JP4900842B2 - 積層型キャパシタ - Google Patents

積層型キャパシタ Download PDF

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Publication number
JP4900842B2
JP4900842B2 JP2008248334A JP2008248334A JP4900842B2 JP 4900842 B2 JP4900842 B2 JP 4900842B2 JP 2008248334 A JP2008248334 A JP 2008248334A JP 2008248334 A JP2008248334 A JP 2008248334A JP 4900842 B2 JP4900842 B2 JP 4900842B2
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JP
Japan
Prior art keywords
electrodes
internal
external
external electrodes
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008248334A
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English (en)
Japanese (ja)
Other versions
JP2009088516A (ja
Inventor
ファ リー、ビョン
クウォン ウイ、スン
ソー パク、サン
チョル パク、ミン
ソク パク、ドン
スク チュン、ハエ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
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Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of JP2009088516A publication Critical patent/JP2009088516A/ja
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Publication of JP4900842B2 publication Critical patent/JP4900842B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
JP2008248334A 2007-09-28 2008-09-26 積層型キャパシタ Expired - Fee Related JP4900842B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020070098300A KR100925603B1 (ko) 2007-09-28 2007-09-28 적층형 캐패시터
KR10-2007-0098300 2007-09-28

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011138774A Division JP5118237B2 (ja) 2007-09-28 2011-06-22 積層型キャパシタ

Publications (2)

Publication Number Publication Date
JP2009088516A JP2009088516A (ja) 2009-04-23
JP4900842B2 true JP4900842B2 (ja) 2012-03-21

Family

ID=40508016

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2008248334A Expired - Fee Related JP4900842B2 (ja) 2007-09-28 2008-09-26 積層型キャパシタ
JP2011138774A Expired - Fee Related JP5118237B2 (ja) 2007-09-28 2011-06-22 積層型キャパシタ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2011138774A Expired - Fee Related JP5118237B2 (ja) 2007-09-28 2011-06-22 積層型キャパシタ

Country Status (3)

Country Link
US (1) US7675733B2 (enExample)
JP (2) JP4900842B2 (enExample)
KR (1) KR100925603B1 (enExample)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
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KR100887108B1 (ko) * 2007-06-14 2009-03-04 삼성전기주식회사 저ｅｓｌ을 갖는 제어된 ｅｓｒ 적층형 칩 커패시터의구현방법
KR101053410B1 (ko) * 2009-07-17 2011-08-01 삼성전기주식회사 적층형 칩 커패시터
JP4983874B2 (ja) * 2009-08-05 2012-07-25 Ｔｄｋ株式会社 積層コンデンサアレイの実装構造
JP5589994B2 (ja) * 2011-09-01 2014-09-17 株式会社村田製作所 選択方法
JP6282388B2 (ja) * 2011-10-24 2018-02-21 デクセリアルズ株式会社 静電容量素子、及び共振回路
KR101514514B1 (ko) * 2013-04-22 2015-04-22 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR102061504B1 (ko) * 2013-04-22 2020-02-17 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR101994712B1 (ko) * 2013-04-22 2019-09-30 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR101994713B1 (ko) 2013-04-22 2019-07-01 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR101994711B1 (ko) * 2013-04-22 2019-07-01 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
JP6142651B2 (ja) * 2013-05-08 2017-06-07 Tdk株式会社 積層コンデンサ
KR101504017B1 (ko) * 2013-07-11 2015-03-18 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR101994717B1 (ko) * 2013-07-15 2019-07-01 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR101514532B1 (ko) * 2013-07-22 2015-04-22 삼성전기주식회사 적층 세라믹 커패시터
US9653212B2 (en) 2013-08-13 2017-05-16 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and board for mounting thereof
KR20140038876A (ko) * 2013-08-13 2014-03-31 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
JP6137069B2 (ja) * 2013-10-01 2017-05-31 株式会社村田製作所 コンデンサの実装構造体及びコンデンサ
KR102083993B1 (ko) * 2013-10-31 2020-03-03 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR101548814B1 (ko) * 2013-11-08 2015-08-31 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR101499725B1 (ko) 2013-11-08 2015-03-06 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR101499724B1 (ko) * 2013-11-08 2015-03-06 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR101514565B1 (ko) * 2013-11-14 2015-04-22 삼성전기주식회사 적층 세라믹 전자 부품 및 적층 세라믹 전자 부품의 실장 기판
WO2015098990A1 (ja) 2013-12-24 2015-07-02 京セラ株式会社 積層型電子部品およびその実装構造体
JP2015153800A (ja) * 2014-02-12 2015-08-24 株式会社村田製作所 電子部品及び電子部品の実装構造体
KR102089693B1 (ko) * 2014-05-07 2020-03-16 삼성전기주식회사 적층 세라믹 커패시터
JP5725240B2 (ja) * 2014-06-02 2015-05-27 株式会社村田製作所 電子部品及び実装構造体
KR102016485B1 (ko) * 2014-07-28 2019-09-02 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR102097324B1 (ko) 2014-08-14 2020-04-06 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR101973419B1 (ko) * 2014-09-23 2019-04-29 삼성전기주식회사 복합 전자 부품 및 그 실장 기판
KR102037268B1 (ko) * 2014-10-15 2019-10-29 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR102183424B1 (ko) * 2015-07-06 2020-11-26 삼성전기주식회사 적층 전자부품 및 적층 전자부품의 실장 기판
JP2017112170A (ja) 2015-12-15 2017-06-22 株式会社村田製作所 コンデンサ
JP2017143129A (ja) * 2016-02-09 2017-08-17 株式会社村田製作所 積層セラミックコンデンサ
JP2017143130A (ja) * 2016-02-09 2017-08-17 株式会社村田製作所 電子部品
KR102449360B1 (ko) * 2017-06-02 2022-10-04 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
US10062511B1 (en) * 2017-06-08 2018-08-28 Samsung Electro-Mechanics Co., Ltd. Multilayer electronic component and board having the same
JP2020077792A (ja) * 2018-11-08 2020-05-21 株式会社村田製作所 積層セラミックコンデンサの実装構造体
JP7156914B2 (ja) 2018-11-13 2022-10-19 株式会社村田製作所 積層セラミックコンデンサ、及び、積層セラミックコンデンサの製造方法
US12374505B2 (en) * 2020-03-31 2025-07-29 Panasonic Intellectual Property Management Co., Ltd. Electrolytic capacitor
WO2023176684A1 (ja) * 2022-03-15 2023-09-21 パナソニックＩｐマネジメント株式会社 キャパシタ及び電源モジュール

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US7054136B2 (en) * 2002-06-06 2006-05-30 Avx Corporation Controlled ESR low inductance multilayer ceramic capacitor
US6606237B1 (en) * 2002-06-27 2003-08-12 Murata Manufacturing Co., Ltd. Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same
CN1993783B (zh) * 2004-12-24 2010-09-01 株式会社村田制作所 多层电容器及其安装结构
JP4167231B2 (ja) 2005-01-13 2008-10-15 Ｔｄｋ株式会社 積層コンデンサ、及び、積層コンデンサの等価直列抵抗調整方法
JP4287822B2 (ja) * 2005-01-25 2009-07-01 Ｔｄｋ株式会社 積層コンデンサ、及び、積層コンデンサの等価直列抵抗調整方法
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JP2007250973A (ja) * 2006-03-17 2007-09-27 Taiyo Yuden Co Ltd デカップリングデバイス

Also Published As

Publication number Publication date
JP2011181976A (ja) 2011-09-15
US7675733B2 (en) 2010-03-09
US20090086403A1 (en) 2009-04-02
JP2009088516A (ja) 2009-04-23
KR100925603B1 (ko) 2009-11-06
JP5118237B2 (ja) 2013-01-16
KR20090032798A (ko) 2009-04-01

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