ portion is sandwiched with the conductive particles is lowered, so that the connection terminal and the land portion are likely to cause conduction failure. Compared with &, if the conductivity/content ratio contained in the anisotropic (tetra) adhesive is increased, the probability of connecting the terminal and the platform portion can be increased, but the cost is also increased. Manufacture of a highly anisotropic conductive adhesive > It is difficult to manufacture an electrical device having a conduction reliability 在 under a cost reduction by a conventional technique. SUMMARY OF THE INVENTION The present invention aims to solve the above-mentioned problems of the prior art, and aims to provide an electric milk device having a connection with high conduction reliability at a low cost, and to provide a connection method and the connection method The adhesive film used. In order to solve the above problems, the present invention provides an electric device having a platform portion disposed on a wiring substrate, and a connection terminal of an electric component facing each other and electrically connected by conductive particles of an anisotropic conductive adhesive. In part, the connecting portion has a first connecting portion and a second connecting portion having a conductive particle content lower than that of the first connecting portion. Further, the present invention provides a method for producing the above-mentioned electric device: a third-phase anisotropic conductive adhesive layer having 3 electric particles and a content ratio of the conductive particles being lower than the first conductive material The second anisotropic conductive adhesive layer of the adhesive layer is disposed at different positions on the strip-shaped release film. And the present invention provides a connection method for manufacturing the above-described electrical device, which is through an anisotropic conductive adhesive layer. The platform portion disposed on the wiring substrate and the connection terminal of the electrical component are disposed opposite to each other, and then one or both of the 7-plate and the electrical component are placed in the factory, and the platform portion and the electrical part of the wiring earth plate are electrically connected. The connection terminals of the components are electrically connected so that 6 200850094 is connected to the first connection terminal and the first connection terminal, and the conductive particle content rate of the anisotropic conductive adhesive layer is "connected" The (four) anisotropic conductive adhesive layer electrical particle content ratio of the terminal and the arrangement portion facing the second connection terminal. The electric device of the present invention is connected to the wiring board by a different ratio of the i-th, 帛2, and the content ratio of the particles / 2 to #'. Therefore, when the connection area of the connection terminals of the motor parts is large, the connection area is small because f = the connection portion of the 帛1 having a high conductivity particle content: the connection terminal of the brother 1 is connected to the corresponding platform: (4): . Further, since the second connection h' having a low conductivity of the conductive particles can be used to connect the 帛2 connection terminals having a small connection area, the conductivity and the required cost can be reduced. In the use of +, the connection can be suppressed, and according to the connection method of the present invention, the bonding film according to the present invention can be manufactured, and the connecting method of the present invention can be made. In the top view of the example, the present invention will be specifically described below based on the drawings. The other symbols represent the same or equivalent constituent elements. Figure 1 (a) shows the same film of the present invention, Figure 5 (b) shows a cross-sectional view of the b_b line, 200850094, as the m electrical adhesive layer 52, which is made of the same type of adhesive resin 56. 'The content rate (% by weight) of the conductive particles 59 is not the same as the conductive adhesive layer, that is, the ratio of the conductive particles 59 (four) the first rear portion 55 and the conductive particles 59 are lower than the first The jZ player Shao 58 of the subsequent portion 55 is not placed at a different position. In the resin 56', various thermosetting resins such as an epoxy resin, a trimeric amine resin, and a urea resin are used, and these resins may be used alone or in combination of two or more. Further, the resin used in the adhesive resin 56 is not limited to those having a bismuth-curable resin as a main component, and the other resin such as a thermoplastic resin may be added to the thermosetting resin, ... It is mainly composed of ultraviolet light, visible light, etc., or a photocurable resin (which is cured by light irradiation). Conductive particles 59 can be made to contain one type or two

Hit?在樹脂粒子表面形成有金屬被膜層 弟2接者部55、58所含有之導電性粒子的種 颂可彼此相同或不同，又，第！、第2接著部Μ、π所含 有之W 1±粒子59的含有率，係使其根據導電性粒子π :粒=用此接著膜5。所欲連接之電氣零件之配線端 子、或配線基板之平台面積、間距等而彼此不同。 又，形成於剥離臈51上之第卜第2接著部55、58 之膜厚，並無特別限制，盔 + 著於配線基板之電Μ❹^貫接著膜5〇將待接 心，以上卿I:;件固疋在配線基板，該膜厚較佳在 第1、第2接著部55、58，分別係以小於剥離膜51之 200850094 見度的見度形成為帶狀。又，係沿著剝離膜51之一方側 緣部設置第1接著部55，另沿著剝離膜5丨之另一方側緣 設置第2接著部5 8。 另一方面，圖3 ( a )係顯示以接著膜5〇所連接之配 線基板60之一例。此配線基板60，具有基板本體61、及 设置在基板本體61之一面上不同區域的第1、第2平台部Hit? The metal film layer is formed on the surface of the resin particles. The types of conductive particles contained in the second and second contacts 55 and 58 may be the same or different from each other. The content ratio of the W 1±particles 59 contained in the second and second Μ and π is based on the conductive particles π: granules = the film 5 is used. The wiring terminals of the electrical components to be connected, or the land area, pitch, and the like of the wiring substrate are different from each other. Further, the film thickness of the second and second second portions 55 and 58 formed on the peeling crucible 51 is not particularly limited, and the helmet + the electrode on the wiring substrate is to be connected to the film 5〇. The material is fixed to the wiring board, and the film thickness is preferably formed in a strip shape in the first and second rear portions 55 and 58 which are smaller than the visibility of the peeling film 51 of 200850094. Further, the first rear portion 55 is provided along one side edge portion of the release film 51, and the second rear portion 58 is provided along the other side edge of the release film 5''. On the other hand, Fig. 3 (a) shows an example of the wiring board 60 to which the film 5 is attached. The wiring board 60 has a substrate body 61 and first and second platform portions provided in different regions on one surface of the substrate body 61.

7刀63、64。第1平台部分63之表面面積大於第2平台部 分64之表面面積 又’第1、第2平台部分63、64係分別配置排列成直 、、泉狀，第1平台部分63之配置排列間距小於第2平台部 分64之配置排列間距。 圖2係顯示連接於配線基板6〇之電氣零件“之一例。 此兒乳零件65具有細長之零件本體66、及設置於零件本 體66之一面的第1、第2連接端子67、68。 另，於本發明中，電氣零件並不限定於半導體元件， =可使用各種物品。又，_ f氣零件上設置有複數個連接 端I之連接區域的數目，可為1個或複數個，因此在一電 孔衣置中，電氣零件與配線基板之連接區域的個數可為1 個或複數個。 ^弟1、第2連接端子67、68，係分別對應於上述電氣 二65之第1、第2平台部分63、64，第J連接端子 :前端部分53的面積小於第2連接端子68之前端部分54 的面積（圖6 ( b))。 將此電機零件65連接於上述配線基板60之方法，首 9 200850094 先’係將配線基板60設置在壓合台（未圖示），使配線 基板60之第1、第2平台部分63、64的配置排列方向、 及接著膜50的移動方向平行。 接著’使接著膜5 0移動於配線基板6 0上，使接著膜 5〇之第1、第2接著部55、58位於配線基板6〇之第1、 第2平台部分63、64上。然後，使用抵壓滾輪將接著膜5〇 壓接於配線基板60。藉此，將接著膜5〇之第1接著部55 接著於配線基板60之第1平台部分63上，接著膜50之 第2接著部58則接著於配線基板6〇之第2平台部分μ 接著，使用切斷機構，將接著膜5〇接著於配線基板6〇 之區域自其他區域予以分離。由於接著膜5〇之第丨、第2 2著部55、58與配線基板6〇之間的接著力大於此第i、 弟2接著部55、58與剝離膜51之間的接著力，因此若解 除接者膜50對配線基板6〇的抵壓，則接著於配線基板的 之接著膜50的區域將會自剝離膜5丨剝離，而使第1、第 2接著部55、58轉附於配線基板6〇 (圖6 (b))。 弟 又，將上述電氣零件65設置有第〗、第2連接端子π、 68之面朝向配線基板6〇側，以第}、第2連接端子π、6 與配線基板6 0之第1、第2平△部八a q , ^ 罘2干口邛分63、64相對向的方 式，將電氣零件65設置在配線基板6〇上。 藉此，使電氣零件65之第丨i車桩硿工〇 u +人 弟1連接糕子67的前端部分 53岔合於接著膜5〇的第1接著部55,電氣零件65之第2 連接端子68的前端部分54密合於接著膜5g的第2接著 200850094 部58。 接著’在此狀態下’對電氣零件65進行加熱抿壓。藉 加熱使異向導電性接著劑層52升溫，使黏合樹脂56軟化曰。 由於黏合樹脂56 —經軟化，第i、第2接著部55、58 則會具有流動性，因此，藉由抵壓可使第丨、第2連接端 子67、68的前端部分53、54將第工、第2接著部&二 推塗開，使其前端部分53、54接觸於第卜第2接著部55、 Γ 58中的導電性粒子59。 此處’當導電性粒子59的含有率為均_時，導電性粒 ^ 59接觸於第1連接端子67之前端部分53的機率，與 第=連接端子68之前端部分54的面積相較之下，雖然會 ，第1，接端子67之前端部分53的面積小而降低，但^ 第"妾著部55之導電性粒子59的含有率，由於較第2接 者:"8之導電性粒子59的含有率高，因此，不僅第2連 接端子68，導電性粒子59亦確實地接觸於第工連接 67之前端部分53。 亚且’右持續進行加熱抵壓，則第1、第2連接端子67、 68將會被壓著於望 ^ 0 ^ , A x 、弟、弟2千口口P为63、64，接觸於各前 端部分 53、54 7 的V黾性粒子59將會呈被夾持在第丨、 2連接端子67、命结· ! 咕 ”弟1、弟2平台部分63、64的狀態。 ^在此狀恶下，黏合樹脂56的聚合反應將會進行，而在 第^第^接著部55、58圍繞第1、第2連接端子67、68 14第2 $ 2平台部分63、64之周圍的狀態下硬化。 藉此如圖4及其C-C剖面之圖3 ( c )所示，可得到 200850094 第卜第2接著部55、58硬化後的電氣 法所得到之電氣裝置4。，具有高導通可;;置4°。以此方 粒子I:::高異向導電性接著劑層52全體之導電性 之導電性粒子59的HI成本提高’但是第2接著部58 全體之導電性位3 〃越低，異向導電性接著劑層52 本降低。子59的含有率就越低，因此可使製造成 圖4之符號43，係題干、查垃筮 第1平台部八“ > 係颂不連接弟1連接端子67與 刀63之第丨連接部分 同圖的符號44則是顯一… 在的弟1連接區域， 部分64之第”查”、、、不妾苐2連接端子68與第2平台 連接部分42所在的第2連接區域。 p於此電氣裝置4G中，例如，配線基板60之電氣替， 係從連接面積較大的筮？、击从 包風汛唬 ^ 、 的弟2連接部分42進入電氣零件25， @电汛唬經電魚裳杜 小 ^ 進仃處理後，則從連接面積較 弟、接部分4 1輸出至配線基板6〇。 同^本务明之接著膜5G中’導電性粒子之含有率彼此不 °、弟第2接著部55、58的設置，並不限於上述之例， 士亦可如圖5所示之接著膜70般來設置。 二圖5 (〇係顯示接著膜70之平面圖，圖5 (b)則顯 圖5 ( &)之D'D切線剖面圖。此接著膜70具有帶狀之 離膜71、及設於剝離膜71表面的異向導電性接著劑層 ^於圖5中’異向導電性接著劑I 72 |別係由與圖1 第1帛2接著部55、58相同，其導電性粒子之含有率 不同的弗1、帛2接著部75、78所構成，第"妾著部75 200850094 之導電性粒子的含有率高於第2接著部Μ。又，第！ 邛75與第2接著部78係交互重複於帶狀之接著臈7〇之 長邊方向。 圖5 ( a )之崖線係顯示可使用此接著冑進行較佳 接口之电氣令件65之連接面的大小。此電氣零件μ，士 圖2所示，係分別將前端部分之面積較小的第i連接端^ H 前端部分之面積較大的第2連接端子“配 …+ (a)所不’接著膜70之寬度係稍大於 -电料件65之連接面長邊的長度，而第ι、第2接著部7卜 ’亦^微大於電氣零件65之連接面短邊的 u ’且W 1、第2接著部75、78構成連接單位乃。 因此’若❹钱接單幻9之接著膜7q將電氣 以5曾與配線基板與前述相同地加以對向設置並連接時，則可 性粒子之含有率較高的第1接著部75來確實連接 接 引鲕邛刀之面積較小的第i連 要而子07，並可抑制成本以導電性 2接著部78來確實連接前端 ^率較低的第 子68。 刀之面積&大的第2連接端 本發明之接著膜，第i、第2接著部5 ，限制，例如，亦可如圖6所示之電 的1亚 '二65以對角線分半的區域，分別設置導電 的第2:，：的第1接著部85、及導電性粒子含有率低 接者部88，以作為接著膜之異向 ^，形成連接接者劑層 受挪十興干台部分的第i 13 200850094 連接區域43b、及連接前端面積較大之連接端子與平台部 分的第2連接區域44b，藉此，將電氣零件65b連接於配 線基板60b。 於本發明中，亦可以導電性粒子含有率不同之3個以 上的接著部分來構成未硬化接著劑層，又，如連接端子為 焊料凸塊之情形’當期待藉由加熱抵壓以金屬結合連接端 子與平台部分時，亦可以導電性粒子之含有率為零的接著 邛分來構成未硬化接著劑層的一部份或全部。 —並且’於本發明之連接方法中，亦可將第卜第2之 接著部55、58設置在不同的剝離膜51 i，使形成有第卜 第2接著部55、58之剝離膜51分別移動於配線基板60 上’將弟1、第2接著部 ^ 5 8 k不同的剝離膜5丨上 附於相同的配線基板6〇。 :，在將異向導電性接著劑層52設置於配線基板6〇 上之弟1、第2平台部分63、64與電機零件65之第卜 = '連接端子67、68間進行連接時，亦可先將異向導電 性接者劑層52轉附於 深基板6G後，再將異向導電性接 者劑層52與電機零件65加以宓人 向導電性接著劑層52轉附於電々J株 5疋先將異 杯⑽. 電礼零件65後，再將配線基 板6〇與異向導電性接著劑層52加以密合並連接。 方法又:广1、弟2接著部55、58設置於配線基板60之 二Λ如，'可準備導電性粒子之含有率彼此不同之糊 之第二弟2異向導電性接著劑，將導電性粒子含量不同 弟2異向導電性接著劑塗布於配線基板6 0與電氣 14 200850094 零件65的政φ ^ 5 5、5 8，作 適用於需同 ” Τ ~方，形成第1、第2接著部 成異向導電性接著劑層52。 [產業利用性] 日士、本&明之連接膜、連接方法及電氣袭置， ^進仃電連接與機械連接之各種電氣裝置。 【圖式簡單說明】 f …，V D 著膜之俯視圖及其4 係分別用以說明本發明 圖。 所使用之接 圖2 圖3 與電氣裝 圖4 圖5 其剖面圖 ’係說明本發明所使用之電氣零件之俯視圖。 (a )〜（C )，係說明藉由本發明，將配線基板 置加以連接之步驟的剖面圖。 係祝明第2發明之電氣裝置一例的俯視圖。 (a )，（ b )，係說明本發明之接著膜之俯視圖及7 knives 63, 64. The surface area of the first platform portion 63 is larger than the surface area of the second platform portion 64. The first and second platform portions 63 and 64 are arranged in a straight, spring shape, respectively, and the arrangement pitch of the first platform portion 63 is smaller than The arrangement of the second platform portion 64 is arranged in a pitch. 2 shows an example of an electric component connected to the wiring board 6 . The milk component 65 has an elongated component body 66 and first and second connection terminals 67 and 68 provided on one surface of the component body 66. In the present invention, the electrical component is not limited to the semiconductor component, and various items may be used. Further, the number of connection regions in which the plurality of connection terminals I are provided on the _f gas component may be one or plural, In an electric hole clothing, the number of connection areas of the electric component and the wiring substrate may be one or plural. ^1, the second connection terminals 67, 68 correspond to the first of the electric two 65, respectively. The second platform portion 63, 64, the Jth connection terminal: the area of the front end portion 53 is smaller than the area of the front end portion 54 of the second connection terminal 68 (Fig. 6 (b)). The motor part 65 is connected to the above wiring substrate 60. First, the first 9 200850094 firstly sets the wiring board 60 on a press stand (not shown), and arranges the arrangement direction of the first and second land portions 63 and 64 of the wiring board 60 and the movement of the film 50. The direction is parallel. Then 'move the film 5 0 to On the wire substrate 60, the first and second end portions 55 and 58 of the bonding film 5 are placed on the first and second land portions 63 and 64 of the wiring board 6A. Then, the bonding film 5 is used using the pressing roller. The first bonding portion 55 of the bonding film 5 is next to the first land portion 63 of the wiring substrate 60, and then the second bonding portion 58 of the film 50 is next to the wiring substrate 6. The second platform portion μ of the crucible Next, the second film is separated from the other regions by the cutting mechanism by the cutting mechanism. The second film of the film 5 is followed by the second and second portions 55 and 58. The adhesion force between the wiring board 6 〇 and the wiring board 6 大于 is larger than the adhesion force between the ith and second bonding portions 55 and 58 and the peeling film 51. Therefore, when the contact film 50 is released from the wiring substrate 6 ,, the subsequent pressing is performed. The region of the bonding film 50 on the wiring board is peeled off from the peeling film 5, and the first and second rear portions 55 and 58 are transferred to the wiring substrate 6 (Fig. 6 (b)). The electric component 65 is provided with the first and second connection terminals π and 68 facing the wiring board 6 , side, and the second and second connection terminals π and 6 The electric component 65 is placed on the wiring board 6 方式 so that the first and second flat Δ portions 8 aq , ^ 罘 2 dry ports 63 and 64 of the wiring board 60 are opposed to each other. The first end portion 53 of the connecting cake 67 is coupled to the first end portion 55 of the bonding film 5A, and the front end portion 54 of the second connection terminal 68 of the electric component 65 is densely bonded. The second and subsequent 200850094 portions 58 of the bonding film 5g are bonded. Next, the electric component 65 is heated and pressed in this state. The anisotropic conductive adhesive layer 52 is heated by heating to soften the bonding resin 56. Since the adhesive resin 56 is softened, the i-th and second-side portions 55 and 58 have fluidity. Therefore, the front end portions 53, 54 of the second and second connection terminals 67 and 68 can be made to be pressed by the pressing. The second rear portion and the second push portion are spread, and the front end portions 53, 54 are brought into contact with the conductive particles 59 in the second and second rear portions 55 and 58. Here, when the content rate of the conductive particles 59 is _, the probability that the conductive particles 59 are in contact with the front end portion 53 of the first connection terminal 67 is compared with the area of the front end portion 54 of the second connection terminal 68. In the first place, the area of the front end portion 53 of the terminal 67 is small and decreases, but the content of the conductive particles 59 of the second portion is lower than the second one: "8 Since the content of the conductive particles 59 is high, not only the second connection terminal 68 but also the conductive particles 59 are surely brought into contact with the front end portion 53 of the first connection 67. Ya and 'the right continuous heating pressure, the first and second connecting terminals 67, 68 will be pressed against Wang ^ 0 ^, A x, brother, brother 2 thousand mouth P is 63, 64, in contact with The V-shaped particles 59 of the front end portions 53, 54 7 will be held in the state of the second, second connection terminal 67, the knot, the brother, the brother 2, the platform portions 63, 64. In the case of the discoloration, the polymerization reaction of the adhesive resin 56 proceeds, and the state around the second and second connection terminals 67, 58 around the second and second connection terminals 67, 68 As shown in Fig. 4 and Fig. 3 (c) of the CC cross section, the electric device 4 obtained by the electrical method after the hardening of the 200850094 second and second rear portions 55 and 58 can be obtained. The HI cost of the electrically conductive conductive particles 59 of the entire high-orientation conductive adhesive layer 52 is improved by the above-mentioned particle I::: The conductivity of the entire second bonding portion 58 is 3 〃 The lower the anisotropic conductive adhesive layer 52 is, the lower the content of the sub-59 is, so that it can be manufactured as the symbol 43 of Fig. 4, which is the first platform part of the head and the gt. The symbol 44 of the figure that is not connected to the connection terminal 67 of the brother 1 and the third connection portion of the knife 63 is obvious... In the connection area of the brother 1 , the "check", "," and "2" connections of the portion 64 The second connection region where the terminal 68 and the second platform connecting portion 42 are located. In the electric device 4G, for example, the electric wiring of the wiring board 60 is a large connection area. The second part connecting portion 42 of the typhoon ^, enters the electrical part 25, and the @电汛唬经电鱼裳杜小^ is processed, and the output is output from the connection area to the younger part, the connecting part 4 1 to the wiring. The substrate 6 is. In the film 5G of the present invention, the content of the conductive particles is not equal to each other, and the second second portions 55 and 58 are not limited to the above examples, and the film 70 may be as shown in FIG. Set it up. Fig. 5 (the lanthanum shows the plan view of the film 70, and Fig. 5(b) shows the D'D tangential section of Fig. 5 (the ampule). The film 70 has a strip-shaped film 71 and is provided for stripping. The anisotropic conductive adhesive layer on the surface of the film 71 is the same as the "opposite conductive adhesive I 72" in Fig. 5, and the content of the conductive particles is the same as that of the first and second portions 55 and 58 of Fig. 1 . The content of the conductive particles of the first and second portions 75 and 500 is higher than that of the second subsequent portion. Further, the first 邛75 and the second subsequent portion 78 are formed. The interaction is repeated in the direction of the long side of the strip. The cliff line of Figure 5 (a) shows the size of the joint of the electrical command 65 that can be used to make the preferred interface. μ, as shown in Fig. 2, the second connection terminal having a larger area of the front end portion of the i-th connection end H of the front end portion is respectively "fitted with + (a) not" followed by the width of the film 70 It is slightly larger than the length of the long side of the connecting surface of the electric material member 65, and the first and second rear portions 7b are also slightly larger than the short side of the connecting surface of the electric component 65, u' and W1, the second The subsequent portions 75 and 78 constitute a connection unit. Therefore, if the film 7q is connected to the wiring substrate in the same manner as described above, the content of the optional particles is set. The upper first rear portion 75 is surely connected to the ith connection 07 having a small area of the riving blade, and the cost can be suppressed by the conductivity 2 and the lower portion 78. Sub-68. The area of the knives & the second large connection end of the present invention, the i-th and the second splicing portion 5, the limitation, for example, may also be as shown in Fig. 6 In the region where the corner line is half-divided, the first and second conductive portions of the second and second conductive portions 85 and the conductive particle-containing low-capacity portion 88 are respectively provided as the connecting film of the adhesive film. The electric component 65b is connected to the wiring board 60b by the i i 13 200850094 connection area 43b of the Norwegian platform and the connection terminal having a large front end area and the second connection area 44b of the platform portion. In the invention, three or more subsequent portions having different conductivity particle content ratios may be used. The uncured adhesive layer is formed, and if the connection terminal is a solder bump, when it is desired to press the connection terminal and the land portion by the metal by heating, the content of the conductive particles may be zero. To form part or all of the uncured adhesive layer - and 'in the joining method of the present invention, the second and second portions 55, 58 of the second portion may be disposed on different peeling films 51 i to form The peeling film 51 of the second and second rear portions 55 and 58 is respectively moved on the wiring board 60. The peeling film 5 which is different from the second and second portions is attached to the same wiring substrate 6A. When the isotropic conductive adhesive layer 52 is placed on the wiring board 6A, the first and second platform portions 63 and 64 are connected to the motor component 65, and the connection terminals 67 and 68 of the motor component 65 are connected. After the anisotropic conductive interface layer 52 is transferred to the deep substrate 6G, the anisotropic conductive interface layer 52 and the motor component 65 are transferred to the conductive adhesive layer 52. After the electric gift part 65, the wiring board 6〇 and the anisotropic conductive adhesive layer 52 are closely connected and connected. In addition, the second and second sub-parts 55 and 58 are disposed on the wiring substrate 60, for example, 'the second electric 2 anisotropic conductive adhesive which can prepare a paste having different conductivity ratios of the conductive particles, and is electrically conductive. The difference in the content of the particles is 2, and the anisotropic conductive adhesive is applied to the wiring board 60 and the electric 14 200850094. The φ ^ 5 5, 5 8 of the part 65 is applied to the same "Τ", forming the first and second Next, the anisotropic conductive adhesive layer 52 is formed. [Industrial Applicability] Japanese, Ben &Ming; connection film, connection method, and electrical attack, various electrical devices for electrical connection and mechanical connection. BRIEF DESCRIPTION OF THE DRAWINGS f ..., VD film top view and its 4 series are used to illustrate the invention. Figure 2 is used and electrical assembly 4 Figure 5 is a sectional view of the electrical system used in the present invention (a) to (C) are sectional views showing a step of connecting the wiring board by the present invention. Fig. 1 is a plan view showing an example of the electric device of the second invention. (a), (b) Describes the top view of the adhesive film of the present invention and

圖 6 係說明本發明之電氣裝置之俯視圖。 [主要 40 41 42 43 44 50 元件符號說明 電氣裝置 第1連接部分 第2連接部分 第1連接區域 第2連接區域 接著膜 15 200850094 51 剝離膜 52 異向導電性接著劑層 55 第1接著部（異向導電性接著劑層） 56 黏合樹脂 58 第2接著部（異向導電性接著劑層） 59 導電性粒子 60 配線基板 61 基板本體 63 第1平台部分 64 第2平台部分 65 電氣零件 67 第1連接端子 68 第2連接端子 70 接著膜 71 剝離膜 72 異向導電性接著劑層 75 第1接著部 78 第2接著部 79 連接單位 80 電氣裝置 82b 異向導電性接著劑層 85 第1接著部 88 第2接著部 16Figure 6 is a plan view showing the electrical device of the present invention. [Main 40 41 42 43 44 50 Element Symbol Description Electrical Device First Connection Portion Second Connection Portion First Connection Region Second Connection Region Adhesion Film 15 200850094 51 Release Film 52 Anisotropic Conductive Adhesive Layer 55 First Subsequent ( Anisotropic conductive adhesive layer) 56 Adhesive resin 58 Second adhesive portion (isotropic conductive adhesive layer) 59 Conductive particles 60 Wiring substrate 61 Substrate body 63 First platform portion 64 Second platform portion 65 Electrical component 67 1 connection terminal 68 second connection terminal 70 next film 71 peeling film 72 anisotropic conductive adhesive layer 75 first rear portion 78 second rear portion 79 connection unit 80 electric device 82b anisotropic conductive adhesive layer 85 first Part 88 second follower 16

Claims (1)

200850094 十、申請專利範圍： h 一種電氣裝置，具有#罢μ 及命与兩从 °又置於配線基板上之平么邱八 :"牛之連接端子彼此對向而 厂刀、 *電性粒子電連接之連接部分；該 ^電性接著劑之 部分、及導電性粒子之含有率小於第/刀接:有第1連接 接部分。 、 連接部分的第2連 2.如申請專利範圍帛 接部分之連接端子前姓郝、电孔衣置，其中，第丨連 逻接知子則知部分的面積 接端子前端部分的面積。 、、 連接部分之連 3·—種接著膜，其含有導電性粒子之 接著劑層、及導電性粒子之含 〃向導電性 著劑層的第2 1 ；第1異向導電性接 J曰w 2異向導電性接著劑層 上不同的位置。 、°又置在Y狀剝離膜 *4.如申請專利範圍第3項之接著膜，其 V電性接著劑層、及第 弟1 /、向 膜之長邊方向設置。接著劑層係沿著剝離 5=申請專利範圍第3項之接著膜， 電性接著劑層構成對應於以接著膜所連接之電二 件大小之長度的連接單位， I 的長邊方向。 早位配置排列在剝離膜 6· —種連接方法，#类 置於配線基板上之平4 = 接著劑層，將設 對向設置，對配線基板與電接而子予以 抵塵，而將配令一者或兩者進行 線基板之平台部分及電氣零件之連接端子加 17 200850094 使…1連接端子、及與該第〗連 置之平台部分之間的異向導電性接著劑層的導電:己 有率’高於在第2連接料、及與㈣ ^子含 配置之平台部分之間的異向導電性接著句=子相對向 含有率。 …接者劑層的導電性粒子 ，第1連 端部分的 7·如申請專利範圍帛6項之連接方法，其中 接端子之丽端部分的面積小於第2連接端子之前 面積。 8·如申請專利範圍第“戈7項之連接方法，其 申請專利範圍第…項中任一項之接著膜移動於配線基 板上’將接著膜之第i、第2異向導電性接著劑層轉附於 配線基板，藉此將第卜第2異向導電性接著劑層設置在 配線基板上。 9·如申請專利範圍第7項之連接方法，其中，係使用 申凊專利乾圍第5項之接著膜，按各連接單位將第丨、第 2異向導電性接著劑層轉附於配線基板上。 十一、圖式： 如次頁 18200850094 X. Patent application scope: h An electrical device with # μμ and life and two slaves placed on the wiring substrate. Qiu Ba: " cattle connection terminals are opposite each other and the factory knife, *electricity The connecting portion of the particles is electrically connected; the portion of the electroconductive adhesive and the content of the conductive particles are smaller than the first knife-joining: there is a first connecting portion. The second connection of the connection part 2. If the connection terminal of the connection part of the patent application range is surnamed Hao and the electric hole clothing, the area of the first part of the connection terminal is the area of the front end part of the terminal. And a bonding film of the connecting portion, comprising an adhesive layer of conductive particles and a second conductive conductive layer of the conductive particles; the first anisotropic conductive connection w 2 different positions on the anisotropic conductive adhesive layer. And a Y-like release film is also placed in the film. *4. The adhesive film of the third item of the patent application, the V-electrode adhesive layer, and the first brother 1 / are disposed in the longitudinal direction of the film. The subsequent layer is along the peeling film of the peeling 5 = the third item of the patent application, and the electrical adhesive layer is formed to correspond to the length of the connecting unit of the length of the electric piece to which the film is connected, and the longitudinal direction of I. The early position is arranged in the peeling film 6 - a kind of connection method, the # type is placed on the wiring board, the flat 4 = the next layer, and the opposite side is placed, and the wiring board and the electric connection are grounded, and the matching is performed. One or both of the base plate portion of the wire substrate and the connection terminal of the electrical component are added 17 200850094 to make the conduction of the anisotropic conductive adhesive layer between the ... 1 connection terminal and the platform portion connected to the first: The rate of occurrence 'is higher than the isotropic conductivity between the second binder and the platform portion of the (four)^sub-configuration, followed by the sub-relative ratio. The conductive particles of the carrier layer, and the connection method of the first terminal portion, as described in claim 6, wherein the area of the terminal portion of the terminal is smaller than the area before the second terminal. 8. The i-th and second anisotropic conductive adhesives of the film are attached to the film according to the method of "the connection method of the 7th item of the application of the patent range" The layer is transferred to the wiring substrate, whereby the second epitaxial conductive adhesive layer is provided on the wiring substrate. 9* The connection method of claim 7 is used for the application of the patent pending In the five-layer bonding film, the second and second anisotropic conductive adhesive layers are transferred to the wiring substrate for each connection unit. XI. Schema:
TW097119331A 2007-05-24 2008-05-26 Electrical device, connection method and subsequent film TWI422294B (en)

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