JP2009164219A - 電子部品の製造方法 - Google Patents
電子部品の製造方法 Download PDFInfo
- Publication number
- JP2009164219A JP2009164219A JP2007340037A JP2007340037A JP2009164219A JP 2009164219 A JP2009164219 A JP 2009164219A JP 2007340037 A JP2007340037 A JP 2007340037A JP 2007340037 A JP2007340037 A JP 2007340037A JP 2009164219 A JP2009164219 A JP 2009164219A
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- oxide film
- ceramic substrate
- multilayer ceramic
- passive element
- film
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/19015—Structure including thin film passive components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Integrated Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
【解決手段】本発明は、貫通電極12を有する多層セラミック基板20上に感光性SOG酸化膜26を形成する工程と、貫通電極12の上面が露出するように、感光性SOG酸化膜26に露光現像を行うことにより開口部25を形成する工程と、感光性SOG酸化膜26上に開口部25を介し貫通電極12と接続する受動素子を形成する工程と、を有する電子部品の製造方法である。
【選択図】図7
Description
12 貫通電極
20 多層セラミック基板
22、32 保護膜
26 感光性SOG酸化膜
28 別の感光性SOG酸化膜
40、140 キャパシタ
50、110、120 インダクタ
Claims (5)
- 貫通電極を有する多層セラミック基板上に感光性SOG酸化膜を形成する工程と、
前記貫通電極の上面が露出するように、前記感光性SOG酸化膜に露光現像を行うことにより開口部を形成する工程と、
前記感光性SOG酸化膜上に前記開口部を介し前記貫通電極と接続する受動素子を形成する工程と、
を有することを特徴とする電子部品の製造方法。 - 前記多層セラミック基板は金属酸化物からなることを特徴とする請求項1記載の電子部品の製造方法。
- 前記受動素子はインダクタ、またはインダクタとコンデンサと、であることを特徴とする請求項1または2記載の電子部品の製造方法。
- 前記セラミック基板の下面に別の感光性SOG酸化膜を形成する工程と、
前記貫通電極の下面が露出するように、前記別の感光性SOG酸化膜に開口部を形成する工程と、
を有することを特徴とする請求項1から3のいずれか一項記載の電子部品の製造方法。 - 前記感光性SOG酸化膜上にスパイラル状の第1コイルを形成する工程と、
前記第1コイル上方に空隙を介し離間してスパイラル状の第2コイルを形成する工程と、を具備することを特徴とする請求項1から4のいずれか一項記載の電子部品。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007340037A JP5133047B2 (ja) | 2007-12-28 | 2007-12-28 | 電子部品の製造方法 |
US12/343,935 US8221962B2 (en) | 2007-12-28 | 2008-12-24 | Method of manufacturing electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007340037A JP5133047B2 (ja) | 2007-12-28 | 2007-12-28 | 電子部品の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009164219A true JP2009164219A (ja) | 2009-07-23 |
JP5133047B2 JP5133047B2 (ja) | 2013-01-30 |
Family
ID=40798883
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007340037A Expired - Fee Related JP5133047B2 (ja) | 2007-12-28 | 2007-12-28 | 電子部品の製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8221962B2 (ja) |
JP (1) | JP5133047B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012221983A (ja) * | 2011-04-04 | 2012-11-12 | Murata Mfg Co Ltd | セラミック基板 |
US11069615B2 (en) | 2018-11-20 | 2021-07-20 | Taiyo Yuden Co., Ltd. | Inductor, filter, and multiplexer |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015048808A1 (en) * | 2013-09-30 | 2015-04-02 | Wolf Joseph Ambrose | Silver thick film paste hermetically sealed by surface thin film multilayer |
KR101940981B1 (ko) | 2014-05-05 | 2019-01-23 | 3디 글래스 솔루션즈 인코포레이티드 | 2d 및 3d 인덕터 안테나 및 변압기 제작 광 활성 기판 |
CN105742251B (zh) * | 2014-12-09 | 2019-10-18 | 联华电子股份有限公司 | 具有电感和金属-绝缘层-金属电容的结构 |
WO2017147511A1 (en) | 2016-02-25 | 2017-08-31 | 3D Glass Solutions, Inc. | 3d capacitor and capacitor array fabricating photoactive substrates |
WO2017177171A1 (en) | 2016-04-08 | 2017-10-12 | 3D Glass Solutions, Inc. | Methods of fabricating photosensitive substrates suitable for optical coupler |
EP3616254B1 (en) | 2017-04-28 | 2023-06-14 | 3D Glass Solutions, Inc. | Rf circulator |
CA3067812C (en) | 2017-07-07 | 2023-03-14 | 3D Glass Solutions, Inc. | 2d and 3d rf lumped element devices for rf system in a package photoactive glass substrates |
US10854946B2 (en) | 2017-12-15 | 2020-12-01 | 3D Glass Solutions, Inc. | Coupled transmission line resonate RF filter |
CA3082624C (en) | 2018-01-04 | 2022-12-06 | 3D Glass Solutions, Inc. | Impedance matching conductive structure for high efficiency rf circuits |
EP3643148A4 (en) | 2018-04-10 | 2021-03-31 | 3D Glass Solutions, Inc. | RF INTEGRATED POWER STATE CAPACITOR |
WO2019231947A1 (en) | 2018-05-29 | 2019-12-05 | 3D Glass Solutions, Inc. | Low insertion loss rf transmission line |
AU2019344542B2 (en) | 2018-09-17 | 2022-02-24 | 3D Glass Solutions, Inc. | High efficiency compact slotted antenna with a ground plane |
JP7257707B2 (ja) | 2018-12-28 | 2023-04-14 | スリーディー グラス ソリューションズ,インク | 環状コンデンサrf、マイクロ波及びmm波システム |
KR102393450B1 (ko) | 2018-12-28 | 2022-05-04 | 3디 글래스 솔루션즈 인코포레이티드 | 광활성 유리 기판들에서 rf, 마이크로파, 및 mm 파 시스템들을 위한 이종 통합 |
JP7140435B2 (ja) | 2019-04-05 | 2022-09-21 | スリーディー グラス ソリューションズ,インク | ガラスベースの空基板集積導波路デバイス |
WO2020214788A1 (en) | 2019-04-18 | 2020-10-22 | 3D Glass Solutions, Inc. | High efficiency die dicing and release |
CA3177603C (en) | 2020-04-17 | 2024-01-09 | 3D Glass Solutions, Inc. | Broadband induction |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS63299394A (ja) * | 1987-05-29 | 1988-12-06 | Matsushita Electric Ind Co Ltd | 印刷配線板 |
JPH06283846A (ja) * | 1993-03-24 | 1994-10-07 | Ngk Spark Plug Co Ltd | ビア付き配線基板及びその製造方法 |
JP2002033560A (ja) * | 2000-07-17 | 2002-01-31 | Alps Electric Co Ltd | 電子回路基板の製造方法 |
JP2004304154A (ja) * | 2003-03-28 | 2004-10-28 | Northrop Grumman Corp | Mems可変インダクタ及びキャパシタ |
JP2007031242A (ja) * | 2005-07-29 | 2007-02-08 | Tdk Corp | 薄膜電子部品用基板とそれを用いた薄膜電子部品の製造方法 |
JP2007149827A (ja) * | 2005-11-25 | 2007-06-14 | Fujitsu Ltd | 電子部品製造方法および電子部品 |
Family Cites Families (10)
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JPH0461264A (ja) | 1990-06-29 | 1992-02-27 | Nippon Telegr & Teleph Corp <Ntt> | Lc複合素子 |
US5370766A (en) * | 1993-08-16 | 1994-12-06 | California Micro Devices | Methods for fabrication of thin film inductors, inductor networks and integration with other passive and active devices |
US5743998A (en) * | 1995-04-19 | 1998-04-28 | Park Scientific Instruments | Process for transferring microminiature patterns using spin-on glass resist media |
US5891606A (en) * | 1996-10-07 | 1999-04-06 | Motorola, Inc. | Method for forming a high-density circuit structure with interlayer electrical connections method for forming |
JP2001332859A (ja) * | 2000-05-22 | 2001-11-30 | Murata Mfg Co Ltd | 積層型セラミック電子部品およびその製造方法ならびに電子装置 |
JP2003287875A (ja) * | 2002-01-24 | 2003-10-10 | Hitachi Ltd | マスクの製造方法および半導体集積回路装置の製造方法 |
WO2005048667A1 (ja) * | 2003-11-14 | 2005-05-26 | Murata Manufacturing Co., Ltd. | 導電性ペーストおよび多層セラミック基板 |
JP4762531B2 (ja) | 2004-11-30 | 2011-08-31 | 太陽誘電株式会社 | 電子部品及びその製造方法 |
JP4707056B2 (ja) | 2005-08-31 | 2011-06-22 | 富士通株式会社 | 集積型電子部品および集積型電子部品製造方法 |
JP4872306B2 (ja) | 2005-10-27 | 2012-02-08 | Tdk株式会社 | 薄膜電子部品用基板の製造方法及びそれを用いた薄膜電子部品の製造方法 |
-
2007
- 2007-12-28 JP JP2007340037A patent/JP5133047B2/ja not_active Expired - Fee Related
-
2008
- 2008-12-24 US US12/343,935 patent/US8221962B2/en not_active Expired - Fee Related
Patent Citations (6)
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JPS63299394A (ja) * | 1987-05-29 | 1988-12-06 | Matsushita Electric Ind Co Ltd | 印刷配線板 |
JPH06283846A (ja) * | 1993-03-24 | 1994-10-07 | Ngk Spark Plug Co Ltd | ビア付き配線基板及びその製造方法 |
JP2002033560A (ja) * | 2000-07-17 | 2002-01-31 | Alps Electric Co Ltd | 電子回路基板の製造方法 |
JP2004304154A (ja) * | 2003-03-28 | 2004-10-28 | Northrop Grumman Corp | Mems可変インダクタ及びキャパシタ |
JP2007031242A (ja) * | 2005-07-29 | 2007-02-08 | Tdk Corp | 薄膜電子部品用基板とそれを用いた薄膜電子部品の製造方法 |
JP2007149827A (ja) * | 2005-11-25 | 2007-06-14 | Fujitsu Ltd | 電子部品製造方法および電子部品 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012221983A (ja) * | 2011-04-04 | 2012-11-12 | Murata Mfg Co Ltd | セラミック基板 |
US11069615B2 (en) | 2018-11-20 | 2021-07-20 | Taiyo Yuden Co., Ltd. | Inductor, filter, and multiplexer |
Also Published As
Publication number | Publication date |
---|---|
JP5133047B2 (ja) | 2013-01-30 |
US8221962B2 (en) | 2012-07-17 |
US20090170032A1 (en) | 2009-07-02 |
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