TWI422294B - Electrical device, connection method and subsequent film - Google Patents

Electrical device, connection method and subsequent film Download PDF

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Publication number
TWI422294B
TWI422294B TW097119331A TW97119331A TWI422294B TW I422294 B TWI422294 B TW I422294B TW 097119331 A TW097119331 A TW 097119331A TW 97119331 A TW97119331 A TW 97119331A TW I422294 B TWI422294 B TW I422294B
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TW
Taiwan
Prior art keywords
connection
anisotropic conductive
film
conductive adhesive
connection terminal
Prior art date
Application number
TW097119331A
Other languages
English (en)
Other versions
TW200850094A (en
Inventor
Misao Konishi
Original Assignee
Dexerials Corp
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Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of TW200850094A publication Critical patent/TW200850094A/zh
Application granted granted Critical
Publication of TWI422294B publication Critical patent/TWI422294B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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Description

電氣裝置、連接方法及接著膜
本發明關於一種電氣零件與半導體元件之連接方法。
自以往，為了將如半導體元件之電氣零件連接於配線基板上，係一直使用黏合樹脂中分散有導電性粒子的異向導電性接著劑。
若說明用以連接電氣零件與配線基板之步驟一例，則係以配線基板與電氣零件夾持異向導電性接著劑，然後加以抵壓。藉此，以電氣零件之連接端子的前端部分、及配線基板之平台(land)部分夾持導電性粒子，且將黏合樹脂(接著劑)加以壓塗，而將電氣零件電連接於配線基板。
當接著劑具有熱硬化性時，在進行上述抵壓時，係進行加熱抵壓，使接著劑熱硬化，而將電氣零件固定於配線基板。以此方式，若使用異向導電性接著劑，則可將電氣零件電連接且機械連接於配線基板上。
近年來，隨著半導體元件之成本降低、細間距化、電氣零件本身之窄框化等，半導體元件之狹長化持續發展，但是在半導體元件之前端部分面積小的情形，由於該前端部分與平台部分夾持有導電性粒子的機率降低，故連接端子與平台部分容易發生導通不良。
相對於此，若提高異向導電性接著劑所含有之導電性粒子的含有率，雖然可提高連接端子與平台部分夾持有導 電性粒子的機率，但是亦會提高異向導電性接著劑的製造成本。
因此，以習知技術難以在抑制成本下製造導通可靠度高的電氣裝置。
本發明係為了解決上述習知技術之不良情形所完成者，其目的在於以低成本提供一種具備有導通可靠度高之連接的電氣裝置，且提供一種連接方法及該連接方法所使用之接著膜。
為了解決上述課題，本發明提供一種電氣裝置，其具有配置在配線基板上之平台部分、與電氣零件之連接端子互相對向，且藉由異向導電性接著劑之導電性粒子電連接之連接部分，該連接部分具有第一連接部分及導電性粒子含有率少於第一連接部分之第二連接部分。
又，本發明提供一種使用於製造上述電氣裝置之接著膜，係將含有導電性粒子之第1異向導電性接著劑層、及導電性粒子之含有率低於第1異向導電性接著劑層之第2異向導電性接著劑層設置於帶狀剝離膜上的不同位置。
並且，本發明提供一種使用於製造上述電氣裝置之連接方法，係透過異向導電性接著劑層將配置於配線基板上之平台部分、及電氣零件之連接端子對向配置，然後對配線基板與電氣零件之其中一者或兩者進行抵壓，而將配線基板之平台部分及電氣零件之連接端子加以電連接，使得 在第1連接端子、及與該第1連接端子相對向配置之平台部分之間的異向導電性接著劑層的導電性粒子含有率高於在第2連接端子、及與該第2連接端子相對向配置之平台部分之間的異向導電性接著劑層的導電性粒子含有率。
本發明之電氣裝置，係藉由導電性粒子之含有率彼此不同之第1、第2連接部分，來將電氣零件連接於配線基板。故於電機零件之連接端子的連接面積有大小時，由於可以導電性粒子含有率高的第1連接部分，將連接面積小的第1連接端子加以連接在所對應的平台部分，因此可提高導通可靠度。又，由於可以導電性粒子含有率低的第2連接部分，將連接面積小的第2連接端子加以連接在所對應的平台，因此可降低導電性粒子的使用量，可抑制連接所需之成本。
又，根據本發明之連接方法，即可製造本發明之電氣裝置，根據本發明之接著膜，即可使本發明之連接方法容易進行。
以下，根據圖式具體說明本發明。另，各圖中，相同符號係表示相同或相等的構成要素。
圖1(a)係顯示本發明之接著膜50之一例的俯視圖，同圖(b)則是顯示其B－B剖線之剖面圖。
此接著膜50具有帶狀剝離膜51、及配置在剝離膜51上且分散有導電性粒子59之異向導電性接著劑層52。
異向導電性接著劑層52，係以相同種類之黏合樹脂56作為主成分，並將導電性粒子59之含有率(重量%)不同的2種異向導電性接著劑層，亦即，將導電性粒子59之含有率高的第1接著部55、及導電性粒子59之含有率低於第1接著部55的第2接著部58設置在不同位置。
此處，黏合樹脂56，可使用環氧樹脂、三聚氰胺樹脂、酚樹脂、尿素樹脂等各種熱硬化性樹脂，此等樹脂可單獨或混合2種以上使用。
又，黏合樹脂56所使用之樹脂並非限定於以熱硬化性樹脂為主成分者，亦可為在熱硬化性樹脂中添加有熱可塑性樹脂等其他樹脂者，又，亦可使用以光硬化性樹脂(係藉由紫外線、可見光等之光照射使其硬化)為主成分者。
另一方面，導電性粒子59，可使其含有單獨一種或兩種以上之金屬粒子、或在樹脂粒子表面形成有金屬被膜層者等。第1、第2接著部55、58所含有之導電性粒子的種類可彼此相同或不同，又，第1、第2接著部55、58所含有之導電性粒子59的含有率，係使其根據導電性粒子59之粒徑、使用此接著膜50所欲連接之電氣零件之配線端子、或配線基板之平台面積、間距等而彼此不同。
又，形成於剝離膜51上之第1、第2接著部55、58之膜厚，並無特別限制，為了確實地以接著膜50將待接著於配線基板之電氣零件固定在配線基板，該膜厚較佳在10 μm以上40 μm以下。
第1、第2接著部55、58，分別係以小於剝離膜51之 寬度的寬度形成為帶狀。又，係沿著剝離膜51之一方側緣部設置第1接著部55，另沿著剝離膜51之另一方側緣設置第2接著部58。
另一方面，圖3(a)係顯示以接著膜50所連接之配線基板60之一例。此配線基板60，具有基板本體61、及設置在基板本體61之一面上不同區域的第1、第2平台部分63、64。第1平台部分63之表面面積大於第2平台部分64之表面面積
又，第1、第2平台部分63、64係分別配置排列成直線狀，第1平台部分63之配置排列間距小於第2平台部分64之配置排列間距。
圖2係顯示連接於配線基板60之電氣零件65之一例。此電氣零件65具有細長之零件本體66、及設置於零件本體66之一面的第1、第2連接端子67、68。
另，於本發明中，電氣零件並不限定於半導體元件，亦可使用各種物品。又，一電氣零件上設置有複數個連接端子之連接區域的數目，可為1個或複數個，因此在一電氣裝置中，電氣零件與配線基板之連接區域的個數可為1個或複數個。
第1、第2連接端子67、68，係分別對應於上述電氣零件65之第1、第2平台部分63、64，第1連接端子67之前端部分53的面積小於第2連接端子68之前端部分54的面積(圖6(b))。
將此電機零件65連接於上述配線基板60之方法，首 先，係將配線基板60設置在壓合台(未圖示)，使配線基板60之第1、第2平台部分63、64的配置排列方向、及接著膜50的移動方向平行。
接著，使接著膜50移動於配線基板60上，使接著膜50之第1、第2接著部55、58位於配線基板60之第1、第2平台部分63、64上。然後，使用抵壓滾輪將接著膜50壓接於配線基板60。藉此，將接著膜50之第1接著部55接著於配線基板60之第1平台部分63上，接著膜50之第2接著部58則接著於配線基板60之第2平台部分64上。
接著，使用切斷機構，將接著膜50接著於配線基板60之區域自其他區域予以分離。由於接著膜50之第1、第2接著部55、58與配線基板60之間的接著力大於此第1、第2接著部55、58與剝離膜51之間的接著力，因此若解除接著膜50對配線基板60的抵壓，則接著於配線基板60之接著膜50的區域將會自剝離膜51剝離，而使第1、第2接著部55、58轉附於配線基板60(圖6(b))。
又，將上述電氣零件65設置有第1、第2連接端子67、68之面朝向配線基板60側，以第1、第2連接端子67、68與配線基板60之第1、第2平台部分63、64相對向的方式，將電氣零件65設置在配線基板60上。
藉此，使電氣零件65之第1連接端子67的前端部分53密合於接著膜50的第1接著部55，電氣零件65之第2連接端子68的前端部分54密合於接著膜50的第2接著 部58。
接著，在此狀態下，對電氣零件65進行加熱抵壓。藉加熱使異向導電性接著劑層52升溫，使黏合樹脂56軟化。
由於黏合樹脂56一經軟化，第1、第2接著部55、58則會具有流動性，因此，藉由抵壓可使第1、第2連接端子67、68的前端部分53、54將第1、第2接著部55、58推塗開，使其前端部分53、54接觸於第1、第2接著部55、58中的導電性粒子59。
此處，當導電性粒子59的含有率為均一時，導電性粒子59接觸於第1連接端子67之前端部分53的機率，與第2連接端子68之前端部分54的面積相較之下，雖然會因第1連接端子67之前端部分53的面積小而降低，但是第1接著部55之導電性粒子59的含有率，由於較第2接著部58之導電性粒子59的含有率高，因此，不僅第2連接端子68，導電性粒子59亦確實地接觸於第1連接端子67之前端部分53。
並且，若持續進行加熱抵壓，則第1、第2連接端子67、68將會被壓著於第1、第2平台部分63、64，接觸於各前端部分53、54的導電性粒子59將會呈被夾持在第1、第2連接端子67、68與第1、第2平台部分63、64的狀態。
在此狀態下，黏合樹脂56的聚合反應將會進行，而在第1、第2接著部55、58圍繞第1、第2連接端子67、68與第1、第2平台部分63、64之周圍的狀態下硬化。
藉此，如圖4及其C－C剖面之圖3(c)所示，可得到 第1、第2接著部55、58硬化後的電氣裝置40。以此方法所得到之電氣裝置40，具有高導通可靠度。
又，雖然若提高異向導電性接著劑層52全體之導電性粒子59的含有率，則會使成本提高，但是第2接著部58之導電性粒子59的含有率越低，異向導電性接著劑層52全體之導電性粒子59的含有率就越低，因此可使製造成本降低。
另，圖4之符號43，係顯示連接第1連接端子67與第1平台部分63之第1連接部分41所在的第1連接區域，同圖的符號44則是顯示連接第2連接端子68與第2平台部分64之第2連接部分42所在的第2連接區域。
於此電氣裝置40中，例如，配線基板60之電氣訊號，係從連接面積較大的第2連接部分42進入電氣零件25，該電氣訊號經電氣零件25進行處理後，則從連接面積較小的第1連接部分41輸出至配線基板60。
於本發明之接著膜50中，導電性粒子之含有率彼此不同的第1、第2接著部55、58的設置，並不限於上述之例，例如，亦可如圖5所示之接著膜70般來設置。
圖5(a)係顯示接著膜70之平面圖，圖5(b)則顯示圖5(a)之D－D切線剖面圖。此接著膜70具有帶狀之剝離膜71、及設於剝離膜71表面的異向導電性接著劑層72。於圖5中，異向導電性接著劑層72分別係由與圖1之第1、第2接著部55、58相同，其導電性粒子之含有率不同的第1、第2接著部75、78所構成，第1接著部75 之導電性粒子的含有率高於第2接著部78。又，第1接著部75與第2接著部78係交互重複於帶狀之接著膜70之長邊方向。
圖5(a)之虛線係顯示可使用此接著膜70進行較佳接合之電氣零件65之連接面的大小。此電氣零件65，如圖2所示，係分別將前端部分之面積較小的第1連接端子67、及前端部分之面積較大的第2連接端子68配置排列成直線狀。如圖5(a)所示，接著膜70之寬度係稍大於電氣零件65之連接面長邊的長度，而第1、第2接著部75、78的反覆間距，亦稍微大於電氣零件65之連接面短邊的長度，且以第1、第2接著部75、78構成連接單位79。
因此，若使用每連接單位79之接著膜70將電氣零件65與配線基板與前述相同地加以對向設置並連接時，則可以導電性粒子之含有率較高的第1接著部75來確實連接電氣零件65之連接端子中前端部分之面積較小的第1連接端子67，並可抑制成本以導電性粒子之含有率較低的第2接著部78來確實連接前端部分之面積較大的第2連接端子68。
本發明之接著膜，第1、第2接著部55、58的設置並無特別限制，例如，亦可如圖6所示之電氣裝置80，在四邊形之電氣零件65以對角線分半的區域，分別設置導電性粒子含有率高的第1接著部85、及導電性粒子含有率低的第2接著部88，以作為接著膜之異向導電性接著劑層82b，形成連接前端面積較小之連接端子與平台部分的第1 連接區域43b、及連接前端面積較大之連接端子與平台部分的第2連接區域44b，藉此，將電氣零件65b連接於配線基板60b。
於本發明中，亦可以導電性粒子含有率不同之3個以上的接著部分來構成未硬化接著劑層，又，如連接端子為焊料凸塊之情形，當期待藉由加熱抵壓以金屬結合連接端子與平台部分時，亦可以導電性粒子之含有率為零的接著部分來構成未硬化接著劑層的一部份或全部。
並且，於本發明之連接方法中，亦可將第1、第2之接著部55、58設置在不同的剝離膜51上，使形成有第1、第2接著部55、58之剝離膜51分別移動於配線基板60上，將第1、第2接著部55、58從不同的剝離膜51上轉附於相同的配線基板60。
又，在將異向導電性接著劑層52設置於配線基板60上之第1、第2平台部分63、64與電機零件65之第1、第2連接端子67、68間進行連接時，亦可先將異向導電性接著劑層52轉附於配線基板60後，再將異向導電性接著劑層52與電機零件65加以密合並連接，或者是先將異向導電性接著劑層52轉附於電氣零件65後，再將配線基板60與異向導電性接著劑層52加以密合並連接。
又，第1、第2接著部55、58設置於配線基板60之方法，例如，亦可準備導電性粒子之含有率彼此不同之糊狀第1、第2異向導電性接著劑，將導電性粒子含量不同之第1、第2異向導電性接著劑塗布於配線基板60與電氣 零件65的其中一方，形成第1、第2接著部55、58，作成異向導電性接著劑層52。
[產業利用性]
本發明之連接膜、連接方法及電氣裝置，適用於需同時進行電連接與機械連接之各種電氣裝置。
40‧‧‧電氣裝置
41‧‧‧第1連接部分
42‧‧‧第2連接部分
43‧‧‧第1連接區域
44‧‧‧第2連接區域
50‧‧‧接著膜
51‧‧‧剝離膜
52‧‧‧異向導電性接著劑層
55‧‧‧第1接著部(異向導電性接著劑層)
56‧‧‧黏合樹脂
58‧‧‧第2接著部(異向導電性接著劑層)
59‧‧‧導電性粒子
60‧‧‧配線基板
61‧‧‧基板本體
63‧‧‧第1平台部分
64‧‧‧第2平台部分
65‧‧‧電氣零件
67‧‧‧第1連接端子
68‧‧‧第2連接端子
70‧‧‧接著膜
71‧‧‧剝離膜
72‧‧‧異向導電性接著劑層
75‧‧‧第1接著部
78‧‧‧第2接著部
79‧‧‧連接單位
80‧‧‧電氣裝置
82b‧‧‧異向導電性接著劑層
85‧‧‧第1接著部
88‧‧‧第2接著部
圖1(a),(b)，係分別用以說明本發明所使用之接著膜之俯視圖及其剖面圖。
圖2，係說明本發明所使用之電氣零件之俯視圖。
圖3(a)~(c)，係說明藉由本發明，將配線基板與電氣裝置加以連接之步驟的剖面圖。
圖4，係說明第2發明之電氣裝置一例的俯視圖。
圖5(a),(b)，係說明本發明之接著膜之俯視圖及其剖面圖。
圖6，係說明本發明之電氣裝置之俯視圖。
40‧‧‧電氣裝置
41‧‧‧第1連接部分
42‧‧‧第2連接部分
43‧‧‧第1連接區域
44‧‧‧第2連接區域
50‧‧‧接著膜
55‧‧‧第1接著部(異向導電性接著劑層)
58‧‧‧第2接著部(異向導電性接著劑層)
65‧‧‧電氣零件
70‧‧‧接著膜
71‧‧‧剝離膜
72‧‧‧異向導電性接著劑層
75‧‧‧第1接著部
78‧‧‧第2接著部
79‧‧‧連接單位

Claims (9)

  1. 一種電氣裝置，具有設置於配線基板上之平台部分、及電氣零件之連接端子彼此對向而以異向導電性接著劑之導電性粒子電連接之連接部分；該連接部分具有第1連接部分、及導電性粒子之含有率小於第1連接部分的第2連接部分。
  2. 如申請專利範圍第1項之電氣裝置，其中，第1連接部分之連接端子前端部分的面積小於第2連接部分之連接端子前端部分的面積。
  3. 一種接著膜，其含有導電性粒子之第1異向導電性接著劑層、及導電性粒子之含有率小於第1異向導電性接著劑層的第2異向導電性接著劑層，係設置在帶狀剝離膜上不同的位置。
  4. 如申請專利範圍第3項之接著膜，其中，第1異向導電性接著劑層、及第2異向導電性接著劑層係沿著剝離膜之長邊方向設置。
  5. 如申請專利範圍第3項之接著膜，其中，第1、第2異向導電性接著劑層構成對應於以接著膜所連接之電氣零件大小之長度的連接單位，該連接單位配置排列在剝離膜的長邊方向。
  6. 一種連接方法，係透過異向導電性接著劑層，將設置於配線基板上之平台部分、及電氣零件之連接端子予以對向設置，對配線基板與電氣零件之其中一者或兩者進行抵壓，而將配線基板之平台部分及電氣零件之連接端子加 以電連接；使得在第1連接端子、及與該第1連接端子相對向配置之平台部分之間的異向導電性接著劑層的導電性粒子含有率，高於在第2連接端子、及與該第2連接端子相對向配置之平台部分之間的異向導電性接著劑層的導電性粒子含有率。
  7. 如申請專利範圍第6項之連接方法，其中，第1連接端子之前端部分的面積小於第2連接端子之前端部分的面積。
  8. 如申請專利範圍第6或7項之連接方法，其中，使申請專利範圍第3至5項中任一項之接著膜移動於配線基板上，將接著膜之第1、第2異向導電性接著劑層轉附於配線基板，藉此將第1、第2異向導電性接著劑層設置在配線基板上。
  9. 如申請專利範圍第7項之連接方法，其中，係使用申請專利範圍第5項之接著膜，按各連接單位將第1、第2異向導電性接著劑層轉附於配線基板上。
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