KR102066934B1 - Bonding Method Using Polyethylenenaphthalate Flexible Printed Circuit Board and Large Polyethylenenaphthalate Flexible Printed Circuit Board Assembly Manufactured from the Same - Google Patents

Abstract

The present invention relates to a method for manufacturing a large flexible printed circuit board (FPCB) and, more specifically, to a bonding method using a polyethylene naphthalate (PEN) FPCB to manufacture a large FPCB by bonding a plurality of FPCBs through an adhesive member including conductive particles, and a large PEN FPCB assembly manufactured by using the same. The large PEN FPCB comprises: a first circuit board; a second circuit board; and a conductive adhesive means.

Description

Bonding Method Using Polyethylenenaphthalate Flexible Printed Circuit Board Assembly and Large Polyethylenenaphthalate Flexible Printed Circuit Board Assembly Manufactured from the Same

The present invention relates to a method for manufacturing a large-area flexible printed circuit board, and more particularly, to a PEN for manufacturing a large-area flexible printed circuit board by bonding a plurality of flexible printed circuit boards through an adhesive member containing conductive particles. A bonding method using FPCB and a large area PEN FPCB assembly manufactured using the same.

Flexible printed circuit boards (FPCBs) are flexible printed circuit boards, and a plurality of subsidiary materials (COVERLAY, SHIELD STIFFENER, KAPTON, SUS, etc.) are attached to form a single product. Recently, flexible printed circuit boards are also used as main boards such as mobile communication terminals, and embedded chips are used directly in flexible printed circuit boards, and are used as circuits of bent portions in portable mobile communication terminals.

For this reason, flexible circuit boards require high-level specifications such as high speed, high performance, high frequency, small size and light weight, in line with the rapid growth of the electronics and telecommunications industry. Due to the high functionalization, various requirements such as mechanical strength and high density are increasing.

Recently, polyethylene naphthalate (PEN) film has been spotlighted as a material for flexible circuit boards in order to satisfy these requirements, and has an advantage of excellent mechanical and thermal chemical properties compared to polyethylene terephthalate (PET) film.

Meanwhile, FPCB is applied to modules of secondary battery battery cells, and secondary batteries for driving hybrid vehicles or electric vehicles require large-capacity and high-capacity battery cells, and demand for large-area FPCBs having a length of 500 mm or more is increasing. The trend is increasing.

However, the existing FPCB manufacturing equipment, there is a limitation in manufacturing a large area FPCB, so in order to manufacture a large area FPCB of 500 mm or more in length, there is a problem in that a cost or time investment loss occurs accordingly.

Korean Patent Publication No. 10-2017-0133040 (published Dec. 5, 2017)

The present invention has been made to solve the above problems, an object of the present invention, by bonding a plurality of FPCB in the width direction by using an adhesive member containing a conductive particle in a large area of 500mm or more using a general FPCB manufacturing equipment It is to provide a bonding method using a PEN FPCB, and a large area PEN FPCB assembly manufactured using the same, which can produce an FPCB.

Furthermore, the present invention provides a bonding method using a PEN FPCB capable of bonding not only FPCB and FPCB but also PCB and FPCB, PCB or FPCB and FFC, and a large-area PEN FPCB assembly manufactured using the same.

In the large-area PEN FPCB assembly according to an embodiment of the present invention, a circuit pattern is formed, and a plurality of first substrates having a first junction part formed on one side thereof and electrically connected to the circuit pattern exposed to the first junction part. A first circuit board including a first terminal of a second circuit board having a circuit pattern formed thereon, the second substrate having a second junction portion at the other side of the other surface to be bonded to the first junction portion, and being electrically connected to the circuit pattern; A second circuit board including a plurality of second terminals exposed to the second circuit board; And bonding means made of an adhesive material to physically bond the first and second junctions, and a conductive material electrically connecting the first and second terminals when the first and second junctions are joined. Conductive bonding means comprising conductive particles; It includes.

A large area PEN FPCB assembly according to another embodiment of the present invention may include a first substrate having a circuit pattern formed thereon, and having a first junction formed on one side thereof, and a plurality of electrically connected to the circuit pattern exposed to the first junction. A first circuit board comprising a first terminal of the first circuit board; A cable having a plurality of third terminals at one end thereof and having a plurality of fourth terminals exposed at the other end thereof; And an adhesive means made of an adhesive material to physically bond the first junction part and the third terminal, and a conductive material electrically connecting the first terminal and the third terminal when the first junction part and the third terminal are joined. Conductive bonding means comprising conductive particles; It includes.

In this case, a plurality of the conductive particles are evenly distributed in the bonding means, and the conductive particles maintain the conductive state in the joining direction of the first and second circuit boards by pressing the first terminal and the second terminal. In addition, in the plane direction of the first and second circuit boards, the insulating state is maintained.

In addition, a plurality of the conductive particles are evenly distributed in the bonding means, and the conductive particles maintain a conductive state in the joining direction of the first circuit and the cable by pressurization of the first terminal and the third terminal. In the surface direction of the first circuit and the cable, it is spaced apart from each other to maintain an insulating state.

In addition, a plurality of the conductive particles are evenly distributed in the bonding means, the first conductive particles disposed between the pair of first terminals and the second terminals corresponding to each other, and the second conductive particles disposed in the remaining portions. The first conductive particles are in close contact with the pair of the first terminal and the second terminal to electrically connect the first terminal and the second terminal, and the second conductive particles are spaced apart from each other. The first terminal and the second terminal except for the first terminal and the second terminal is characterized in that the insulating state is maintained.

In addition, a plurality of the conductive particles are evenly distributed in the bonding means, the first conductive particles disposed between the pair of first terminals and the third terminals corresponding to each other, and the second conductive particles disposed in the remaining portions. The first conductive particles are in close contact with the pair of the first terminal and the third terminal to electrically connect the first terminal and the third terminal, and the second conductive particles are spaced apart from each other. The first terminal and the third terminal except for the first terminal and the third terminal is characterized in that the insulating state is maintained.

The first circuit board may be a flexible printed circuit board (FPCB) made of polyethylene naphthalate (PEN), and the second circuit board may be a printed circuit board (PCB) or a flexible circuit. It is characterized in that it is any one selected from the substrate (FPCB).

The first circuit board may be a flexible printed circuit board (FPCB) made of polyethylene naphthalate (PEN), and the cable may be a flexible flat cable (FFC). It features.

In addition, the material of the second substrate is characterized in that any one selected from PET, PEN, FR4 and ITO Glass.

In the bonding method using a PEN FPCB according to an embodiment of the present invention, a first terminal is formed at a first bonding portion formed on one side of one surface of the first circuit board 100, and the other side of the second circuit board 200 is formed on the other side of the second circuit board 200. Joining preparation step (S1) for forming a second terminal in the formed second bonding portion; Conductive bonding means placement step of placing one side of the conductive bonding means in the second bonding portion (S2); A substrate disposing step (S3) for disposing a first junction on the other side of the conductive bonding means; A bonding step (S4) of applying heat and pressure to the first or second bonding portion through the exothermic pressurizing means; It includes, wherein the conductive bonding means, the bonding means made of an adhesive material to physically bond the first bonding portion and the second bonding portion, and when the first bonding portion and the second bonding portion bonding the first terminal and the second It characterized in that it comprises a conductive particle of a conductive material for electrically connecting the terminal.

In addition, the substrate disposing step S3 may further include aligning a pair of first and second terminals corresponding to each other.

In addition, the conductive adhesive means further comprises a separator film on the other side, and further comprising the step of removing the separator film immediately before performing the substrate placement step (S3).

In addition, during the bonding step (S4) is characterized in that the heat and pressure is applied to the first or second bonding portion in the state provided with a buffer member of the elastic material between the exothermic pressurizing means and the first or second bonding portion.

The bonding method using the PEN FPCB of the present invention and the large-area PEN FPCB assembly manufactured by using the same structure as described above can manufacture a large-area flexible circuit board having a length of 500 mm or more using a general FPCB manufacturing equipment. There is an effect that can reduce the cost or time due to the reinvestment of equipment for manufacturing.

1 is a plan view of a large area FPCB assembly according to a first embodiment of the present invention
FIG. 2 is a sectional view taken along line AA ′ of FIG. 1 (large area FPCB assembly junction view)
Figure 3 is an exploded view of Figure 2 (large area FPCB assembly junction exploded cross section)
4 is an enlarged conceptual view of FIG. 2 (large area FPCB assembly junction cross-sectional conceptual view)
5 is a plan view of a large area FPCB assembly according to a second embodiment of the present invention;
6 to 11 are conceptual perspective views sequentially illustrating a bonding method of a flexible printed circuit board according to an embodiment of the present invention.

Hereinafter, an embodiment of the present invention as described above will be described in detail with reference to the accompanying drawings.

Example 1 (PCB vs PCB)

1 is a plan view of a large area PEN FPCB assembly 1000 (hereinafter, referred to as a "large area substrate") manufactured using a bonding method using a PEN FPCB according to one embodiment of the present invention.

As shown, the large-area substrate 1000 of the present invention bonds the first circuit board 100 and the second circuit board 200 having a normal size to each other through the junction 500, but electrically connects each terminal to each other. It is characterized by finding a circuit board with a large area by connecting to it.

In this case, the first circuit board 100 is a flexible printed circuit board (FPCB) made of polyethylene naphthalate (PEN), and the second circuit board 200 is a printed circuit board (PCB). Or a flexible printed circuit board (FPCB).

In the present embodiment, the bonding of the circuit board and the circuit board is described, but it is also applicable to the bonding of the circuit board and the cable. This will be described later through the following examples.

Hereinafter, a detailed configuration of the junction part 500 for bonding the first circuit board 100 and the second circuit board 200 to form the large area substrate 1000 will be described in detail with reference to the drawings.

2 is a cross-sectional view of the junction 500 of the large-area substrate 1000 according to an embodiment of the present invention, Figure 3 is a junction 500 of the large-area substrate 1000 according to an embodiment of the present invention. An exploded cross section is shown.

As shown, the first circuit board 100 includes a first substrate 110 forming a body, a first terminal 150 electrically connected to a circuit pattern of the first substrate 110, and a second circuit. The substrate 200 includes a second substrate 210 forming a body and a second terminal 250 electrically connected to a circuit pattern of the second substrate 210.

The first and second substrates 110 and 210 may be formed of a conventional PET material or a PEN material which is recently in the spotlight, and FR4, ITO Glass, or the like.

When the first circuit board 100 is disposed above and the second circuit board 200 is disposed below the first circuit board 100, the first terminal 150 is positioned below the first circuit board 100. The second terminal 250 may be joined in a state where the second terminal 250 is positioned above the second circuit board 200.

In this case, the junction 500 has the following configuration for physically coupling the first and second circuit boards 100 and 200 and for electrical connection of the first and second terminals 150 and 250. That is, the conductive bonding means 300 may be provided at the junction 500 between the first and second circuit boards 100 and 200 on which the first terminal 150 and the second terminal 250 are formed. The conductive bonding means 300 may include bonding means 310 for physically coupling the first and second circuit boards 100 and 200 and bonding means for electrical connection of the first and second terminals 150 and 250. It is configured to include a plurality of conductive particles 350 evenly distributed in the (310). That is, the bonding means 310 is made of a conventional adhesive paste or film material and is applied between the bonding portions 500 of the first and second circuit boards 100 and 200, or applied to the first and second layers by applying heat and pressure in a stacked state. It is configured to physically couple the two circuit boards (100, 200), the plurality of conductive particles 350 of the conductive material distributed between the bonding means 310 between the first and second terminals (150, 250) When arranged, it is configured to electrically connect the first and second terminals 150, 250 by heat and pressure.

At this time, the conductive bonding means 300 of the present invention is electrically connected only between the pair of first and second terminals 150 and 250 aligned with each other among the plurality of first terminals 150 and the second terminal 250. The remaining first and second terminals 150 and 250 may be coupled to maintain an insulation state.

In one example, the conductive adhesive means 300 may be applied with an anisotropic conductive film (ACF) adhesive.

For ease of understanding, FIG. 4 is an enlarged cross-sectional conceptual view of the junction 500 of the large-area substrate 1000. As shown in the drawing, a plurality of first conductive particles 351 disposed between the first terminal 150 and the second terminal 250 among the conductive particles 350 distributed in a plurality of bonding means 310 of the conductive bonding means 300. ) Is closely contacted between the first terminal 150 and the second terminal 250 due to the coupling pressure of the first terminal 150 and the second terminal 250, so that the first terminal 150 and the second terminal 250 Are electrically connected to each other, and the second conductive particles 352 disposed in the remaining space except between the first terminal 150 and the second terminal 250 are kept spaced apart from each other. It is configured to maintain an insulating state in the surface direction of the second substrates 110 and 210.

Example 2 (PCB to Cable)

FIG. 5 is a plan view of a large area PEN FPCB assembly 2000 (hereinafter referred to as a “large area substrate”) manufactured using a bonding method using a PEN FPCB according to one embodiment of the present invention.

As shown, the large-area substrate 2000 of the present invention is bonded to the first circuit board 100 having a normal size and the cable 600 through the junction 500, but each terminal electrically connected to each other by It is characterized by finding a circuit board with a large area.

In this case, the first circuit board 100 is a flexible printed circuit board (FPCB) made of polyethylene naphthalate (PEN), and the cable 600 is a flexible flat cable (FFC). Cable).

A plurality of third terminals 610 and fourth terminals 620 may be formed at both ends of the cable 600, respectively.

The detailed structure of the junction part 500 for joining the 1st circuit board 100 and the cable 600 to form the large area board | substrate 2000 is the same as that of the junction part 500 of 1st Embodiment mentioned above. Similar descriptions are omitted here.

Hereinafter, a method of bonding a flexible printed circuit board for manufacturing a large area substrate 1000 according to an exemplary embodiment of the present invention configured as described above will be described in detail with reference to the accompanying drawings.

6 to 11 are conceptual perspective views sequentially illustrating a bonding method of a flexible printed circuit board according to an embodiment of the present invention.

First, as shown in FIG. 6, one of the pair of substrates. In this embodiment, the second terminal 250 is formed at the junction 500 of the second circuit board 200, and the second terminal 250 is formed. A bonding preparation step (S1) of cleaning is performed. The second terminal 250 is a configuration for electrically connecting a circuit pattern formed on another circuit board and a circuit pattern formed on the circuit board, and may be integrally formed when the second circuit board 200 is manufactured.

Next, as shown in FIG. 7, the conductive bonding means arrangement step S2 of stacking the conductive bonding means 300 on the second circuit board 200 on which the second terminal 250 is formed is performed. In this embodiment, the conductive adhesive means 300 is formed in a film form, but may also be configured by applying a paste material. In this case, a separator film 320 may be provided on an upper surface of the conductive adhesive means 300, and the foreign matter may be removed from the conductive adhesive means 300 by removing the separator film 320 as illustrated in FIG. 8 immediately before the bonding process. It can be configured to minimize the inflow.

Next, as shown in FIG. 9, a substrate disposition step S3 is performed in which a first circuit board 100 having a first terminal (not shown) is formed on the conductive bonding means 300. In this case, when the first circuit board 100 is disposed, the first terminal 150 and the second terminal 250 formed on the second circuit board 200 are aligned with each other. When the bonding is performed in a state where the pair of first and second terminals 150 and 250 corresponding to each other are not aligned, a poor connection occurs between the first circuit board 100 and the second circuit board 200. Because it can be. The alignment method will be described in detail. First, alignment points are formed on the first circuit board 100 and the second circuit board 200, respectively. At this time, the alignment point is formed through the circuit board, and the size of the point hole of the first circuit board 100 and the point hole of the second circuit board 200 are different from each other, so The alignment is aligned by correcting the position so that the hole is located at the center of the large point hole.

The junction 500 of the first and second circuit boards 100 and 200 is applied to heat and pressure to finish the bonding. In this case, the first circuit to prevent damage to the first and second circuit boards 100 and 200 is prevented. The buffer member 510 may be disposed above the junction 500 of the substrate 100. The buffer member 510 may be any elastic material, but in this embodiment, a silicone rubber material may be applied.

Next, as shown in FIG. 10, the upper side of the shock absorbing member 510 is pressed in more detail than the upper side of the junction 500 of the first circuit board 100 using the heat generating pressurizing means 520. The joining step (S4) of applying pressure is performed. The exothermic pressurizing means 520 may be, for example, a conventional press that is heated to a predetermined temperature to perform compression processing. Through this, the bonding means 310 of the conductive bonding means 300 is cured to physically bond the first circuit board 100 and the second circuit board 200, and the first conductive particles 351 of the conductive particles 350 are formed. ) Is electrically connected to the first and second terminals 150 and 250 under the pressure of the first and second terminals 150 and 250.

Finally, as shown in FIG. 11, when the conductive bonding means 300 is cured 301 and the bonding of the first circuit board 100 and the second circuit board 200 is completed, the heat generating pressurizing means 520 and the buffer are completed. The large area circuit board 1000 is completed by removing the member 510.

The technical spirit should not be interpreted as being limited to the above embodiments of the present invention. Various modifications may be made at the level of those skilled in the art without departing from the spirit of the invention as claimed in the claims. Therefore, such improvements and modifications fall within the protection scope of the present invention as long as it is obvious to those skilled in the art.

1000, 2000: large area printed circuit board
100: first circuit board
110: first substrate 150: first terminal
200: second circuit board
210: second substrate 250: second terminal
300: conductive bonding means
310: bonding means 320: separator film
350: conductive particles
351: first conductive particles 352: second conductive particles
500: junction 510: buffer member
520: exothermic pressurizing means
600: cable 610: third terminal
620: fourth terminal

Claims (13)

A first circuit board including a first substrate having a circuit pattern formed thereon, the first substrate having a first junction formed on one side thereof, and a plurality of first terminals electrically connected to the circuit pattern exposed to the first junction;
A second substrate including a second substrate having a circuit pattern formed thereon, the second substrate having a second junction formed on the other side thereof to be bonded to the first junction, and a plurality of second terminals electrically connected to the circuit pattern and exposed to the second junction; 2 circuit board; And
Bonding means made of an adhesive material to physically bond the first junction portion and the second junction portion, and a conductive material electrically connecting the first terminal and the second terminal when the first junction portion and the second junction portion are joined; A conductive adhesive means comprising particles,
The conductive particles are made of a conductive material, a plurality of are evenly distributed on the bonding means,
The conductive particles are composed of a pair of first conductive particles disposed between a pair of the first terminal and the second terminal corresponding to each other, and second conductive particles disposed in the remaining portions,
The first conductive particles are in close contact with a pair of the first terminal and the second terminal to electrically connect the first terminal and the second terminal, and the second conductive particles are spaced apart from each other to provide a pair of the first terminals. Insulate the first and second terminals except the terminal and the second terminal,
The outer side of the junction is provided with a buffer member,
The shock absorbing member has a width corresponding to the width of the exothermic pressurizing means for applying heat and pressure to the first or second joining portion, and has a larger width than the first and second joining portions. Assembly.
delete delete delete delete delete The method of claim 1,
The first circuit board is a flexible printed circuit board (FPCB) made of polyethylene naphthalate (PEN), and the second circuit board is a printed circuit board (PCB) or a flexible circuit board ( A large area PEN FPCB assembly, characterized in that any one of FPCB).
delete The method of claim 7, wherein
The material of the second substrate,
A large area PEN FPCB assembly, characterized in that any one selected from PET, PEN, FR4 and ITO Glass.
A joining method using a PEN FPCB for producing the large area PEN FPCB assembly of claim 1,
Joining preparation step of forming a first terminal on the first junction formed on one side of the first circuit board 100, and a second terminal formed on the second junction formed on the other side of the second circuit board 200 (S1) );
Conductive bonding means placement step of placing one side of the conductive bonding means in the second bonding portion (S2);
A substrate disposing step (S3) for disposing a first junction on the other side of the conductive bonding means;
A bonding step (S4) of applying heat and pressure to the first or second bonding portion through the exothermic pressurizing means; Including,
The conductive adhesive means may include adhesive means made of an adhesive material to physically bond the first joint part and the second joint part, and electrically connect the first terminal and the second terminal when the first joint part and the second joint part are joined together. Conductive particles of a conductive material to connect,
In the bonding step (S4)
Bonding method using a PEN FPCB, characterized in that the heat and pressure is applied to the first or second joint in a state that the buffer member of the elastic material is provided between the exothermic pressing means and the first or second joint.
The method of claim 10,
The substrate placing step (S3),
And aligning a pair of the first terminal and the second terminal corresponding to each other, the bonding method using a PEN FPCB.
The method of claim 10,
The conductive adhesive means further comprises a separator film on the other side,
Bonding method using a PEN FPCB, further comprising the step of removing the separator film immediately before the substrate placement step (S3).
delete

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