JP2009004768A - 電気装置、接続方法及び接着フィルム - Google Patents
電気装置、接続方法及び接着フィルム Download PDFInfo
- Publication number
- JP2009004768A JP2009004768A JP2008136369A JP2008136369A JP2009004768A JP 2009004768 A JP2009004768 A JP 2009004768A JP 2008136369 A JP2008136369 A JP 2008136369A JP 2008136369 A JP2008136369 A JP 2008136369A JP 2009004768 A JP2009004768 A JP 2009004768A
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- Prior art keywords
- connection
- anisotropic conductive
- wiring board
- connection terminal
- adhesive
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L24/10—Bump connectors ; Manufacturing methods related thereto
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- H01L24/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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Abstract
【解決手段】
配線基板60上に配置されたランド部分63、64と、電気部品65の接続端子67、68とが互いに対向し、異方導電接着剤の導電性粒子59によって電気的に接続されている接続部分41、42を有する電気装置40であって、
接続部分として、第一の接続部分41と、第一の接続部分よりも導電性粒子の含有率が少ない第二の接続部分42を設ける。
【選択図】図4
Description
接続部分として、第一の接続部分と、第一の接続部分よりも導電性粒子の含有率が少ない第二の接続部分を有する電気装置を提供する。
第一の接続端子と該第一の接続端子と対向配置したランド部分との間の異方導電性接着剤層の導電性粒子の含有率を、第二の接続端子と該第二の接続端子と対向配置したランド部分との間の異方導電性接着剤層の導電性粒子の含有率よりも高くする接続方法を提供する。
この接着フィルム50は帯状の剥離フィルム51と、剥離フィルム51上に配置され、導電性粒子59が分散された異方導電性接着剤層52とを有している。
41 第一の接続部分
42 第二の接続部分
50 接着フィルム
51 剥離フィルム
52 異方導電接着剤層
55 第一の接着部(異方導電接着剤層)
56 バインダー樹脂
58 第二の接着部(異方導電接着剤層)
59 導電性粒子
60 配線基板
63 第一のランド部分
64 第二のランド部分
65 電気部品
67 第一の接続端子
68 第二の接続端子
70 接着フィルム
71 剥離フィルム
72 異方導電性接着剤層
75 第一の接着部
78 第二の接着部
80 電気装置
82b 異方導電接着剤層
85 第一の接着部
88 第二の接着部
Claims (9)
- 配線基板上に配置されたランド部分と、電気部品の接続端子とが互いに対向し、異方導電接着剤の導電性粒子によって電気的に接続されている接続部分を有する電気装置であって、
接続部分として、第一の接続部分と、第一の接続部分よりも導電性粒子の含有率が少ない第二の接続部分を有する電気装置。 - 第一の接続部分の接続端子の先端部分の面積が、第二の接続部分の接続端子の先端部分の面積よりも狭い請求項1記載の電気装置。
- 導電性粒子を含有する第一の異方導電性接着剤層と、第一の異方導電性接着剤層よりも導電性粒子の含有率が低い第二の異方導性電接着剤層とが、帯状の剥離フィルム上の異なる位置に設けられた接着フィルム。
- 第一の異方導電性接着剤層と第二の異方導性電接着剤層とが剥離フィルムの長手方向に沿って設けられた請求項3記載の接着フィルム。
- 第一、第二の異方導電性接着剤層が、接着フィルムで接続する電気部品の大きさに応じた長さの接続単位を構成し、該接続単位が剥離フィルムの長手方向に配列している請求項3記載の接着フィルム。
- 配線基板上に配置されたランド部分と、電気部品の接続端子とを、異方導電性接着剤層を介して対向配置し、配線基板と電気部品のいずれか一方又は両方を押圧し、配線基板のランド部分と、電気部品の接続端子とを電気的に接続する接続方法であって、
第一の接続端子と該第一の接続端子と対向配置したランド部分との間の異方導電性接着剤層の導電性粒子の含有率を、第二の接続端子と該第二の接続端子と対向配置したランド部分との間の異方導電性接着剤層の導電性粒子の含有率よりも高くする接続方法。 - 第一の接続端子の先端部分の面積は、第二の接続端子の先端部分の面積よりも小さい請求項6記載の接続方法。
- 請求項3〜5のいずれかに記載の接着フィルムを配線基板上に走行させ、接着フィルムの第一、第二の異方導電性接着剤層を配線基板に転着させることにより、第一、第二の異方導電性接着剤層を配線基板上に配置する請求項6又は7記載の接続方法。
- 請求項5記載の接着フィルムを使用し、接続単位ごとに第一、第二の異方導電性接着剤層を配線基板上に転着させる請求項7記載の接続方法。
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WO2014034102A1 (ja) * | 2012-09-03 | 2014-03-06 | シャープ株式会社 | 表示装置及びその製造方法 |
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JP5608504B2 (ja) * | 2010-10-06 | 2014-10-15 | デクセリアルズ株式会社 | 接続方法及び接続構造体 |
KR101712043B1 (ko) * | 2010-10-14 | 2017-03-03 | 삼성전자주식회사 | 적층 반도체 패키지, 상기 적층 반도체 패키지를 포함하는 반도체 장치 및 상기 적층 반도체 패키지의 제조 방법 |
CN103828493A (zh) * | 2011-09-12 | 2014-05-28 | 名幸电子有限公司 | 元器件内置基板的制造方法及使用该制造方法的元器件内置基板 |
JP5926590B2 (ja) * | 2012-03-23 | 2016-05-25 | デクセリアルズ株式会社 | 接続体の製造方法、及び電子部品の接続方法 |
JP6307308B2 (ja) * | 2014-03-06 | 2018-04-04 | デクセリアルズ株式会社 | 接続構造体の製造方法、及び回路接続材料 |
JP6241326B2 (ja) * | 2014-03-07 | 2017-12-06 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
JP2016001574A (ja) * | 2014-06-12 | 2016-01-07 | 株式会社デンソー | ラミネート外装電池 |
JP6759578B2 (ja) * | 2014-12-22 | 2020-09-23 | デクセリアルズ株式会社 | 異方導電性フィルム及び接続構造体 |
JP7305957B2 (ja) * | 2016-10-03 | 2023-07-11 | 株式会社レゾナック | 導電性フィルム、巻回体、接続構造体、及び接続構造体の製造方法 |
TWI763750B (zh) * | 2016-12-01 | 2022-05-11 | 日商迪睿合股份有限公司 | 異向性導電膜 |
WO2018101108A1 (ja) * | 2016-12-01 | 2018-06-07 | デクセリアルズ株式会社 | 異方性導電フィルム |
KR102066934B1 (ko) * | 2018-07-11 | 2020-01-16 | 주식회사 비에이치 | Pen fpcb를 이용한 접합 방법 및 이를 이용해 제조된 대면적 pen fpcb 조립체 |
TWI724911B (zh) * | 2020-05-26 | 2021-04-11 | 友達光電股份有限公司 | 發光裝置及其製造方法 |
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JP2004071857A (ja) * | 2002-08-07 | 2004-03-04 | Sharp Corp | 基板接続部の構造、並びに該構造を有する電子部品及び液晶表示装置 |
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WO2014034102A1 (ja) * | 2012-09-03 | 2014-03-06 | シャープ株式会社 | 表示装置及びその製造方法 |
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TW200850094A (en) | 2008-12-16 |
CN101681855B (zh) | 2013-03-13 |
TW200847866A (en) | 2008-12-01 |
TWI387412B (zh) | 2013-02-21 |
KR101203017B1 (ko) | 2012-11-20 |
JP5152499B2 (ja) | 2013-02-27 |
CN101681855A (zh) | 2010-03-24 |
JP2009004767A (ja) | 2009-01-08 |
KR20090085017A (ko) | 2009-08-06 |
JP5013114B2 (ja) | 2012-08-29 |
HK1139506A1 (en) | 2010-09-17 |
TWI422294B (zh) | 2014-01-01 |
WO2008146793A1 (ja) | 2008-12-04 |
WO2008143358A1 (ja) | 2008-11-27 |
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