KR100945622B1 - 전자 부품 모듈 - Google Patents
전자 부품 모듈 Download PDFInfo
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- KR100945622B1 KR100945622B1 KR1020070085318A KR20070085318A KR100945622B1 KR 100945622 B1 KR100945622 B1 KR 100945622B1 KR 1020070085318 A KR1020070085318 A KR 1020070085318A KR 20070085318 A KR20070085318 A KR 20070085318A KR 100945622 B1 KR100945622 B1 KR 100945622B1
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- wiring board
- electronic component
- component module
- wiring
- spiral coil
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/642—Capacitive arrangements
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- H01L23/64—Impedance arrangements
- H01L23/645—Inductive arrangements
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H01L2924/01079—Gold [Au]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/19015—Structure including thin film passive components
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0574—Stacked resist layers used for different processes
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4685—Manufacturing of cross-over conductors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
Abstract
Description
Claims (12)
- 배선 기판과,상기 배선 기판 상에 형성된 제1 스파이럴 코일과,상기 제1 스파이럴 코일의 상방에 공극을 두고 형성된 제2 스파이럴 코일과,상기 배선 기판에 실장된 적어도 하나의 디바이스 칩을 구비하고,상기 제1 스파이럴 코일과 상기 제2 스파이럴 코일은, 직렬로 접속되고, 각각을 흐르는 전류가 동일 방향으로 되는 나선 형상을 갖고,상기 제1 스파이럴 코일과 상기 제2 스파이럴 코일 중 적어도 한쪽과, 상기 디바이스 칩과의 사이에 공극이 존재하는 전자 부품 모듈.
- 삭제
- 삭제
- 제1항에 있어서,입체 배선을 더 구비하고, 그 입체 배선은, 상기 배선 기판에 접하여 연장되는 제1 배선부와, 상기 배선 기판으로부터 이격하여 그 배선 기판을 따라 연장되는 제2 배선부와, 상기 배선 기판의 두께 방향으로 연장되는 제3 배선부를 포함하는 전자 부품 모듈.
- 제1항에 있어서,상기 디바이스 칩은, 상기 제2 스파이럴 코일의 상위에 위치하는 전자 부품 모듈.
- 제1항에 있어서,상기 배선 기판은, 적어도 하나의 내부 배선층을 갖는 다층 배선 기판인 전자 부품 모듈.
- 제6항에 있어서,상기 다층 배선 기판은, 적층된 복수의 세라믹층을 포함하는 다층 세라믹 배선 기판인 전자 부품 모듈.
- 제1항에 있어서,상기 배선 기판은, 그 배선 기판을 관통하는 비아를 갖는 전자 부품 모듈.
- 삭제
- 삭제
- 배선 기판과,상기 배선 기판 상에 형성된 제1 스파이럴 코일과,상기 제1 스파이럴 코일의 상방에 공극을 두고 형성된 제2 스파이럴 코일과,상기 배선 기판에 실장된 적어도 하나의 디바이스 칩을 구비하고,상기 제1 스파이럴 코일과 상기 제2 스파이럴 코일은, 직렬로 접속되고, 각각을 흐르는 전류가 동일 방향으로 되는 나선 형상을 갖고 있는 전자 부품 모듈.
- 배선 기판과,상기 배선 기판 상에 형성된 제1 스파이럴 코일과,상기 제1 스파이럴 코일의 상방에 공극을 두고 형성된 제2 스파이럴 코일과,상기 배선 기판에 실장된 적어도 하나의 디바이스 칩을 구비하고,상기 제1 스파이럴 코일과 상기 제2 스파이럴 코일 중 적어도 한쪽과, 상기 디바이스 칩과의 사이에 공극이 존재하는 전자 부품 모듈.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JPJP-P-2006-00235727 | 2006-08-31 | ||
JP2006235727A JP4722795B2 (ja) | 2006-08-31 | 2006-08-31 | 配線基板および電子部品モジュール |
Publications (2)
Publication Number | Publication Date |
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KR20080021515A KR20080021515A (ko) | 2008-03-07 |
KR100945622B1 true KR100945622B1 (ko) | 2010-03-04 |
Family
ID=39151210
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070085318A KR100945622B1 (ko) | 2006-08-31 | 2007-08-24 | 전자 부품 모듈 |
Country Status (4)
Country | Link |
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US (1) | US8345438B2 (ko) |
JP (1) | JP4722795B2 (ko) |
KR (1) | KR100945622B1 (ko) |
CN (1) | CN101136397B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101436462B1 (ko) | 2013-05-06 | 2014-09-01 | 한국과학기술원 | 관통 실리콘 비아 연결성 탐침 소자, 이를 포함하는 연결성 측정 장치 및 방법 |
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JP4434268B2 (ja) * | 2007-11-28 | 2010-03-17 | Tdk株式会社 | 電子部品モジュール |
JP5154262B2 (ja) * | 2008-02-26 | 2013-02-27 | 太陽誘電株式会社 | 電子部品 |
US8217514B2 (en) * | 2008-04-07 | 2012-07-10 | Stats Chippac Ltd. | Integrated circuit packaging system with warpage control system and method of manufacture thereof |
JP2010004028A (ja) * | 2008-05-23 | 2010-01-07 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法、及び半導体装置 |
US20100019346A1 (en) * | 2008-07-28 | 2010-01-28 | Mete Erturk | Ic having flip chip passive element and design structure |
US20100022063A1 (en) * | 2008-07-28 | 2010-01-28 | Mete Erturk | Method of forming on-chip passive element |
JPWO2010095201A1 (ja) * | 2009-02-20 | 2012-08-16 | パナソニック株式会社 | 半導体装置及び半導体装置の製造方法 |
US9607935B2 (en) * | 2009-04-21 | 2017-03-28 | Ati Technologies Ulc | Semiconductor chip package with undermount passive devices |
US8058934B2 (en) * | 2009-06-03 | 2011-11-15 | Qualcomm Incorporated | Apparatus and method for frequency generation |
CN102460686B (zh) * | 2009-06-30 | 2016-01-06 | 日本电气株式会社 | 半导体器件、用于半导体器件的安装基板以及制造安装基板的方法 |
EP2309829A1 (en) * | 2009-09-24 | 2011-04-13 | Harman Becker Automotive Systems GmbH | Multilayer circuit board |
JP5401292B2 (ja) * | 2009-12-15 | 2014-01-29 | ルネサスエレクトロニクス株式会社 | 半導体装置及び通信方法 |
FR2961345A1 (fr) * | 2010-06-10 | 2011-12-16 | St Microelectronics Tours Sas | Circuit integre passif |
KR101088824B1 (ko) * | 2010-06-16 | 2011-12-06 | 주식회사 하이닉스반도체 | 모듈 기판, 이를 갖는 메모리 모듈 및 메모리 모듈 형성방법 |
CN103681539B (zh) * | 2013-12-18 | 2016-06-08 | 江阴长电先进封装有限公司 | 一种集成共模电感的封装结构及其封装方法 |
JP6310371B2 (ja) * | 2014-09-11 | 2018-04-11 | 太陽誘電株式会社 | 弾性波デバイス |
US9553079B1 (en) * | 2015-12-15 | 2017-01-24 | International Business Machines Corporation | Flip chip assembly with connected component |
JP7266996B2 (ja) | 2018-11-20 | 2023-05-01 | 太陽誘電株式会社 | インダクタ、フィルタおよびマルチプレクサ |
US11495588B2 (en) | 2018-12-07 | 2022-11-08 | Advanced Micro Devices, Inc. | Circuit board with compact passive component arrangement |
CN110176437B (zh) * | 2019-05-31 | 2020-11-03 | 合肥圣达电子科技实业有限公司 | 一种窄间距陶瓷接线柱及其制备方法 |
CN110386586A (zh) * | 2019-08-16 | 2019-10-29 | 中电科技集团重庆声光电有限公司 | 一种光电隔离通用片式can总线微系统封装结构 |
CN111968995B (zh) * | 2020-07-13 | 2024-02-09 | 深圳市汇芯通信技术有限公司 | 一种集成无源器件及其制作方法和集成电路 |
DE112022003019T5 (de) * | 2021-06-11 | 2024-04-25 | Microchip Technology Incorporated | Erfassungsspule zur induktiven linearpositionserfassung und zugehörige vorrichtungen, systeme und verfahren |
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CN101136397A (zh) | 2008-03-05 |
US8345438B2 (en) | 2013-01-01 |
JP2008060342A (ja) | 2008-03-13 |
CN101136397B (zh) | 2011-11-23 |
JP4722795B2 (ja) | 2011-07-13 |
US20080055873A1 (en) | 2008-03-06 |
KR20080021515A (ko) | 2008-03-07 |
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