KR100925603B1 - 적층형 캐패시터 - Google Patents

적층형 캐패시터 Download PDF

Info

Publication number
KR100925603B1
KR100925603B1 KR1020070098300A KR20070098300A KR100925603B1 KR 100925603 B1 KR100925603 B1 KR 100925603B1 KR 1020070098300 A KR1020070098300 A KR 1020070098300A KR 20070098300 A KR20070098300 A KR 20070098300A KR 100925603 B1 KR100925603 B1 KR 100925603B1
Authority
KR
South Korea
Prior art keywords
electrodes
internal
external
external electrodes
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020070098300A
Other languages
English (en)
Korean (ko)
Other versions
KR20090032798A (ko
Inventor
이병화
위성권
박상수
박민철
박동석
정해석
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020070098300A priority Critical patent/KR100925603B1/ko
Priority to US12/237,837 priority patent/US7675733B2/en
Priority to JP2008248334A priority patent/JP4900842B2/ja
Publication of KR20090032798A publication Critical patent/KR20090032798A/ko
Application granted granted Critical
Publication of KR100925603B1 publication Critical patent/KR100925603B1/ko
Priority to JP2011138774A priority patent/JP5118237B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
KR1020070098300A 2007-09-28 2007-09-28 적층형 캐패시터 Expired - Fee Related KR100925603B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020070098300A KR100925603B1 (ko) 2007-09-28 2007-09-28 적층형 캐패시터
US12/237,837 US7675733B2 (en) 2007-09-28 2008-09-25 Multilayer capacitor
JP2008248334A JP4900842B2 (ja) 2007-09-28 2008-09-26 積層型キャパシタ
JP2011138774A JP5118237B2 (ja) 2007-09-28 2011-06-22 積層型キャパシタ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070098300A KR100925603B1 (ko) 2007-09-28 2007-09-28 적층형 캐패시터

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020090078303A Division KR100946101B1 (ko) 2009-08-24 2009-08-24 적층형 캐패시터

Publications (2)

Publication Number Publication Date
KR20090032798A KR20090032798A (ko) 2009-04-01
KR100925603B1 true KR100925603B1 (ko) 2009-11-06

Family

ID=40508016

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070098300A Expired - Fee Related KR100925603B1 (ko) 2007-09-28 2007-09-28 적층형 캐패시터

Country Status (3)

Country Link
US (1) US7675733B2 (enExample)
JP (2) JP4900842B2 (enExample)
KR (1) KR100925603B1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101504017B1 (ko) * 2013-07-11 2015-03-18 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100887108B1 (ko) * 2007-06-14 2009-03-04 삼성전기주식회사 저ｅｓｌ을 갖는 제어된 ｅｓｒ 적층형 칩 커패시터의구현방법
KR101053410B1 (ko) * 2009-07-17 2011-08-01 삼성전기주식회사 적층형 칩 커패시터
JP4983874B2 (ja) * 2009-08-05 2012-07-25 Ｔｄｋ株式会社 積層コンデンサアレイの実装構造
JP5589994B2 (ja) * 2011-09-01 2014-09-17 株式会社村田製作所 選択方法
JP6282388B2 (ja) * 2011-10-24 2018-02-21 デクセリアルズ株式会社 静電容量素子、及び共振回路
KR101514514B1 (ko) * 2013-04-22 2015-04-22 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR102061504B1 (ko) * 2013-04-22 2020-02-17 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR101994712B1 (ko) * 2013-04-22 2019-09-30 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR101994713B1 (ko) 2013-04-22 2019-07-01 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR101994711B1 (ko) * 2013-04-22 2019-07-01 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
JP6142651B2 (ja) * 2013-05-08 2017-06-07 Tdk株式会社 積層コンデンサ
KR101994717B1 (ko) * 2013-07-15 2019-07-01 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR101514532B1 (ko) * 2013-07-22 2015-04-22 삼성전기주식회사 적층 세라믹 커패시터
US9653212B2 (en) 2013-08-13 2017-05-16 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and board for mounting thereof
KR20140038876A (ko) * 2013-08-13 2014-03-31 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
JP6137069B2 (ja) * 2013-10-01 2017-05-31 株式会社村田製作所 コンデンサの実装構造体及びコンデンサ
KR102083993B1 (ko) * 2013-10-31 2020-03-03 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR101548814B1 (ko) * 2013-11-08 2015-08-31 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR101499725B1 (ko) 2013-11-08 2015-03-06 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR101499724B1 (ko) * 2013-11-08 2015-03-06 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR101514565B1 (ko) * 2013-11-14 2015-04-22 삼성전기주식회사 적층 세라믹 전자 부품 및 적층 세라믹 전자 부품의 실장 기판
WO2015098990A1 (ja) 2013-12-24 2015-07-02 京セラ株式会社 積層型電子部品およびその実装構造体
JP2015153800A (ja) * 2014-02-12 2015-08-24 株式会社村田製作所 電子部品及び電子部品の実装構造体
KR102089693B1 (ko) * 2014-05-07 2020-03-16 삼성전기주식회사 적층 세라믹 커패시터
JP5725240B2 (ja) * 2014-06-02 2015-05-27 株式会社村田製作所 電子部品及び実装構造体
KR102016485B1 (ko) * 2014-07-28 2019-09-02 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR102097324B1 (ko) 2014-08-14 2020-04-06 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR101973419B1 (ko) * 2014-09-23 2019-04-29 삼성전기주식회사 복합 전자 부품 및 그 실장 기판
KR102037268B1 (ko) * 2014-10-15 2019-10-29 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR102183424B1 (ko) * 2015-07-06 2020-11-26 삼성전기주식회사 적층 전자부품 및 적층 전자부품의 실장 기판
JP2017112170A (ja) 2015-12-15 2017-06-22 株式会社村田製作所 コンデンサ
JP2017143129A (ja) * 2016-02-09 2017-08-17 株式会社村田製作所 積層セラミックコンデンサ
JP2017143130A (ja) * 2016-02-09 2017-08-17 株式会社村田製作所 電子部品
KR102449360B1 (ko) * 2017-06-02 2022-10-04 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
US10062511B1 (en) * 2017-06-08 2018-08-28 Samsung Electro-Mechanics Co., Ltd. Multilayer electronic component and board having the same
JP2020077792A (ja) * 2018-11-08 2020-05-21 株式会社村田製作所 積層セラミックコンデンサの実装構造体
JP7156914B2 (ja) 2018-11-13 2022-10-19 株式会社村田製作所 積層セラミックコンデンサ、及び、積層セラミックコンデンサの製造方法
US12374505B2 (en) * 2020-03-31 2025-07-29 Panasonic Intellectual Property Management Co., Ltd. Electrolytic capacitor
WO2023176684A1 (ja) * 2022-03-15 2023-09-21 パナソニックＩｐマネジメント株式会社 キャパシタ及び電源モジュール

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060082795A (ko) * 2005-01-13 2006-07-19 티디케이가부시기가이샤 적층 콘덴서 및 적층 콘덴서의 등가 직렬 저항 조정 방법
KR20070002654A (ko) * 2005-06-30 2007-01-05 삼성전기주식회사 적층형 칩 커패시터
JP2007250973A (ja) * 2006-03-17 2007-09-27 Taiyo Yuden Co Ltd デカップリングデバイス

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000062828A1 (en) * 1996-04-30 2000-10-26 Medtronic, Inc. Autologous fibrin sealant and method for making the same
US6542352B1 (en) * 1997-12-09 2003-04-01 Daniel Devoe Ceramic chip capacitor of conventional volume and external form having increased capacitance from use of closely spaced interior conductive planes reliably connecting to positionally tolerant exterior pads through multiple redundant vias
JP3376970B2 (ja) * 1999-09-08 2003-02-17 株式会社村田製作所 セラミック電子部品
JP2001210544A (ja) * 2000-01-25 2001-08-03 Nec Tohoku Ltd チップ積層セラミックコンデンサ
TWI266342B (en) * 2001-12-03 2006-11-11 Tdk Corp Multilayer capacitor
JP2003318066A (ja) * 2002-04-25 2003-11-07 Taiyo Yuden Co Ltd コンデンサモジュール
US7054136B2 (en) * 2002-06-06 2006-05-30 Avx Corporation Controlled ESR low inductance multilayer ceramic capacitor
US6606237B1 (en) * 2002-06-27 2003-08-12 Murata Manufacturing Co., Ltd. Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same
CN1993783B (zh) * 2004-12-24 2010-09-01 株式会社村田制作所 多层电容器及其安装结构
JP4287822B2 (ja) * 2005-01-25 2009-07-01 Ｔｄｋ株式会社 積層コンデンサ、及び、積層コンデンサの等価直列抵抗調整方法
US7158364B2 (en) * 2005-03-01 2007-01-02 Tdk Corporation Multilayer ceramic capacitor and method of producing the same
JP4351181B2 (ja) * 2005-03-10 2009-10-28 Ｔｄｋ株式会社 積層コンデンサ、及び、積層コンデンサの等価直列抵抗調整方法
US7149071B2 (en) * 2005-03-17 2006-12-12 Intel Corporation Controlled resistance capacitors
JP2007043093A (ja) * 2005-07-05 2007-02-15 Taiyo Yuden Co Ltd 積層コンデンサ
US7088569B1 (en) * 2005-12-22 2006-08-08 Tdk Corporation Multilayer capacitor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060082795A (ko) * 2005-01-13 2006-07-19 티디케이가부시기가이샤 적층 콘덴서 및 적층 콘덴서의 등가 직렬 저항 조정 방법
KR20070002654A (ko) * 2005-06-30 2007-01-05 삼성전기주식회사 적층형 칩 커패시터
JP2007250973A (ja) * 2006-03-17 2007-09-27 Taiyo Yuden Co Ltd デカップリングデバイス

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101504017B1 (ko) * 2013-07-11 2015-03-18 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
US9136059B2 (en) 2013-07-11 2015-09-15 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and board for mounting the same

Also Published As

Publication number Publication date
JP2011181976A (ja) 2011-09-15
US7675733B2 (en) 2010-03-09
US20090086403A1 (en) 2009-04-02
JP4900842B2 (ja) 2012-03-21
JP2009088516A (ja) 2009-04-23
JP5118237B2 (ja) 2013-01-16
KR20090032798A (ko) 2009-04-01

Similar Documents

Publication Publication Date Title
KR100925603B1 (ko) 적층형 캐패시터
KR100916476B1 (ko) 적층형 칩 커패시터 및 이를 구비한 회로기판 장치
US8184425B2 (en) Multilayer capacitor
US7046500B2 (en) Laminated ceramic capacitor
US4916576A (en) Matrix capacitor
KR100925623B1 (ko) 적층형 칩 커패시터 및 이를 구비한 회로기판 장치 및회로기판
US7411776B2 (en) Multilayer capacitor array
CN100550234C (zh) 多层片式电容器及嵌有多层片式电容器的印刷电路板
US20050047059A1 (en) Multilayer capacitor
KR20070078397A (ko) 다층 캐패시터
JP4475298B2 (ja) 積層コンデンサ
CN101465204B (zh) 叠层电容器阵列
KR100946101B1 (ko) 적층형 캐패시터
CN101471177B (zh) 层叠电容器
KR20150011165A (ko) 적층 세라믹 커패시터 및 그 제조 방법
KR101141328B1 (ko) 적층형 칩 캐패시터, 적층형 칩 캐패시터 어셈블리 및 그 제조방법
US7948737B2 (en) Multilayer capacitor array
JP2008021861A (ja) 貫通型積層コンデンサ
JP2009164258A (ja) 貫通型積層コンデンサアレイ
JP3511569B2 (ja) 積層コンデンサ

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R15-X000 Change to inventor requested

St.27 status event code: A-3-3-R10-R15-oth-X000

R16-X000 Change to inventor recorded

St.27 status event code: A-3-3-R10-R16-oth-X000

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

AMND Amendment
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

A107 Divisional application of patent
AMND Amendment
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

J201 Request for trial against refusal decision
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0107 Divisional application

St.27 status event code: A-0-1-A10-A18-div-PA0107

St.27 status event code: A-0-1-A10-A16-div-PA0107

PJ0201 Trial against decision of rejection

St.27 status event code: A-3-3-V10-V11-apl-PJ0201

PB0901 Examination by re-examination before a trial

St.27 status event code: A-6-3-E10-E12-rex-PB0901

B701 Decision to grant
PB0701 Decision of registration after re-examination before a trial

St.27 status event code: A-3-4-F10-F13-rex-PB0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20121002

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20130916

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20141001

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20151005

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20161004

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20171011

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

FPAY Annual fee payment

Payment date: 20181002

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 14

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20231031

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20231031