CN101136397B - 电子部件模块及其制造方法 - Google Patents
电子部件模块及其制造方法 Download PDFInfo
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- CN101136397B CN101136397B CN2007101471628A CN200710147162A CN101136397B CN 101136397 B CN101136397 B CN 101136397B CN 2007101471628 A CN2007101471628 A CN 2007101471628A CN 200710147162 A CN200710147162 A CN 200710147162A CN 101136397 B CN101136397 B CN 101136397B
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- wiring substrate
- electronic component
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- component module
- passive
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
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- H—ELECTRICITY
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- H01L23/645—Inductive arrangements
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- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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- H—ELECTRICITY
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- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
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- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/19015—Structure including thin film passive components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0574—Stacked resist layers used for different processes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4685—Manufacturing of cross-over conductors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006235727 | 2006-08-31 | ||
JP2006235727A JP4722795B2 (ja) | 2006-08-31 | 2006-08-31 | 配線基板および電子部品モジュール |
JP2006-235727 | 2006-08-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101136397A CN101136397A (zh) | 2008-03-05 |
CN101136397B true CN101136397B (zh) | 2011-11-23 |
Family
ID=39151210
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007101471628A Active CN101136397B (zh) | 2006-08-31 | 2007-08-30 | 电子部件模块及其制造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8345438B2 (zh) |
JP (1) | JP4722795B2 (zh) |
KR (1) | KR100945622B1 (zh) |
CN (1) | CN101136397B (zh) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4434268B2 (ja) * | 2007-11-28 | 2010-03-17 | Tdk株式会社 | 電子部品モジュール |
JP5154262B2 (ja) * | 2008-02-26 | 2013-02-27 | 太陽誘電株式会社 | 電子部品 |
US8217514B2 (en) * | 2008-04-07 | 2012-07-10 | Stats Chippac Ltd. | Integrated circuit packaging system with warpage control system and method of manufacture thereof |
JP2010004028A (ja) * | 2008-05-23 | 2010-01-07 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法、及び半導体装置 |
US20100022063A1 (en) * | 2008-07-28 | 2010-01-28 | Mete Erturk | Method of forming on-chip passive element |
US20100019346A1 (en) * | 2008-07-28 | 2010-01-28 | Mete Erturk | Ic having flip chip passive element and design structure |
JPWO2010095201A1 (ja) * | 2009-02-20 | 2012-08-16 | パナソニック株式会社 | 半導体装置及び半導体装置の製造方法 |
US9607935B2 (en) * | 2009-04-21 | 2017-03-28 | Ati Technologies Ulc | Semiconductor chip package with undermount passive devices |
US8058934B2 (en) * | 2009-06-03 | 2011-11-15 | Qualcomm Incorporated | Apparatus and method for frequency generation |
CN102460686B (zh) * | 2009-06-30 | 2016-01-06 | 日本电气株式会社 | 半导体器件、用于半导体器件的安装基板以及制造安装基板的方法 |
EP2309829A1 (en) * | 2009-09-24 | 2011-04-13 | Harman Becker Automotive Systems GmbH | Multilayer circuit board |
JP5401292B2 (ja) * | 2009-12-15 | 2014-01-29 | ルネサスエレクトロニクス株式会社 | 半導体装置及び通信方法 |
FR2961345A1 (fr) * | 2010-06-10 | 2011-12-16 | St Microelectronics Tours Sas | Circuit integre passif |
KR101088824B1 (ko) * | 2010-06-16 | 2011-12-06 | 주식회사 하이닉스반도체 | 모듈 기판, 이를 갖는 메모리 모듈 및 메모리 모듈 형성방법 |
KR101436462B1 (ko) | 2013-05-06 | 2014-09-01 | 한국과학기술원 | 관통 실리콘 비아 연결성 탐침 소자, 이를 포함하는 연결성 측정 장치 및 방법 |
CN103681539B (zh) * | 2013-12-18 | 2016-06-08 | 江阴长电先进封装有限公司 | 一种集成共模电感的封装结构及其封装方法 |
JP6310371B2 (ja) * | 2014-09-11 | 2018-04-11 | 太陽誘電株式会社 | 弾性波デバイス |
US9553079B1 (en) * | 2015-12-15 | 2017-01-24 | International Business Machines Corporation | Flip chip assembly with connected component |
JP7266996B2 (ja) | 2018-11-20 | 2023-05-01 | 太陽誘電株式会社 | インダクタ、フィルタおよびマルチプレクサ |
US11495588B2 (en) | 2018-12-07 | 2022-11-08 | Advanced Micro Devices, Inc. | Circuit board with compact passive component arrangement |
CN110176437B (zh) * | 2019-05-31 | 2020-11-03 | 合肥圣达电子科技实业有限公司 | 一种窄间距陶瓷接线柱及其制备方法 |
CN110386586A (zh) * | 2019-08-16 | 2019-10-29 | 中电科技集团重庆声光电有限公司 | 一种光电隔离通用片式can总线微系统封装结构 |
CN111968995B (zh) * | 2020-07-13 | 2024-02-09 | 深圳市汇芯通信技术有限公司 | 一种集成无源器件及其制作方法和集成电路 |
CN117501071A (zh) * | 2021-06-11 | 2024-02-02 | 微芯片技术股份有限公司 | 用于感应线性位置感测的感测线圈以及相关设备、系统和方法 |
CN117716209A (zh) | 2021-08-05 | 2024-03-15 | 微芯片技术股份有限公司 | 感应角位置传感器以及相关设备、系统和方法 |
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CN101136397A (zh) | 2008-03-05 |
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US8345438B2 (en) | 2013-01-01 |
US20080055873A1 (en) | 2008-03-06 |
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