KR101059431B1 - 마운팅 장치 및 마운팅 방법 - Google Patents

마운팅 장치 및 마운팅 방법 Download PDF

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Publication number
KR101059431B1
KR101059431B1 KR1020067006894A KR20067006894A KR101059431B1 KR 101059431 B1 KR101059431 B1 KR 101059431B1 KR 1020067006894 A KR1020067006894 A KR 1020067006894A KR 20067006894 A KR20067006894 A KR 20067006894A KR 101059431 B1 KR101059431 B1 KR 101059431B1
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KR
South Korea
Prior art keywords
dicing tape
ring frame
semiconductor wafer
strip
shaped material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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KR1020067006894A
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English (en)
Korean (ko)
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KR20060125720A (ko
Inventor
마사키 츠지모토
켄지 코바야시
타카히사 요시오카
Original Assignee
린텍 가부시키가이샤
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Publication of KR20060125720A publication Critical patent/KR20060125720A/ko
Application granted granted Critical
Publication of KR101059431B1 publication Critical patent/KR101059431B1/ko
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Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1075—Prior to assembly of plural laminae from single stock and assembling to each other or to additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1084—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing of continuous or running length bonded web
    • Y10T156/1085—One web only
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1317—Means feeding plural workpieces to be joined
    • Y10T156/1322—Severing before bonding or assembling of parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1317—Means feeding plural workpieces to be joined
    • Y10T156/1322—Severing before bonding or assembling of parts
    • Y10T156/1339—Delivering cut part in sequence to serially conveyed articles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1348—Work traversing type
    • Y10T156/1352—Work traversing type with liquid applying means

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
KR1020067006894A 2003-10-10 2004-09-29 마운팅 장치 및 마운팅 방법 Expired - Lifetime KR101059431B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2003-00351900 2003-10-10
JP2003351900A JP4444619B2 (ja) 2003-10-10 2003-10-10 マウント装置及びマウント方法
PCT/JP2004/014198 WO2005036628A1 (ja) 2003-10-10 2004-09-29 マウント装置及びマウント方法

Publications (2)

Publication Number Publication Date
KR20060125720A KR20060125720A (ko) 2006-12-06
KR101059431B1 true KR101059431B1 (ko) 2011-08-25

Family

ID=34431094

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067006894A Expired - Lifetime KR101059431B1 (ko) 2003-10-10 2004-09-29 마운팅 장치 및 마운팅 방법

Country Status (8)

Country Link
US (1) US8196632B2 (enExample)
EP (1) EP1672684B1 (enExample)
JP (1) JP4444619B2 (enExample)
KR (1) KR101059431B1 (enExample)
CN (1) CN100437918C (enExample)
SG (1) SG147427A1 (enExample)
TW (1) TW200514188A (enExample)
WO (1) WO2005036628A1 (enExample)

Cited By (1)

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WO2013100477A1 (ko) * 2011-12-27 2013-07-04 제일모직주식회사 다이싱 다이본딩 필름 및 다이싱 다이본딩 필름에 홈을 형성하는 방법

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JP4795743B2 (ja) * 2005-05-19 2011-10-19 リンテック株式会社 貼付装置
JP4541237B2 (ja) * 2005-06-29 2010-09-08 リンテック株式会社 半導体ウエハ処理テープ巻装体およびそれを用いた半導体ウエハ処理テープ貼着装置ならびに半導体ウエハ加工処理装置
JP4441450B2 (ja) * 2005-07-07 2010-03-31 リンテック株式会社 シート貼付装置及び貼付方法
JP4441451B2 (ja) * 2005-07-07 2010-03-31 リンテック株式会社 シート貼付装置
JP2007043057A (ja) * 2005-07-07 2007-02-15 Lintec Corp シート貼付用テーブル
WO2007018041A1 (ja) * 2005-08-11 2007-02-15 Lintec Corporation シート貼付装置及び貼付方法
JP4468884B2 (ja) * 2005-12-09 2010-05-26 リンテック株式会社 テープ貼付装置、マウント装置及びマウント方法
JP4360684B2 (ja) * 2006-02-22 2009-11-11 日東電工株式会社 半導体ウエハの粘着テープ貼付け方法およびこれを用いた装置
JP4884075B2 (ja) 2006-05-22 2012-02-22 株式会社東京精密 テープ貼付方法およびテープ貼付装置
JP5112984B2 (ja) * 2008-08-06 2013-01-09 リンテック株式会社 シート貼付装置及び貼付方法
JP4995796B2 (ja) * 2008-09-30 2012-08-08 日東電工株式会社 粘着テープ貼付け方法および粘着テープ貼付け装置
JP5006300B2 (ja) * 2008-10-23 2012-08-22 リンテック株式会社 マウント装置及びマウント方法
JP5412226B2 (ja) * 2009-10-01 2014-02-12 日東電工株式会社 粘着テープ貼付け装置
JP5529503B2 (ja) * 2009-11-13 2014-06-25 リンテック株式会社 帯状体の巻取装置及び巻取方法
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JP4568374B1 (ja) 2010-03-15 2010-10-27 大宮工業株式会社 貼付装置及び貼付方法
US9056400B2 (en) * 2010-06-07 2015-06-16 Cbw Automation, Inc. Apparatus and process for in-mold labeling
US8640755B2 (en) * 2010-10-05 2014-02-04 Skyworks Solutions, Inc. Securing mechanism and method for wafer bonder
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JP5916295B2 (ja) * 2011-04-22 2016-05-11 古河電気工業株式会社 ウエハ加工用テープおよびウエハ加工用テープを用いて半導体装置を製造する方法
JP5897856B2 (ja) * 2011-09-28 2016-04-06 リンテック株式会社 シート製造装置及び製造方法
US9079351B2 (en) * 2012-06-22 2015-07-14 Wisconsin Alumni Research Foundation System for transfer of nanomembrane elements with improved preservation of spatial integrity
JP5945493B2 (ja) * 2012-10-31 2016-07-05 リンテック株式会社 シート貼付装置および貼付方法
KR101981639B1 (ko) * 2012-11-13 2019-05-27 삼성디스플레이 주식회사 시트 커팅 장치 및 그것을 이용한 시트 커팅 방법
CN104347354A (zh) * 2013-08-07 2015-02-11 日东电工株式会社 粘合带粘贴方法及粘合带粘贴装置
CN103625691A (zh) * 2013-12-20 2014-03-12 广东远东食品包装机械有限公司 一种拉纸缓冲机构
US9613845B2 (en) * 2014-01-17 2017-04-04 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion de-taping
JP6054466B2 (ja) * 2015-05-15 2016-12-27 リンテック株式会社 シート製造装置
JP6543152B2 (ja) * 2015-09-30 2019-07-10 リンテック株式会社 シート貼付装置および貼付方法並びに接着シート原反
KR101694498B1 (ko) * 2016-10-07 2017-01-10 조상희 소파 밴드 고정장치
JP6779579B2 (ja) * 2017-01-31 2020-11-04 株式会社ディスコ 判定方法、測定装置、及び粘着テープ貼着装置
JP7154737B2 (ja) 2017-03-27 2022-10-18 リンテック株式会社 シート貼付装置および貼付方法
JP6901322B2 (ja) 2017-05-31 2021-07-14 株式会社ディスコ 保護テープの貼着装置
JP6920113B2 (ja) * 2017-06-16 2021-08-18 株式会社ディスコ テープ形成装置
CN107158783B (zh) * 2017-06-20 2022-11-25 利辛县飞达网业有限公司 一种过滤网自动装填装置
CN107244134A (zh) * 2017-08-02 2017-10-13 江苏万果保鲜科技有限公司 点胶覆膜机及其薄膜张紧度控制系统
TWI670199B (zh) * 2018-01-24 2019-09-01 林俊宏 捲帶式電子模組自動化加工裝置
DE102018132750A1 (de) * 2018-12-18 2020-06-18 Bundesdruckerei Gmbh Vorrichtung und verfahren zur anbringung einer klebstoffschicht an einem klebstofflosen einband eines ausweis-, wert- oder sicherheitsdokument
WO2020196795A1 (ja) * 2019-03-27 2020-10-01 三井化学東セロ株式会社 貼着装置
TWI738049B (zh) * 2019-09-04 2021-09-01 志聖工業股份有限公司 層膜裁切裝置、層膜裁切方法、晶圓貼膜機以及晶圓貼膜方法
US12202094B2 (en) * 2021-07-09 2025-01-21 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for chemical mechanical polishing pad replacement
CN114121736B (zh) * 2022-01-28 2022-06-21 新恒汇电子股份有限公司 引线框架双面揭膜系统
CN115959512A (zh) * 2023-02-15 2023-04-14 苏州盈科电子有限公司 背胶粘贴设备
CN117260883B (zh) * 2023-08-23 2025-12-19 深圳市领略数控设备有限公司 模切方法及模切设备

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Publication number Priority date Publication date Assignee Title
WO2013100477A1 (ko) * 2011-12-27 2013-07-04 제일모직주식회사 다이싱 다이본딩 필름 및 다이싱 다이본딩 필름에 홈을 형성하는 방법
CN104024359A (zh) * 2011-12-27 2014-09-03 第一毛织株式会社 切割芯片接合膜和用于在该切割芯片接合膜上形成切口的方法

Also Published As

Publication number Publication date
KR20060125720A (ko) 2006-12-06
SG147427A1 (en) 2008-11-28
TWI331786B (enExample) 2010-10-11
CN100437918C (zh) 2008-11-26
CN1868038A (zh) 2006-11-22
EP1672684B1 (en) 2015-12-09
JP4444619B2 (ja) 2010-03-31
TW200514188A (en) 2005-04-16
US20070131344A1 (en) 2007-06-14
EP1672684A4 (en) 2010-05-26
EP1672684A1 (en) 2006-06-21
JP2005116928A (ja) 2005-04-28
US8196632B2 (en) 2012-06-12
WO2005036628A1 (ja) 2005-04-21

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