JP6901322B2 - 保護テープの貼着装置 - Google Patents
保護テープの貼着装置 Download PDFInfo
- Publication number
- JP6901322B2 JP6901322B2 JP2017107769A JP2017107769A JP6901322B2 JP 6901322 B2 JP6901322 B2 JP 6901322B2 JP 2017107769 A JP2017107769 A JP 2017107769A JP 2017107769 A JP2017107769 A JP 2017107769A JP 6901322 B2 JP6901322 B2 JP 6901322B2
- Authority
- JP
- Japan
- Prior art keywords
- protective tape
- release paper
- wafer
- tip
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000001681 protective effect Effects 0.000 title claims description 140
- 238000005452 bending Methods 0.000 claims description 26
- 239000012790 adhesive layer Substances 0.000 claims description 22
- 239000000853 adhesive Substances 0.000 claims description 18
- 230000001070 adhesive effect Effects 0.000 claims description 18
- 238000004804 winding Methods 0.000 claims description 16
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 239000002390 adhesive tape Substances 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 39
- 238000000034 method Methods 0.000 description 20
- 239000010410 layer Substances 0.000 description 3
- 239000003522 acrylic cement Substances 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- -1 polyethylene vinyl chloride Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
- B32B2037/268—Release layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
- B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
- B32B2310/0831—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/14—Semiconductor wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Fluid Mechanics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Plasma & Fusion (AREA)
- Thermal Sciences (AREA)
Description
11:基台
20:保持テーブル(保持手段)
30:移動手段
40:シート送り手段
41:支持ローラ
50:折り曲げプレート(折り曲げ手段)
52:押圧ローラ
56:紫外線照射器
60:シート
62:保護テープ
64:剥離紙
70:剥離紙巻取手段
71:巻取ローラ
R:保護テープロール
W:ウエーハ
Claims (1)
- 紫外線の照射によって粘着力が低下する粘着層を有する保護テープをウエーハに貼着する保護テープの貼着装置であって、
ウエーハを保持する保持手段と、
ウエーハの大きさに対応した大きさの保護テープの粘着層が剥離紙に対面して貼着されたシートを保護テープロールから送り出すシート送り手段と、
該剥離紙を巻き取る剥離紙巻取手段と、
該剥離紙を折り曲げて引っ張り該剥離紙から剥離した保護テープの先端部を該保持手段に保持されたウエーハに貼着する折り曲げ手段と、
該粘着層の反対側をローラで押圧して保護テープの粘着層をウエーハに密着させると共に、該剥離紙を更に引っ張り該剥離紙から粘着テープを完全に剥離して保護テープをウエーハに貼着する貼着手段と、
を少なくとも含み構成され、
該折り曲げ手段により保護テープの剥離を開始させる先端部に予めスポット的に紫外線を照射して剥離起点を形成する紫外線照射器を、該保護テープロールと該折り曲げ手段との間に備えている保護テープの貼着装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017107769A JP6901322B2 (ja) | 2017-05-31 | 2017-05-31 | 保護テープの貼着装置 |
KR1020180054886A KR102464297B1 (ko) | 2017-05-31 | 2018-05-14 | 보호 테이프의 첩착 방법 및 보호 테이프 첩착 장치 |
SG10201804288UA SG10201804288UA (en) | 2017-05-31 | 2018-05-21 | Protective tape attaching method and protective tape attaching apparatus |
CN201810498742.XA CN108987325B (zh) | 2017-05-31 | 2018-05-23 | 保护带的粘贴方法和保护带粘贴装置 |
US15/988,953 US10622230B2 (en) | 2017-05-31 | 2018-05-24 | Protective tape attaching method |
TW107118266A TWI751342B (zh) | 2017-05-31 | 2018-05-29 | 保護膠帶黏貼方法以及保護膠帶黏貼裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017107769A JP6901322B2 (ja) | 2017-05-31 | 2017-05-31 | 保護テープの貼着装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018206833A JP2018206833A (ja) | 2018-12-27 |
JP6901322B2 true JP6901322B2 (ja) | 2021-07-14 |
Family
ID=64460829
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017107769A Active JP6901322B2 (ja) | 2017-05-31 | 2017-05-31 | 保護テープの貼着装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10622230B2 (ja) |
JP (1) | JP6901322B2 (ja) |
KR (1) | KR102464297B1 (ja) |
CN (1) | CN108987325B (ja) |
SG (1) | SG10201804288UA (ja) |
TW (1) | TWI751342B (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9777195B2 (en) | 2010-06-22 | 2017-10-03 | Zagg Intellectual Property Holding Co., Inc. | Dry apply protective systems and methods |
US9580626B2 (en) | 2010-06-22 | 2017-02-28 | Zagg Intellectual Property Holding Co., Inc. | Systems for securing protective films to surfaces of substrates |
WO2011163416A2 (en) | 2010-06-22 | 2011-12-29 | Zagg Intellectual Property Holding Co., Inc. | Protective films for dry application to protected surfaces, installation assemblies and kits including the films, devices protected with the films, and associated methods |
WO2012031127A2 (en) | 2010-09-01 | 2012-03-08 | Timothy Andrew Chaves | Protective covering for an electronic device |
TWI685905B (zh) * | 2017-07-12 | 2020-02-21 | 日商新川股份有限公司 | 接合裝置和接合方法 |
JP7555259B2 (ja) | 2020-12-21 | 2024-09-24 | 日機装株式会社 | 剥離機構及びこれを用いた積層装置 |
JP2023050847A (ja) * | 2021-09-30 | 2023-04-11 | 株式会社ディスコ | 被加工物の分割方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3560823B2 (ja) * | 1998-08-18 | 2004-09-02 | リンテック株式会社 | ウェハ転写装置 |
JP4154067B2 (ja) | 1999-04-06 | 2008-09-24 | 株式会社ディスコ | 研削装置 |
JP3408805B2 (ja) | 2000-09-13 | 2003-05-19 | 浜松ホトニクス株式会社 | 切断起点領域形成方法及び加工対象物切断方法 |
JP2002367931A (ja) * | 2001-06-07 | 2002-12-20 | Lintec Corp | ダイボンディングシート貼着装置およびダイボンディングシートの貼着方法 |
JP2004047823A (ja) * | 2002-07-12 | 2004-02-12 | Tokyo Seimitsu Co Ltd | ダイシングテープ貼付装置およびバックグラインド・ダイシングテープ貼付システム |
JP2004304133A (ja) * | 2003-04-01 | 2004-10-28 | Lintec Corp | ウェハ処理装置 |
JP4444619B2 (ja) | 2003-10-10 | 2010-03-31 | リンテック株式会社 | マウント装置及びマウント方法 |
JP4505798B2 (ja) * | 2003-11-10 | 2010-07-21 | 日立化成工業株式会社 | 粘接着シート |
JP2007081060A (ja) * | 2005-09-13 | 2007-03-29 | Furukawa Electric Co Ltd:The | ウエハ加工用粘接着テープ |
JP5216393B2 (ja) * | 2008-04-08 | 2013-06-19 | リンテック株式会社 | 半導体ウエハ処理用接着シート |
JP5691230B2 (ja) * | 2010-04-14 | 2015-04-01 | 日立化成株式会社 | 接着シート及び接着シートロール |
JP2011199307A (ja) * | 2011-06-06 | 2011-10-06 | Hitachi Chem Co Ltd | 半導体装置の製造方法 |
JP2014007230A (ja) * | 2012-06-22 | 2014-01-16 | Hitachi Chemical Co Ltd | ウェハ加工用テープ、ウェハ加工用テープの製造方法、及び半導体装置の製造方法 |
JP5981822B2 (ja) * | 2012-09-27 | 2016-08-31 | リンテック株式会社 | シート貼付装置およびシート貼付方法 |
KR102544301B1 (ko) * | 2014-03-26 | 2023-06-15 | 린텍 가부시키가이샤 | 수지막 형성용 시트 적층체 |
-
2017
- 2017-05-31 JP JP2017107769A patent/JP6901322B2/ja active Active
-
2018
- 2018-05-14 KR KR1020180054886A patent/KR102464297B1/ko active IP Right Grant
- 2018-05-21 SG SG10201804288UA patent/SG10201804288UA/en unknown
- 2018-05-23 CN CN201810498742.XA patent/CN108987325B/zh active Active
- 2018-05-24 US US15/988,953 patent/US10622230B2/en active Active
- 2018-05-29 TW TW107118266A patent/TWI751342B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN108987325B (zh) | 2024-02-20 |
TWI751342B (zh) | 2022-01-01 |
JP2018206833A (ja) | 2018-12-27 |
TW201903868A (zh) | 2019-01-16 |
KR20180131392A (ko) | 2018-12-10 |
US20180350641A1 (en) | 2018-12-06 |
SG10201804288UA (en) | 2018-12-28 |
US10622230B2 (en) | 2020-04-14 |
KR102464297B1 (ko) | 2022-11-04 |
CN108987325A (zh) | 2018-12-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6901322B2 (ja) | 保護テープの貼着装置 | |
JP4851415B2 (ja) | 紫外線照射方法およびこれを用いた装置 | |
JP6316673B2 (ja) | テープ貼着装置 | |
JP5937404B2 (ja) | 保護テープ剥離方法および保護テープ剥離装置 | |
JP2007311735A (ja) | 保護テープ剥離方法およびこれを用いた装置 | |
KR102649172B1 (ko) | 시트 확장 장치 | |
JP2008205363A (ja) | 粘着テープ貼付け装置 | |
JP2010272755A (ja) | 保護テープ貼付け方法および保護テープ貼付け装置 | |
JP2015053473A (ja) | 粘着テープ貼付け方法および粘着テープ貼付け装置 | |
JP2007227552A (ja) | 半導体ウエハの粘着テープ貼付け方法およびこれを用いた装置 | |
CN103579066B (zh) | 半导体晶圆的固定方法及半导体晶圆的固定装置 | |
JP2016111055A (ja) | 貼付装置 | |
JP2010147123A (ja) | シート剥離装置及び剥離方法 | |
TW201413806A (zh) | 保護帶剝離方法及保護帶剝離裝置 | |
JP2017137115A (ja) | シート供給装置および供給方法 | |
JP2005019841A (ja) | 紫外線硬化型粘着テープの貼付け方法およびその装置並びにそれを用いて形成した物品 | |
JP6963483B2 (ja) | 剥離用テープカッター | |
JP2018149632A (ja) | 吸着テープ自動貼着装置および吸着テープ自動貼着方法 | |
JP2021068789A (ja) | シート剥離装置 | |
JP2021048378A (ja) | シート貼付装置およびシート貼付方法 | |
JP2017163093A (ja) | シート貼付装置および貼付方法 | |
JP7551373B2 (ja) | シート貼付装置およびシート貼付方法 | |
JP2009111056A (ja) | シート剥離装置及び剥離方法 | |
JP5564097B2 (ja) | シート貼り換え装置及びシート貼り換え方法 | |
JP2024077207A (ja) | シート供給装置およびシート供給方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20200306 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20210129 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210209 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210407 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20210525 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210617 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6901322 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |