KR101081263B1 - 접착 시트, 이를 이용한 회로 부재의 접속 구조 및 반도체 장치 - Google Patents

접착 시트, 이를 이용한 회로 부재의 접속 구조 및 반도체 장치 Download PDF

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KR101081263B1
KR101081263B1 KR1020087029928A KR20087029928A KR101081263B1 KR 101081263 B1 KR101081263 B1 KR 101081263B1 KR 1020087029928 A KR1020087029928 A KR 1020087029928A KR 20087029928 A KR20087029928 A KR 20087029928A KR 101081263 B1 KR101081263 B1 KR 101081263B1
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South Korea
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adhesive
film
circuit
adhesive sheet
adhesive layer
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KR1020087029928A
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English (en)
Korean (ko)
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KR20090010105A (ko
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가즈야 사또
마사끼 후지이
데쯔유끼 시라까와
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히다치 가세고교 가부시끼가이샤
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Publication of KR20090010105A publication Critical patent/KR20090010105A/ko
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    • C09J7/00—Adhesives in the form of films or foils
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
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    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
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    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
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