CN101681855B - 电气装置、连接方法及粘接膜 - Google Patents

电气装置、连接方法及粘接膜 Download PDF

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Publication number
CN101681855B
CN101681855B CN2008800173145A CN200880017314A CN101681855B CN 101681855 B CN101681855 B CN 101681855B CN 2008800173145 A CN2008800173145 A CN 2008800173145A CN 200880017314 A CN200880017314 A CN 200880017314A CN 101681855 B CN101681855 B CN 101681855B
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bond layer
uncured bond
uncured
adhesive
circuit board
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Expired - Fee Related
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CN2008800173145A
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CN101681855A (zh
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小西美佐夫
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Dexerials Corp
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Sony Chemical and Information Device Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
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    • H01L24/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
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    • C09J7/38—Pressure-sensitive adhesives [PSA]
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    • C09J9/02—Electrically-conducting adhesives
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Abstract

在通过固化粘接剂层(12a)来固定布线基板(20)和至少一个面上配置了连接端子(27)的电气部件(25)的电气装置(1)中，固化粘接剂层(12a)具有第一固化区域(15a)和玻璃转变温度比第一固化区域(15a)低的第二固化区域(18a)。将第一固化区域(1a)和第二固化区域(18a)配置在布线基板(20)上的不同位置上。特别是，在连接细长的电气部件(25)时，在第一固化区域(12a)中连接其两端部，在第二固化区域中连接其两端部之间。

Description

电气装置、连接方法及粘接膜
技术领域
本发明涉及电气部件和半导体元件的连接方法。 
背景技术
一直以来，在布线基板上连接诸如半导体元件的电气部件时，使用导电粒子分散在粘合剂(binder)树脂的各向异性导电粘接剂。 
若说明一例连接电气部件和布线基板的工序，则用布线基板和电气部件夹着各向异性导电粘接剂，并按压。从而，电气部件的连接端子的前端部分和布线基板的台垫(land)部分夹着导电粒子，并且粘合剂树脂(粘接剂)被推开，从而使电气部件电连接到布线基板。 
当粘接剂具有热固化性时，在上述的按压时加热并按压，使粘接剂热固化而将电气部件固定于布线基板上。如此，若使用各向异性导电粘接剂，则不管是电气方式还是机械方式都能将电气部件连接至布线基板。 
近年，随着半导体元件的低成本化或细节距(fine pitch)化、电气部件主体的窄边框化等，进行了半导体元件的细长化，但是半导体元件细长的场合，因热固化粘接剂时发生的应力而在半导体元件上发生翘曲，半导体元件的长边方向的两端部从布线基板脱离，使得位于该两端部的连接端子导通不良。 
发明内容
本发明为了解决上述传统技术的不良情况创作而成，其目的在于，提供具备导通可靠性高的连接的电气装置，并提供导通可靠性高的连接方法以及用于该连接方法的粘接膜。 
为了解决上述课题，本发明提供一种电气装置，通过固化粘接剂来固定布线基板和至少在一个面上配置了连接端子的电气部件，固化粘接剂具有第一固化区域和玻璃转变温度比第一固化区域低20～60℃的第二固化区域，第一固化区域和第二固化区域以彼此不重叠且也不隔着间隙的方式配置在布线基板上的不同位置。 
此外，本发明中，作为制造上述电气装置时使用的粘接膜，提供在带状的剥离膜上的不同位置，以彼此不重叠且也不隔着间隙的方式设置了第一未固化粘接剂层和固化后的玻璃转变温度比第一未固化粘接剂层低20～60℃的第二未固化粘接剂层的粘接膜。 
而且，本发明提供一种在制造上述电气装置时使用的连接方法，用固化粘接剂层来固定布线基板和至少在一个面上配置了连接端子的电气部件，在该连接方法中，在布线基板和电气部件之间的不同位置，以彼此不重叠且也不隔着间隙的方式配置第一未固化粘接剂层和固化后的玻璃转变温度比第一未固化粘接剂层低20～60℃的第二未固化粘接剂层，使第一及第二未固化粘接剂层固化，从而将布线基板和电气部件固定。 
(发明效果) 
在本发明的电气装置中，在固定电气部件和布线基板的固化粘接剂的区域，形成有玻璃转变温度彼此不同的第一、第二区域。在此，粘接剂的固化物是玻璃转变温度越高其粘接强度就越高、而玻璃转变温度越低其柔软性就越高的固化物。因而，依据本发明，在玻璃转变温度相对低的第二固化区域中，能够缓冲未固化粘接剂层固化时的应力。特别是，在电气部件细长的场合，通过将第一固化区域配置在电气部件的长边方向两端部，并将玻璃转变温度比第一固化区域低的第二固化区域配置在电气部件的长边方向的中央部分，能够在第二固化区域中缓冲固化时的应力，并且能够在第一固化区域中坚固地固定电气部件的两端部。因而，依据本发明的电气装置，电气部件的两端部不会被剥离，而在该两端部中维持良好的电连接状态。 
再者，在本发明的电气装置中，当电气部件具有第一连接端子和前端部分的面积比第一连接端子大的第二连接端子时，如果用导电粒子含有率高的固化粘接剂层来连接第一连接端子，并且用导电粒子含有率低的固化粘接剂层来连接第二连接端子，则也能提高第一、第二连接端子的任意连接端子的导通可靠性，且能够降低第二连接端子的连接成本。 
此外，依据本发明的连接方法，能够制造本发明的电气装置，依据本发明的粘接膜，由于在剥离膜上具有固化后的玻璃转变温度不同的第一及第二未固化粘接剂层，容易进行本发明的连接方法。 
附图说明
图1是说明本发明中使用的粘接膜的剖视图。 
图2是说明在布线基板上转帖(転着)未固化粘接剂层的工序的图。 
图3是表示按在布线基板的粘接膜的透视图。 
图4的(a)～(d)是说明通过本发明将布线基板和电气部件连接的工序的剖视图。 
图5是说明本发明的粘接膜的平面图。 
图6是说明本发明的粘接膜的平面图。 
图7的(a)是说明本发明的粘接膜的平面图；(b)是其剖视图。 
图8是说明本发明中使用的电气部件的平面图。 
图9的(a)～(c)是说明通过本发明将布线基板和电气装置连接的工序的剖视图。 
图10是说明本发明的电气装置的平面图。 
图11的(a)是说明本发明的粘接膜的平面图；(b)是剖视图。 
图12是说明本发明的粘接膜的平面图。 
图13是说明本发明的电气装置的平面图。 
图14是说明本发明的电气装置的剖视图。 
(符号说明) 
1、1f电气装置；10、10b粘接膜；11剥离膜；12未固化粘接剂层；12a  固化粘接剂层；12f  固化粘接剂层；13f第三固化区域；14连接部分；15、15d、15e第一未固化粘接剂层；15a、15f第一固化区域；16第一粘合剂树脂；17第二粘合剂树脂；18、18d、18e  第二未固化粘接剂层；18a、18f第二固化区域；19导电粒子；19e第三未固化粘接剂层；20布线基板；25电气部件；26部件主体；27连接端子；28固定区域；29、29b、29e连接单位；40电气装置；41第一连接部分；42第二连接部分；43、43b  第一连接区域；44、44b第二连接区域；50粘接膜；51剥离膜；52未固化粘接剂层；52a  固化粘接剂层；55第一粘接部；56第一未固化粘接剂层；56a第一固化区域；57第二未固化粘接剂层；57a第二固化区域；58第二粘接部；59导电粒子；60、60b  布线基板；61基板主体；63第一台垫部分；64第二台垫部分；65、65b  电气部件；66部件主体；67第一连接端子；68第二连接端子；70、70b粘接膜；71剥离膜；72未固化粘接剂层；75第一粘接部；76第一未固化粘接剂层；77第二未固化粘接剂层；78第二粘接部；79连接单位；80电气装置；85第一粘接部；88第二粘接部。 
具体实施方式
以下，基于附图具体说明本发明。此外，在各图中，同一符号表示同一或相等的构成要素。 
图1表示一例本发明的粘接膜10。该粘接膜10具有带状的剥离膜11和配置在剥离膜11上的未固化粘接剂层12。 
在这里，未固化粘接剂层12由第一、第二未固化粘接剂层15、18构成，第一、第二未固化粘接剂层15、18是在固化物的玻璃转变温度彼此不同的热固化性粘合剂树脂(第一、第二粘合剂树脂)16、17中分散了导电粒子19的各向异性导电粘接剂层。第一粘合剂树脂 16的固化物的玻璃转变温度相对于第二粘合剂树脂17的固化物最好高出20～60℃，更好是高出30～50℃。 
如此固化物的玻璃转变温度不同的热固化性粘合剂树脂例如能够由官能团数目彼此不同的环氧树脂构成，更具体地说，第一粘合剂树脂16由官能团数目比第二粘合剂树脂17多的环氧树脂构成。环氧树脂的官能团的数目越多，聚合时的玻璃转变温度就越高，因此第一未固化粘接剂层15固化后的第一固化区域15a的玻璃转变温度，高于第二未固化粘接剂层18固化后的第二固化区域18a的玻璃转变温度(图4(d))。 
用于第一、第二粘合剂树脂16、17的热固化性树脂并不限定于环氧树脂，能够采用三聚氰氨树脂、酚醛树脂、尿素树脂等各种热固化性树脂，也能够将这些树脂单独或混合两种以上而构成第一、第二粘合剂树脂16、17。 
此外，用于第一、第二粘合剂树脂16、17的树脂并不限定于以热固化性树脂为主成分的树脂，在热固化性树脂中添加热塑性树脂等其它树脂也可，此外，也能使用以通过紫外线或可见光等的光照射来固化的光固化性树脂为主成分的树脂。 
此外，为了形成玻璃转变温度彼此不同的第一、第二固化区域，也可以通过改变导电粒子的含有量和种类、以及防老化剂、着色剂、软化剂等添加剂的添加量及种类，来设定第一、第二未固化粘接剂层15、18的固化后的玻璃转变温度不同，以取代使用固化后的玻璃转变温度不同的第一、第二粘合剂树脂16、17的情形。 
另一方，作为导电粒子19，可以单独含有金属粒子或在树脂粒子表面形成有金属被膜层的粒子等，也可以含有两种以上的上述粒子。第一、第二未固化粘接剂层15、18中含有的导电粒子的种类可以彼此相同，也可以彼此不同，此外，第一、第二未固化粘接剂层15、18中含有的导电粒子的含有率也可以彼此相同，也可以彼此不同。 
此外，形成在剥离膜11上的第一、第二未固化粘接剂层15、18 的各膜厚没有特别的限定，但是为了用粘接膜10来将要连接于布线基板20的电气部件25确实地固定于布线基板20，最好为10μm以上40μm以下。 
第一、第二未固化粘接剂层15、18分别沿着剥离膜11的长边方向形成为细的带状。第二未固化粘接剂层18的宽度L2窄于剥离膜11的宽度，第二未固化粘接剂层18配置在剥离膜11的宽度方向的两端部之间，最好配置在中央位置，第一未固化粘接剂层15配置在剥离膜11上的两端部。第一、第二未固化粘接剂层15、18配置成为彼此不重叠，且也不会隔着间隙(图3)。 
该粘接膜10缠成卷(roll)状，如图2所示，粘接膜10的卷物(roll)2装在卷出轴7上，一端从卷物2卷出，在使未固化粘接剂层12的形成面朝向压接台4的状态下，通过按压辊3和压接台4之间而缠到卷绕轴8上。 
另一方面，图4(a)的符号20表示布线基板。在布线基板20中，基板主体21的表面广布布线，且该布线的一部分形成在台垫部分22。此外，图3中被虚线围着的区域28是包含布线基板20的台垫部分22的区域，将电气部件的各连接端子(后述)连接到对应的台垫部分22时，表示电气部件的连接面接触的固定区域。因此，固定区域28的形状成为与电气部件的连接面相同的大小且相同的形状。因而，当电气部件25的连接面为细长的长方形时，固定区域28也成为细长的长方形。 
此外，图4(c)的符号25表示连接到布线基板20的电气部件。该电气部件25为半导体元件，具有细长的部件主体26和配置在部件主体26的细长的面上的多个连接端子27。 
此外，在本发明中，电气部件并不限定于半导体元件，能够使用各种元件。此外，在一个电气部件中，配置了多个连接端子的连接区域的数目既可以是一个也可以是多个，因而，在一个电气装置中的、电气部件与布线基板的连接区域的个数也既可以是一个也可以是多 个。 
作为用粘接膜10来连接布线基板20的台垫部分22与电气部件25的连接端子27的方法，如图2所示，在使按压辊3从压接台4脱离的状态下，将布线基板20使台垫部分22侧的面朝向按压辊3侧地配置在压接台4上。该场合，最好使固定区域28的长边方向p与布线基板20上的粘接膜10的移动方向大致正交，并使未固化粘接剂层12的宽度方向的中心通过固定区域28的长边方向p的中心。 
接着，使粘接膜10移动，将未固化粘接剂层12配置在固定区域28上，用按压辊3将粘接膜10按在布线基板20。粘接膜10的未固化粘接剂层12的宽度L0比布线基板20的固定区域28的长边方向p的长度Lp宽，因此未固化粘接剂层12密合到固定区域28和其长边方向p的离两端部规定量外侧的区域。 
而且，使按压辊3按压比固定区域28的宽度Lq宽的区域的方式移动。从而，未固化粘接剂层12还密合到固定区域28的宽度方向q的离两端部规定量外侧的区域，结果，未固化粘接剂层12粘接到固定区域28和仅比固定区域28的周围宽规定量的区域。 
图3是表示未固化粘接剂层12粘接到布线基板20上的状态的透视图，图4(b)表示图3的A-A线剖视图。如上所述，第二未固化粘接剂层18位于剥离膜11的宽度方向的两端部之间，由于第二未固化粘接剂层18的宽度L2短于固定区域28的长度Lp，第二未固化粘接剂层18粘接到比固定区域28的长边方向p的两端部更靠内侧的区域。 
此外，第一未固化粘接剂层15位于未固化粘接剂层12的宽度方向的两端部，由于未固化粘接剂层12的宽度L0大于固定区域28的长度Lp，第一未固化粘接剂层15粘接到固定区域28的两端部和仅离该两端部规定距离的外侧的区域。 
如此将未固化粘接剂层12粘接在布线基板20的固定区域28上后，通过切断装置9将第一、第二未固化粘接剂层15、18的密合到 布线基板20的部分从其它部分分离，使按压辊3远离压接台4而消除施加到剥离膜11的负荷。由于设第一、第二未固化粘接剂层15、18与剥离膜11之间的粘接力小于第一、第二未固化粘接剂层15、18与布线基板20之间的粘接力，粘接到第一、第二未固化粘接剂层15、18的布线基板20的部分从剥离膜11剥离，并转贴到布线基板20。 
因此，以使图4(c)的电气部件25的配置有连接端子27的面朝向第一、第二未固化粘接剂层15、18，且使各连接端子27与对应的台垫部分22相向的方式，将电气部件25配置在固定区域28上。 
固定区域28的长边方向的长度Lp成为电气部件25的长边方向的长度，因此通过上述的配置，电气部件25的长边方向的中央部分位于第二未固化粘接剂层18的宽度方向的中央部分，电气部件25的长边方向的两端部分别接触于第一未固化粘接剂层15，其两端部之间接触于第二未固化粘接剂层18。 
接着，在该状态下加热并按压电气部件25。若第一、第二未固化粘接剂层15、18升温，则第一、第二粘合剂树脂16、17软化而第一、第二未固化粘接剂层15、18呈现流动性。而且若继续加热并按压，则第一、第二未固化粘接剂层15、18被连接端子27推开，连接端子27和台垫部分22夹着导电粒子19而电连接。 
这时，第一、第二未固化粘接剂层15、18流出到连接端子27与台垫部分22连接的连接部分的周围，第一未固化粘接剂层15在电气部件25的长边方向两端部中填埋部件主体26与基板主体21的间隙，第二未固化粘接剂层18在该两端部之间的位置填埋部件主体26与基板主体21的间隙。 
第一、第二粘合剂树脂16、17具有热固化性，若继续加热并按压，则进行第一、第二粘合剂树脂16、17的聚合反应。因此，第一、第二未固化粘接剂层15、18在电气部件25的长边方向两端部和其之间的位置，以填埋基板主体21与部件主体26的间隙的状态固化，将基板主体21和部件主体26固定。这样，得到电气装置1(图4(d))。 
图4(d)的符号12a表示未固化粘接剂层12固化后的固化粘接剂。第一未固化粘接剂层15在电气部件25的长边方向两端部以与布线基板20和电气部件25密合的状态加以固化，且第二未固化粘接剂层18在它们之间的位置以与布线基板20和电气部件25密合的状态加以固化，因此第一未固化粘接剂层15固化后的第一固化区域15a，在电气部件25的长边方向两端部中与电气部件25和布线基板20密合而将它们固定，第二未固化粘接剂层18固化后的第二固化区域18a，在其两端部之间与电气部件25和布线基板20密合而将它们固定。 
在这里，第一固化区域15a的玻璃转变温度高于第二固化区域18a。 
另一方面，一般粘接剂的固化物具有玻璃转变温度越高就越硬，且玻璃转变温度越低其柔软性就越高的倾向。因此，布线基板20和电气部件25在电气部件25的长边方向的两端部中固定于固化粘接剂层12a硬的区域(第一固化区域15a)，其两端部之间固定于固化粘接剂层12a软的区域(第二固化区域18a)。 
因而，当第一、第二未固化粘接剂层15、18固化时的应力被软的第二固化区域18a所吸收，此外即使因残留应力而电气部件25上发生翘曲，电气部件25的长边方向的两端部在硬的第一固化区域15a坚固地固定，因此该两端部难以从布线基板20剥离。 
而且，在电气部件25长边方向的两端部中，连接端子27和台垫部分22连接的连接部分14固定于硬的第一固化区域15a，因此连接端子27不会从台垫部分22脱离，不会发生导通不良。因而，本发明的电气装置1的导通可靠性高。 
以上，就利用第一未固化粘接剂层15配置在剥离膜11宽度方向的两端部，且在其两端部之间配置了第二未固化粘接剂层18的粘接膜10，将布线基板20和电气部件25连接的方法进行了说明，但本发明并不限定于此，例如，如图5所示的粘接膜10b那样，使用将第一、第二未固化粘接剂层15b、18b在剥离膜11的长边方向交互排列的粘 接膜也可。 
图5中，第一、第二未固化粘接剂层15b、18b分别与图1的第一、第二未固化粘接剂层15、18同样地，用固化物的玻璃转变温度不同的粘接剂形成。 
未固化粘接剂层12b的宽度L0b比上述长方形的固定区域28短边的长度Lq长。此外，未固化粘接剂层12b将仅比固定区域28长边的长度Lp长规定距离的距离，作为由第一、第二未固化粘接剂层15b、18b构成的连接单位29b，沿剥离膜的长边方向排列该连接单位而构成未固化粘接剂层12b。具体地说，在剥离膜的长边方向上，交互配置第一、第二未固化粘接剂层，使得从一个第一未固化粘接剂层15b的中央部到其相邻的第一未固化粘接剂层15b的中央部为止成为连接单位29b。因而，该连接单位29b成为第一未固化粘接剂层15b位于该长边方向的两端部，且第二未固化粘接剂层18b位于其间。 
然后，若将该一个连接单位29b配置在固定区域28上，则如图5所示，固定区域28和其周围的规定量的区域会被一个连接单位29b所覆盖。 
接着，说明利用该粘接膜10b连接上述布线基板20与电气部件25的工序。 
以使固定区域28的长边与粘接膜10b的长边方向平行的方式，将布线基板20配置在压接台4上，使粘接膜10b在布线基板20上沿着粘接膜10b的长边方向移动，当一个连接单位29b成为覆盖固定区域28上的位置时，用按压辊3来将粘接膜10b按到布线基板20。从而，以使固定区域28及其周围的规定区域的范围覆盖连接单位29b的方式粘接。 
在连接单位29b内，固定区域28长边的长度比粘接膜10b长边方向的第二未固化粘接剂层18b的长度长，且比连接单位29b的粘接膜10b长边方向的长度短。此外，在连接单位29b中，在第二未固化粘接剂层18b长边方向的两端部中配置了第一未固化粘接剂层15b。因 此，若固定区域28被连接单位29b所覆盖，则在固定区域28长边方向p的两端部粘接第一未固化粘接剂层15b，在其两端部之间的位置粘接第二未固化粘接剂层18b。 
接着，通过切断装置9将粘接到布线基板20的连接单位29b从未固化粘接剂层12b的其它部分分离，将剥离膜11剥离。从而，连接单位29b从剥离膜11被剥离，转贴到布线基板20。 
然后，在转贴到布线基板20的连接单位29b上，配置电气部件25，使其连接面位于固定区域28的正上方，并使连接端子27与对应的台垫部分22相向。 
电气部件25的平面形状为与固定区域28相同的大小且相同的形状，因此若使电气部件25的连接端子27位于对应的台垫部分22上，并在固定区域28正上方的位置将电气部件25载放于连接单位29b上，则电气部件25的长边方向两端部密合于第一未固化粘接剂层15b，其两端部之间密合于第二未固化粘接剂层18b。 
因此，在该状态下进行加热并按压。从而，电气部件25的长边方向的两端部和布线基板20固定于第一未固化粘接剂层15b固化后的第一固化区域，其两端部之间固定于第二未固化粘接剂层18b固化后的第二固化区域。 
在该粘接膜10b中，第一固化区域的玻璃转变温度也设为比第二固化区域的玻璃转变温度高，因此电气部件25长边方向的两端部用硬的树脂坚固地固定，其两端部之间的部分用软的树脂固定，以缓冲固化时的应力。因而，得到翘曲量小且导通可靠性高的电气装置。 
在本发明的粘接膜中，作为第一、第二未固化粘接剂层的排列方式，如图6所示的粘接膜10e那样，在一个连接单位29e除了设置第一、第二未固化粘接剂层15e、18e以外设置第三未固化粘接剂层19e也可。作为该未固化粘接剂层19e，可以举出例如通过使该粘合剂树脂不同于第一、第二未固化粘接剂层的粘合剂树脂，使固化物的玻璃转变温度低于第二未固化粘接剂层18e的粘接剂层。 
再者，在本发明的连接方法中，将第一、第二未固化粘接剂层15、18配置在分别不同的剥离膜11上，使形成有第一、第二未固化粘接剂层15、18的剥离膜11分别在布线基板20上移动，能够使第一、第二未固化粘接剂层15、18分别从不同的剥离膜11上转贴到相同的布线基板20。 
此外，作为第一、第二未固化粘接剂层15、18对布线基板20的配置方法，例如，可以准备糊(paste)状的第一、第二未固化粘接剂，并将第一未固化粘接剂涂敷到布线基板20中连接电气部件25的长边方向两端部的位置，并将第二未固化粘接剂涂敷到其两端部之间，分别形成第一、第二未固化粘接剂层15、18。 
此外，也可以将第一未固化粘接剂层15配置在电气部件25的长边方向两端部上，将第二未固化粘接剂层18配置在电气部件25的该两端部之间后，在第一、第二未固化粘接剂层15、18上密合布线基板20。 
在本发明中，根据需要，也可以在粘接膜的未固化粘接剂层(各向异性导电粘接剂层)设置导电粒子的含有率不同的区域的区域。 
图7(a)、图7(b)的符号50表示这样的粘接膜，图7(b)是图7(a)的B-B切断线剖视图。该粘接膜50具有带状的剥离膜51和在剥离膜51上配置的、分散了导电粒子59的未固化粘接剂层52。 
未固化粘接剂层52根据其粘合剂的固化物的玻璃转变温度，被划分为第一未固化粘接剂层56和玻璃转变温度比第一未固化粘接剂层低的第二未固化粘接剂层57，而且，根据导电粒子59的含有率，被划分为第一粘接部55和导电粒子59的含有率比第一粘接部55低的第二粘接部58。 
该粘接膜50能够适当地应用在例如连接图8所示的电气部件65和图9(a)所示的布线基板60的场合。 
即，图8的电气部件65具有细长的部件主体66和设置在部件主体66的一个面的第一、第二连接端子67、68。第一连接端子67的前 端部分53的面积小于第二连接端子68的前端部分54的面积。第一连接端子67和第二连接端子68分别排列成直线状，第一连接端子的排列节距窄于第二连接端子68的排列节距。 
另一方面，图9(a)的布线基板60具有基板主体61和配置在基板主体61的一个面的第一、第二台垫部分63、64。该第一、第二台垫部分63、64设置在与上述电气部件65的第一、第二连接端子67、68对应的位置。因而，第一台垫部分63的表面积小于第二台垫部分64的表面积。此外，第一、第二台垫部分63、64分别排列成直线状，但第一台垫部分63的排列节距小于第二台垫部分63的排列节距。 
因此，在布线基板60上连接电气部件65时，首先，将布线基板60以使第一、第二台垫部分63、64的排列方向与粘接膜50的移动方向平行的方式配置在压接台4上，使粘接膜50沿着布线基板60的长边方向移动。从而，在布线基板60长边方向的两端部配置粘接膜50的第一未固化粘接剂层56，在该两端部之间配置第二未固化粘接剂层57，此外，在布线基板60的第一、第二台垫部分63、64的排列上，配置粘接膜50的第一、第二粘接部55、58。然后，将粘接膜50按在布线基板60，使未固化粘接剂层52粘接到布线基板60，用切断装置9，将该未固化粘接剂层52的粘接部分从其它部分分离，将剥离膜51剥离，如图9(b)所示使未固化粘接剂层52转贴到布线基板60。 
接着，在将配置了电气部件65的第一、第二连接端子67、68的面朝向布线基板60一侧的状态下，将电气部件65配置在布线基板60上，使第一、第二连接端子67、68相向于第一、第二台垫部分63、64。 
又，使电气部件65载放于未固化粘接剂层52上，将第一连接端子67的前端部分53密合于第一未固化粘接剂层56的第一粘接部55，使第二连接端子68的前端部分54密合于第二未固化粘接剂层57的第二粘接部58，在此状态下，将电气部件65加热并按压。 
从而，如图9(c)所示，连接端子的前端面积小的第一连接端子 67与第一粘接部55的导电粒子59接触，连接端子的前端面积大的第二连接端子68，与第二粘接部58的导电粒子59接触。 
在此，当导电粒子59的含有率均匀时，导电粒子59接触于第一连接端子67的概率会以变窄的连接面积分量降低，但第一粘接部55的导电粒子59的含有率高于第二粘接部58的导电粒子59的含有率，因此不仅第二连接端子68与导电粒子59接触，而且第一连接端子67也与导电粒子59确实地接触。 
再者，若继续加热并按压，则第一、第二连接端子67、68被按到第一、第二台垫部分63、64，成为接触于各前端部分53、54的导电粒子59被第一、第二连接端子67、68与第一、第二台垫部分63、64夹持的状态。 
在该状态下进行未固化粘接剂层56、57的聚合反应，第一、第二粘接部55、58以包围第一、第二连接端子67、68和第一、第二台垫部分63、64周围的状态加以固化。 
从而，如图10及其C-C切断面即图9(c)所示，得到电气部件65的两端部的第一、第二连接端子67、68在第一固化区域56a中坚固地固定，而它们之间以在第二固化区域57a中缓冲固化时的应力的状态加以固定的电气装置40。 
这样得到的电气装置40的导通可靠性极高。 
此外，如果提高整个未固化粘接剂层52的导电粒子59的含有率就会增加成本，但是按第二粘接部58的导电粒子59的含有率降低的分量，整个未固化粘接剂层52中导电粒子59的含有率降低，因此制造成本也是低价的。 
此外，在图10中，符号43表示置有连接了第一连接端子67和第一台垫部分63的第一连接部分41的第一连接区域，符号44表示置有连接了第二连接端子68和第二台垫部分64的第二连接部分42的第二连接区域。 
在该电气装置40中，例如，布线基板60的电气信号从连接面积 大的第二连接部分42输入至电气部件25，该电气信号在电气部件25中被处理后，从连接面积小的第一连接部分41输出至布线基板60。 
在本发明的粘接膜50中，配置导电粒子的含有率彼此不同的第一、第二粘接部55、58的情形，并不限于上述例，例如，可以如图11所示的粘接膜70那样配置。 
图11(a)表示粘接膜70的平面图，图11(b)表示图11(a)的D-D切断线剖视图。该粘接膜70具有带状的剥离膜71和在剥离膜71表面延伸地设置的未固化粘接剂层72。 
未固化粘接剂层72从固化后的玻璃转变温度的方面来看，带状的粘接膜70的宽度方向的两端部成为第一未固化粘接剂层76，该两端部之间成为固化后的玻璃转变温度比第一未固化粘接剂层76低的第二未固化粘接剂层77。 
此外，未固化粘接剂层72从各向异性导电粒子的含有率的方面来看，在带状的粘接膜70的长边方向上，第一粘接部75和第二粘接部78交互地重复，第一粘接部75的各向异性导电粒子的含有率比第二粘接部78高。 
图11(a)的虚线表示能够用该粘接膜70适当接合的电气部件65的连接面大小。如图8所示，在该电气部件65中，前端部分的面积小的第一连接端子67和前端部分的面积大的第二连接端子68分别排列成直线状。如图11(a)所示，粘接膜70的宽度稍长于电气部件65的连接面的长边的长度，第一、第二粘接部75、78的重复节距稍长于电气部件65的连接面短边的长度，由第一、第二粘接部75、78构成连接单位79。 
因而，若用粘接膜70来连接电气部件65与布线基板，则电气部件65长边方向的两端部能够在玻璃转变温度高的第一固化区域中坚固地连接，且其两端部之间能以缓冲固化时的应力的状态连接在玻璃转变温度低的第二固化区域中，并且前端部分的面积小的第一连接端子67能够确实地在导电粒子的含有率高的第一粘接部75中连接，且 前端部分的面积大的第二连接端子68能够在导电粒子的含有率低的第二粘接部78中抑制制造成本的同时确实地连接。 
在本发明的粘接膜中，第一、第二粘接部55、58的配置也没有特别的限定，例如，可根据粘接的电气部件65的形状、端子排列等，如图12所示的粘接膜70b那样，在粘接膜70b的长边方向上，交互地设置玻璃转变温度相对高的第一未固化粘接剂层15d和玻璃转变温度比它低的第二未固化粘接剂层18d，且各第一、第二未固化粘接剂层15d、18d根据各向异性导电粒子的含有率，区分为第一粘接部75和导电粒子的含有率比它低的第二粘接部78。 
此外，如图13所示的电气装置80那样，在用四边形的电气部件65b的对角线分成两部分的区域中，作为粘接膜的未固化粘接剂层82b，分别独立地配置导电粒子含有率高的第一粘接部85和导电粒子的含有率低的第二粘接部88，通过形成连接了前端面积小的连接端子和台垫部分的第一连接区域43b和连接了前端面积大的连接端子和台垫部分的第二连接区域44b，将电气部件65b连接在布线基板60b也可。该场合，电气部件65b长边方向的两端部也固定于玻璃转变温度高的第一固化区域，其两端部之间也固定于玻璃转变温度低的第二固化区域。 
在本发明中，用导电粒子的含有率不同的3个以上的粘接部分构成未固化粘接剂层也可，此外，如连接端子为焊盘的场合，若能通过加热并按压期待连接端子和台垫部分的金属结合，则将未固化粘接剂层的一部分或全部用导电粒子的含有率为零的粘接部分构成也可。 
再者，在本发明中，不管在未固化粘接剂层设置还是不设置导电粒子的含有率不同的部分，也可以使玻璃转变温度不同的固化区域在布线基板上重叠。 
例如，图14的电气装置1f的固化粘接剂层12f除了具有玻璃转变温度彼此不同的第一、第二固化区域15f、18f外，还具有与第一、第二固化区域15f、18f不同种类的粘接剂固化后的第三固化区域13f， 第三固化区域13f配置在第一、第二固化区域15f、18f的电气部件25侧的面上，并密合于电气部件25的部件主体26。 
第三固化区域13f的膜厚形成为较薄，因此连接端子27的前端部分从第三固化区域13f突出，所以连接端子27的前端部分通过第一、第二固化区域15f、18f来固定。如此通过设置第三固化区域13f，在加热并按压时混合所需量以上的第一、第二固化区域15f、18f，能够防止玻璃转变温度的差异变小的情形。 
实施例 
<实施例1> 
在环氧树脂及固化剂中分散导电粒子而作成了第一粘接剂。此外，向与第一粘接剂不同种类的环氧树脂加入固化剂，分散与第一粘接剂相同种类的导电粒子，导电粒子的含有量(重量％)与第一粘接剂相同，作成了第二粘接剂。 
将第一、第二粘接剂加热而完全固化，测定该固化物的玻璃转变温度的结果，第一粘接剂的固化物的玻璃转变温度为170℃，第二粘接剂的玻璃转变温度为130℃。 
用这些第一、第二粘接剂，如图4(c)所示，在电气部件25与布线基板20之间配置第一、第二未固化粘接剂层15、18，如上述那样加热并按压而作成了实施例1的电气装置1。利用该实施例1的电气装置1进行了下述的试验。 
〔翘曲〕 
使电气部件25一侧的面朝向下侧的状态，将电气装置1载放于水平盘上，使电气部件25长边方向的两端部密合于水平盘表面，将在电气部件25的从水平盘相离的部分中，到水平盘的距离最长的部分的距离设为翘曲量。 
〔导通电阻〕 
测定了电气装置1的在电气部件25的长边方向端部位置的连接部分14的电阻值。电阻值越低，导通可靠性就越高。 
〔耐久性〕 
在85℃、相对湿度85％的条件下将电气装置1放置1000小时后，观察了电气部件25是否从固化粘接剂层12a剥离。将上述试验的结果记载于下述表1中。 
[表1] 
评价试验的结果 
    实施例1   比较例1   比较例2
  翘曲   12μm   15μm   11μm
  导通电阻   10Ω   30Ω   60Ω
  耐久性   无剥离   有剥离   无剥离
<比较例1> 
只将上述实施例1的第一粘接剂的未固化粘接剂层配置在电气部件25长边方向的两端部与中央部分这两部分上，加热并按压而作成了比较例1的电气装置。 
<比较例2> 
只将上述实施例1的第二粘接剂的未固化粘接剂层配置在电气部件25长边方向的两端部与中央部分这两部分上，加热并按压而作成了比较例2的电气装置。 
利用比较例1、2的电气装置，进行了上述“翘曲”、“导通电阻”及“耐久性”的各评价试验。将各评价试验的结果记载于上述表1中。由上述表1可知，只用固化物的玻璃转变温度高的第一粘接剂的比较例1的翘曲大，观察到电气部件的剥离。只用固化物的玻璃转变温度低的第二粘接剂的比较例2和用第一、第二粘接剂的实施例1中，用第二粘接剂来缓冲了应力，因此翘曲量小，且看不到电气部件的剥离。但是，与实施例1中导通电阻的值也降低的情形相比，比较例2由于固定电气部件的长边方向端部的连接部分的固化粘接剂层的强度低，导通电阻值高。 
由以上可知，如果在电气部件长边方向的两端部配置固化后的玻 璃转变温度高的粘接剂，且在其两端部之间配置固化后的玻璃转变温度低的粘接剂，从而将电气部件连接到布线基板，则能得到翘曲量小且导通可靠性高的电气装置1。 
产业上的利用可能性 
本发明的连接膜、连接方法及电气装置用于需要同时进行电连接和机械连接的各种电气装置。 

Claims (10)

1.一种粘接膜，其中，第一未固化粘接剂层和固化后的玻璃转变温度比第一未固化粘接剂层低20～60℃的第二未固化粘接剂层，以彼此不重叠且也不隔着间隙的方式设置在带状的剥离膜上的不同位置；
所述第一未固化粘接剂层和所述第二未固化粘接剂层的膜厚为10μm以上40μm以下；
所述第一未固化粘接剂层和所述第二未固化粘接剂层分别沿着所述剥离膜的长边方向形成为细的带状，所述第二未固化粘接剂层的宽度窄于所述剥离膜的宽度，所述第二未固化粘接剂层配置在所述剥离膜的宽度方向的两端部之间，所述第一未固化粘接剂层配置在所述剥离膜上的两端部。
2.如权利要求1所述的粘接膜，其中，第一未固化粘接剂层和第二未固化粘接剂层沿着剥离膜的长边方向延伸地设置。
3.如权利要求2所述的粘接膜，其中，第一未固化粘接剂层位于剥离膜宽度方向的两端部上，在该两端部之间置有第二未固化粘接剂层。
4.如权利要求1所述的粘接膜，其中，玻璃转变温度彼此不同的第一及第二未固化粘接剂层构成其长度对应于电气部件大小的连接单位，该连接单位沿剥离膜长边方向排列。
5.如权利要求1至4中任一项所述的粘接膜，其中，第一和/或第二未固化粘接剂层是含有导电粒子的各向异性导电粘接剂层。
6.如权利要求5所述的粘接膜，其中，第一各向异性导电粘接剂层和导电粒子的含有率比第一各向异性导电粘接剂层低的第二各向异性导电粘接剂层，设置在剥离膜上的不同位置上。
7.一种连接方法，用固化粘接剂来将布线基板和至少在一个面配置了连接端子的电气部件进行固定，其中，在布线基板与电气部件之间的不同位置上，以彼此不重叠且也不隔着间隙的方式配置第一未固化粘接剂层和固化后的玻璃转变温度比第一未固化粘接剂层低20～60℃的第二未固化粘接剂层，使第一及第二未固化粘接剂层固化，将布线基板和电气部件固定，
将所述第一未固化粘接剂层和所述第二未固化粘接剂层的膜厚设定为10μm以上40μm以下；
将所述第一未固化粘接剂层和所述第二未固化粘接剂层分别沿着剥离膜的长边方向形成为细的带状，使所述第二未固化粘接剂层的宽度窄于所述剥离膜的宽度，将所述第二未固化粘接剂层配置在所述剥离膜的宽度方向的两端部之间，将所述第一未固化粘接剂层配置在所述剥离膜上的两端部。
8.如权利要求7所述的连接方法，其中，将第一未固化粘接剂层配置在电气部件长边方向的两端部，在该两端部之间配置第二未固化粘接剂层，在此状态下，使第一及第二未固化粘接剂层固化。
9.如权利要求7或8所述的连接方法，其中，通过使权利要求1至6中任一项所述的粘接膜在布线基板上移动，且使粘接膜的第一及第二未固化粘接剂层转贴到布线基板，在布线基板配置第一及第二未固化粘接剂层。
10.如权利要求9所述的连接方法，其中，使用权利要求4所述的粘接膜，按每个连接单位将第一及第二未固化粘接剂层转贴到布线基板。
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