JP5152499B2 - 電気装置及びその接続方法 - Google Patents

電気装置及びその接続方法 Download PDF

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Publication number
JP5152499B2
JP5152499B2 JP2008136369A JP2008136369A JP5152499B2 JP 5152499 B2 JP5152499 B2 JP 5152499B2 JP 2008136369 A JP2008136369 A JP 2008136369A JP 2008136369 A JP2008136369 A JP 2008136369A JP 5152499 B2 JP5152499 B2 JP 5152499B2
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Japan
Prior art keywords
connection
anisotropic conductive
connection terminal
adhesive
wiring board
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Expired - Fee Related
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JP2008136369A
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JP2009004768A (ja
Inventor
美佐夫 小西
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Dexerials Corp
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Dexerials Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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Description

本発明は電気部品と半導体素子の接続方法に関する。
従来より、半導体素子のような電気部品を配線基板に接続するのには、バインダー樹脂に導電性粒子が分散された異方導電性接着剤が用いられている。
電気部品と配線基板を接続する工程の一例について説明すると、配線基板と電気部品とで異方導電性接着剤を挟み込み、押圧する。これにより、電気部品の接続端子の先端部分と、配線基板のランド部分とで導電性粒子が挟み込まれると共にバインダー樹脂（接着剤）が押しのけられ、電気部品が配線基板に電気的に接続される。
接着剤が熱硬化性を有する場合には、上述の押圧時に加熱押圧し、接着剤を熱硬化させて電気部品を配線基板に固定する。このように、異方導電性接着剤を用いれば、電気部品を配線基板に電気的にも機械的にも接続することができる。
近年、半導体素子のコストダウンや、ファインピッチ化、電気部品本体の狭額縁化等に伴い、半導体素子の細長化が進んでいるが、接続端子の先端部分の面積が狭い場合には、その先端部分とランド部分とで導電性粒子が挟み込まれる確率が低くなり、接続端子とランド部分に導通不良が起こり易くなる。
これに対し、異方導電性接着剤に含有される導電性粒子の含有率を高くすれば、接続端子とランド部分とで導電性粒子が挟み込まれる確率が高くなるが、異方導電性接着剤の製造コストが高くなる。
このように、従来技術では導通信頼性の高い電気装置を、製造コストを抑えて製造することが困難であった。
本発明は上記従来技術の不都合を解決するために創作されたものであり、その目的は、導通信頼性の高い接続を備えた電気装置を低コストで提供すること、またそのための接続方法及びその接続方法に使用する接着フィルムを提供することである。
上記課題を解決するため、本発明は、配線基板上に配置されたランド部分と、電気部品の接続端子とが互いに対向し、異方導電接着剤の導電性粒子によって電気的に接続されている接続部分を有する電気装置であって、
接続部分として、第一の接続部分と、第一の接続部分よりも導電性粒子の含有率が少ない第二の接続部分を有する電気装置を提供する。
また、本発明は、上述の電気装置の製造に使用する接着フィルムとして、導電性粒子を含有する第一の異方導電性接着剤層と、第一の異方導電性接着剤層よりも導電性粒子の含有率が低い第二の異方導性電接着剤層とが、帯状の剥離フィルム上の異なる位置に設けられた接着フィルムを提供する。
さらに、本発明は、上述の電気装置の製造に使用する接続方法として、配線基板上に配置されたランド部分と、電気部品の接続端子とを、異方導電性接着剤層を介して対向配置し、配線基板と電気部品のいずれか一方又は両方を押圧し、配線基板のランド部分と、電気部品の接続端子とを電気的に接続する接続方法であって、
第一の接続端子と該第一の接続端子と対向配置したランド部分との間の異方導電性接着剤層の導電性粒子の含有率を、第二の接続端子と該第二の接続端子と対向配置したランド部分との間の異方導電性接着剤層の導電性粒子の含有率よりも高くする接続方法を提供する。
本発明の電気装置では、導電性粒子の含有率が互いに異なる第一、第二の接続部分によって、電気部品が配線基板に接続されている。このため電機部品の接続端子の接続面積に広狭がある場合に、接続面積の狭い第一の接続端子を、導電性粒子の含有率の高い第一の接続部分で対応するランド部分に接続することが可能となるので、導通信頼性を高めることができる。また、接続面積の狭い第二の接続端子を、導電性粒子の含有率の低い第二の接続部分で対応するランドに接続することが可能となるので、導電性粒子の使用量を低減し、接続に要するコストを抑えることができる。
また、本発明の接続方法によれば、本発明の電気装置の製造が可能となり、本発明の接着フィルムによれば、本発明の接続方法が容易となる。
以下、図面に基づいて本発明を具体的に説明する。なお、各図中、同一符号は同一又は同等の構成要素を表している。
図１（ａ）は本発明の接着フィルム５０の一例の平面図を示しており、同図（ｂ）はそのＢ−Ｂ切断線断面図を示している。
この接着フィルム５０は帯状の剥離フィルム５１と、剥離フィルム５１上に配置され、導電性粒子５９が分散された異方導電性接着剤層５２とを有している。
異方導電性接着剤層５２としては、同じ種類のバインダー樹脂５６を主成分とし、導電性粒子５９の含有率（重量％）が異なる２種類の異方導電性接着剤層、即ち、導電性粒子５９の含有率が高い第一の接着部５５と、第一の接着部５５よりも導電性粒子５９の含有率が低い第二の接着部５８とが異なる位置に設けられている。
ここでバインダー樹脂５６としては、エポキシ樹脂、メラミン樹脂、フェノール樹脂、尿素樹脂など種々の熱硬化性樹脂を用いることができ、これらの樹脂を単独、又は２種類以上を混合してもよい。
また、バインダー樹脂５６に用いる樹脂は熱硬化性樹脂を主成分とするものに限定されず、熱硬化性樹脂に熱可塑性樹脂等他の樹脂を添加したものでもよく、また、紫外線や可視光などの光照射によって硬化する光硬化性樹脂を主成分とするものを用いることもできる。
一方、導電性粒子５９としては、金属粒子や、樹脂粒子の表面に金属被膜層が形成されたもの等を単独又は２種類以上で含有させることができる。第一、第二の接着部５５、５８に含有させる導電性粒子の種類は互いに同じでも異なっていてもよいが、第一、第二の接着部５５、５８に含有させる導電性粒子５９の含有率は、導電性粒子５９の粒子径、この接着フィルム５０を用いて接続しようとする電気部品の配線端子あるいは配線基板のランドの面積やピッチ等に応じて互いに異なるようにする。
また、剥離フィルム５１上に形成する第一、第二の接着部５５、５８の膜厚はそれぞれ特に限定されるものではないが、接着フィルム５０で配線基板に接続しようとする電気部品を確実に配線基板に固定するためには、１０μｍ以上４０μｍ以下であることが好ましい。
第一、第二の接着部５５、５８はそれぞれ剥離フィルム５１の幅よりも狭い幅で帯状に形成されている。そして、第一の接着部５５は、剥離フィルム５１の一方の側縁部に沿って配置され、第二の接着部５８は剥離フィルム５１の他方の側縁に沿って配置されている。
一方、図３（ａ）は接着フィルム５０で接続する配線基板６０の一例を示している。この配線基板６０は基板本体６１と、基板本体６１の一面の別々の領域に配置された第一、第二のランド部分６３、６４とを有している。第一のランド部分６３の表面面積は、第二のランド部分６４の表面面積よりも大きくされている。
また、第一、第二のランド部分６３、６４はそれぞれ直線状に配列しているが、第一のランド部分６３の配列ピッチは第二のランド部分６４の配列ピッチよりも狭くなっている。
図２は、配線基板６０に接続する電気部品６５の一例を示している。この電気部品６５は細長い部品本体６６と、部品本体６６の一面に配置された第一、第二の接続端子６７、６８とを有している。
なお、本発明において、電気部品は半導体素子に限定されず、種々のものを用いることができる。また、一つの電気部品に、複数の接続端子が配設された接続領域の数は１個でも複数個でもよく、したがって、一つの電気装置における、電気部品と配線基板との接続領域の個数についても、１個でも複数個でもよい。
第一、第二の接続端子６７、６８は、それぞれ上述の電気部品６５の第一、第二のランド部分６３、６４に対応し、第一の接続端子６７の先端部分５３の面積は、第二の接続端子６８の先端部分５４の面積よりも狭くなっている（図６（ｂ））。
この電機部品６５を上述の配線基板６０に接続する方法としては、まず、配線基板６０の第一、第二のランド部分６３、６４の配列方向と、接着フィルム５０の走行方向とが平行になるように、配線基板６０を圧着台（図示せず）に配置する。
次に、接着フィルム５０を配線基板６０上に走行させ、接着フィルム５０の第一、第二の接着部５５、５８を、配線基板６０の第一、第二のランド部分６３、６４上に位置させる。そして、押圧ローラ等を用いて接着フィルム５０を配線基板６０に押し当てる。これにより、接着フィルム５０の第一の接着部５５が配線基板６０の第一のランド部分６３上に接着し、接着フィルム５０の第二の接着部５８が配線基板６０の第二のランド部分６４上に接着する。
次に、切断手段を用いて、接着フィルム５０の配線基板６０に接着した領域を他の領域から分離する。接着フィルム５０の第一、第二の接着部５５、５８と配線基板６０との間の接着力は、この第一、第二の接着部５５、５８と剥離フィルム５１との間の接着力よりも強くされているので、接着フィルム５０の配線基板６０への押圧を解除すると、配線基板６０に接着していた接着フィルム５０の領域が剥離フィルム５１が剥離し、第一、第二の接着部５５、５８が配線基板６０に転着される（図６（ｂ））。
そこで、前述の電気部品６５の第一、第二の接続端子６７、６８が配置された面を配線基板６０側に向け、第一、第二の接続端子６７、６８が配線基板６０の第一、第二のランド部分６３、６４に対向するように、電気部品６５を配線基板６０上に配置する。
これにより、電気部品６５の第一の接続端子６７の先端部分５３が接着フィルム５０の第一の接着部５５に密着し、電気部品６５の第二の接続端子６８の先端部分５４が接着フィルム５０の第二の接着部５８に密着する。
次に、この状態で、電気部品６５を加熱押圧する。加熱によって異方導電接着剤層５２が昇温し、バインダー樹脂５６が軟化する。
バインダー樹脂５６が軟化すると、第一、第二の接着部５５、５８が流動性を呈するので、押圧によって第一、第二の接続端子６７、６８の先端部分５３、５４が第一、第二の接着部５５、５８を押しのけ、その先端部分５３、５４が第一、第二の接着部５５、５８中の導電性粒子５９に接触する。
ここで、導電性粒子５９の含有率が均一な場合には、第一の接続端子６７の先端部分５３に導電性粒子５９が接触する確率は、第二の接続端子６８の先端部分５４の面積に比して第一の接続端子６７の先端部分５３の面積が狭い分低くなってしまうが、第一の接着部５５における導電性粒子５９の含有率は、第二の接着部５８における導電性粒子５９の含有率よりも高くされているので、第二の接続端子６８だけではなく、第一の接続端子６７の先端部分５３にも導電性粒子５９が確実に接触する。
更に、加熱押圧を続けると、第一、第二の接続端子６７、６８が第一、第二のランド部分６３、６４に押し付けられて、各先端部分５３、５４に接触した導電性粒子５９が第一、第二の接続端子６７、６８と第一、第二のランド部分６３、６４とで挟み込まれた状態になる。
この状態でバインダー樹脂５６の重合反応が進行し、第一、第二の接着部５５、５８が第一、第二の接続端子６７、６８と第一、第二のランド部分６３、６４の周囲を取り囲んだ状態で硬化する。
これにより、図４及びそのＣ−Ｃ切断面である図３（ｃ）に示すように、第一、第二の接着部５５、５８が硬化した電気装置４０が得られる。こうして得られる電気装置４０は、導通信頼性の高いものとなる。
また、異方導電性接着剤層５２全体の導電性粒子５９の含有率を高くするとコストが高くなるが、第二の接着部５８の導電性粒子５９の含有率が低くされている分、異方導電性接着剤層５２全体では導電性粒子５９の含有率が低くされているので、製造コストが安価になる。
なお、図４の符号４３は、第一の接続端子６７と第一のランド部分６３が接続された第一の接続部分４１が位置する第一の接続領域を示しており、同図の符号４４は第二の接続端子６８と第二のランド部分６４が接続された第二の接続部分４２が位置する第二の接続領域を示している。
この電気装置４０では、例えば、配線基板６０の電気信号は、接続面積が広い第二の接続部分４２から電気部品２５に入力され、その電気信号は電気部品２５で処理された後、接続面積が狭い第一の接続部分４１から配線基板６０に出力される。
本発明の接着フィルム５０において、導電性粒子５９の含有率が互いに異なる第一、第二の接着部５５、５８の配置は、上述の例に限られず、例えば、図５に示す接着フィルム７０のように配置してもよい。
図５（ａ）は接着フィルム７０の平面図を示しており、図５（ｂ）は図５（ａ）のＤ−Ｄ切断線断面図を示している。この接着フィルム７０は帯状の剥離フィルム７１と、剥離フィルム７１表面に延設された異方導電性接着剤層７２とを有している。図５において、異方導電性着剤層７２は、それぞれ、図１の第一、第二の接着部５５、５８と同様に導電性粒子の含有率が異なる第一、第二の接着部７５、７８からなり、第一の接着部７５は第二の接着部７８よりも導電性粒子の含有率が高くなっている。また、第一の接着部７５と第二の接着部７８は、帯状の接着フィルム７０の長手方向に、交互に繰り返されている。
図５（ａ）の破線はこの接着フィルム７０を用いて好適に接合することのできる電気部品６５の接続面の大きさを示している。この電気部品６５は、図２に示したように、先端部分の面積が狭い第一の接続端子６７と先端部分の面積が広い第二の接続端子６８がそれぞれ直線状に配列したものである。図５（ａ）に示すように、接着フィルム７０の幅は、電気部品６５の接続面の長辺の長さよりもやや長く、第一、第二の接着部７５、７８の繰り返しピッチは、電気部品６５の接続面の短辺の長さよりもやや長く、第一、第二の接着部７５、７８で接続単位７９を構成している。
したがって、接着フィルム７０を接続単位７９ごとに用い、電気部品６５と配線基板を前述と同様に対向配置して接続すると、電気部品６５の接続端子のうち先端部分の面積が狭い第一の接続端子６７は導電性粒子の含有率の高い第一の接着部７５で確実に接続することができ、先端部分の面積が広い第二の接続端子６８は、導電性粒子の含有率の低い第二の接着部７８で、製造コストを抑えつつ確実に接続することができる。
本発明の接着フィルムにおいて、第一、第二の接着部５５、５８の配置は特に限定されるものではなく、例えば、図６に示した電気装置８０のように、四角形の電気部品６５ｂの対角線で２分される領域に、接着フィルムの異方導電性接着剤層８２ｂとして、導電性粒子含有率の高い第一の接着部８５と、導電性粒子の含有率の低い第二の接着部８８をそれぞれ別々に配置し、先端面積の狭い接続端子とランド部分とが接続されている第一の接続領域４３ｂと、先端面積の広い接続端子とランド部分とが接続されている第二の接続領域４４ｂを形成することにより、電気部品６５ｂを配線基板６０ｂに接続してもよい。
本発明においては、導電性粒子の含有率が異なる３つ以上の接着部分で未硬化接着剤層を構成してもよく、また、接続端子が半田バンプである場合のように、加熱押圧により接続端子とランド部分とが金属結合することを期待できる場合には、未硬化接着剤層の一部又は全部を導電性粒子の含有率がゼロの接着部分で構成してもよい。
さらに、本発明の接続方法では、第一、第二の接着部５５、５８を別々の剥離フィルム５１上に配置し、第一、第二の接着部５５、５８が形成された剥離フィルム５１をそれぞれ配線基板６０上に走行させ、第一、第二の接着部５５、５８を別々の剥離フィルム５１上から同じ配線基板６０に転着させることもできる。
また、配線基板６０上の第一、第二のランド部分６３、６４と電機部品６５の第一、第二の接続端子６７、６８の間に異方導電性接着剤層５２を配置して接続するにあたり、異方導電性接着剤層５２を配線基板６０に転着させてから、異方導電接着剤層５２と電機部品６５とを密着させて接続してもよく、電気部品６５に異方導電性接着剤５２を転着させてから、配線基板６０と異方導電接着剤層５２とを密着させて接続してもよい。
また、第一、第二の接着部５５、５８の配線基板６０への配置方法としては、例えば、導電性粒子の含有率が互いに異なるペースト状の第一、第二の異方導電性接着剤を用意し、配線基板６０と電気部品６５のいずれか一方に、導電性粒子の含有量の異なる第一、第二の異方導電性接着剤を塗布して第一、第二の接着部５５、５８を形成し、異方導電性接着剤層５２とすることもできる。
本発明の接続フィルム、接続方法及び電気装置は、電気的接続と機械的接続を同時に行うことが必要とされる種々の電気装置で有用である。
(a)本発明に用いる接着フィルムを説明する平面図、(b)その断面図 本発明に用いる電気部品を説明する平面図 (a)〜(c)本発明により配線基板と電気装置を接続する工程を説明する断面図 第二の発明の電気装置の一例を説明する平面図 (a)本発明の接着フィルムを説明する平面図、(b)その断面図 本発明の電気装置を説明する平面図
符号の説明
４０ 電気装置
４１ 第一の接続部分
４２ 第二の接続部分
５０ 接着フィルム
５１ 剥離フィルム
５２ 異方導電接着剤層
５５ 第一の接着部（異方導電接着剤層）
５６ バインダー樹脂
５８ 第二の接着部（異方導電接着剤層）
５９ 導電性粒子
６０ 配線基板
６３ 第一のランド部分
６４ 第二のランド部分
６５ 電気部品
６７ 第一の接続端子
６８ 第二の接続端子
７０ 接着フィルム
７１ 剥離フィルム
７２ 異方導電性接着剤層
７５ 第一の接着部
７８ 第二の接着部
８０ 電気装置
８２ｂ 異方導電接着剤層
８５ 第一の接着部
８８ 第二の接着部

Claims (5)

  1. 配線基板上に配置されたランド部分と、電気部品の接続端子とが互いに対向し、異方導電接着剤の導電性粒子によって電気的に接続されている接続部分を有する電気装置であって、
    接続部分として、第一の接続部分と、第一の接続部分よりも導電性粒子の含有率が少ない第二の接続部分を有し、
    第一の接続部分の接続端子の先端部分の面積が、第二の接続部分の接続端子の先端部分の面積よりも狭い電気装置。
  2. 第一の接続部分の導電性粒子と第二の接続部分の導電性粒子とが同じである請求項１記載の電気装置。
  3. 配線基板上に配置されたランド部分と、電気部品の接続端子とを、異方導電性接着剤層を介して対向配置し、配線基板と電気部品のいずれか一方又は両方を押圧し、配線基板のランド部分と、電気部品の接続端子とを電気的に接続する接続方法であって、
    電気部品の接続端子は、第一の接続端子と第二の接続端子とを有し、第一の接続端子の先端部分の面積を、第二の接続端子の先端部分の面積よりも小さくし、
    第一の接続端子と該第一の接続端子と対向配置したランド部分との間の異方導電性接着剤層の導電性粒子の含有率を、第二の接続端子と該第二の接続端子と対向配置したランド部分との間の異方導電性接着剤層の導電性粒子の含有率よりも高くする接続方法。
  4. 導電性粒子を含有する第一の異方導電性接着剤層と、第一の異方導電性接着剤層よりも導電性粒子の含有率が低い第二の異方導電性接着剤層とが、帯状の剥離フィルム上の異なる位置に設けられており、第一、第二の異方導電性接着剤層が、接着フィルムで接続する電気部品の大きさに応じた長さの接続単位を構成し、該接続単位が剥離フィルムの長手方向に配列している接着フィルムを配線基板上に走行させ、接着フィルムの第一、第二の異方導電性接着剤層を配線基板に転着させることにより、第一、第二の異方導電性接着剤層を配線基板上に配置する請求項３記載の接続方法。
  5. 導電性粒子を含有する第一の異方導電性接着剤層と、第一の異方導電性接着剤層よりも導電性粒子の含有率が低い第二の異方導電性接着剤層とが、帯状の剥離フィルム上の異なる位置に設けられており、第一、第二の異方導電性接着剤層が、接着フィルムで接続する電気部品の大きさに応じた長さの接続単位を構成し、該接続単位が剥離フィルムの長手方向に配列している接着フィルムを使用し、接続単位ごとに第一、第二の異方導電性接着剤層を配線基板上に転着させる請求項３又は４記載の接続方法。
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HK1139506A1 (en) 2010-09-17
WO2008143358A1 (ja) 2008-11-27
JP5013114B2 (ja) 2012-08-29
WO2008146793A1 (ja) 2008-12-04
JP2009004768A (ja) 2009-01-08
JP2009004767A (ja) 2009-01-08
CN101681855B (zh) 2013-03-13
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CN101681855A (zh) 2010-03-24
TW200850094A (en) 2008-12-16

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