KR100822322B1 - 기판절단장치 및 기판절단방법 - Google Patents

기판절단장치 및 기판절단방법 Download PDF

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Publication number
KR100822322B1
KR100822322B1 KR1020057014009A KR20057014009A KR100822322B1 KR 100822322 B1 KR100822322 B1 KR 100822322B1 KR 1020057014009 A KR1020057014009 A KR 1020057014009A KR 20057014009 A KR20057014009 A KR 20057014009A KR 100822322 B1 KR100822322 B1 KR 100822322B1
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KR
South Korea
Prior art keywords
line
scribe
line portion
forming
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020057014009A
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English (en)
Korean (ko)
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KR20050095912A (ko
Inventor
요시타카 니시오
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
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Publication of KR20050095912A publication Critical patent/KR20050095912A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0041—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking
    • B28D5/0047—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking using fluid or gas pressure
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • C03B33/107—Wheel design, e.g. materials, construction, shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/304—Including means to apply thermal shock to work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y10T225/325—With means to apply moment of force to weakened work

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
KR1020057014009A 2003-01-29 2004-01-28 기판절단장치 및 기판절단방법 Expired - Fee Related KR100822322B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2003-00021109 2003-01-29
JP2003021109 2003-01-29

Publications (2)

Publication Number Publication Date
KR20050095912A KR20050095912A (ko) 2005-10-04
KR100822322B1 true KR100822322B1 (ko) 2008-04-16

Family

ID=32820647

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057014009A Expired - Fee Related KR100822322B1 (ko) 2003-01-29 2004-01-28 기판절단장치 및 기판절단방법

Country Status (7)

Country Link
US (1) US20070164072A1 (enExample)
EP (1) EP1600270A4 (enExample)
JP (2) JP4606325B2 (enExample)
KR (1) KR100822322B1 (enExample)
CN (4) CN101585657B (enExample)
TW (1) TW200420510A (enExample)
WO (1) WO2004067243A1 (enExample)

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JP2006206361A (ja) * 2005-01-27 2006-08-10 Optrex Corp ガラス板の切断方法及び切断装置
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KR101164847B1 (ko) * 2005-07-06 2012-07-11 미쓰보시 다이야몬도 고교 가부시키가이샤 취성재료용 스크라이빙 휠, 및 이를 이용한 스크라이브 방법, 스크라이브 장치 및 스크라이브 공구
JP2007069477A (ja) * 2005-09-07 2007-03-22 Citizen Seimitsu Co Ltd スクライブ装置およびそれを用いて製作した表示板
KR100960468B1 (ko) 2005-12-29 2010-05-28 엘지디스플레이 주식회사 액정표시패널의 절단방법 및 이를 이용한 액정표시패널의제조방법
KR100596130B1 (ko) * 2006-02-06 2006-07-03 주식회사 탑 엔지니어링 평판 디스플레이용 기판 절단장치
KR100762736B1 (ko) * 2006-04-05 2007-10-04 주식회사 탑 엔지니어링 기판 절단 장치
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JP2009064905A (ja) * 2007-09-05 2009-03-26 Disco Abrasive Syst Ltd 拡張方法および拡張装置
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CN101462822B (zh) * 2007-12-21 2012-08-29 鸿富锦精密工业（深圳）有限公司 具有通孔的脆性非金属工件及其加工方法
KR101303542B1 (ko) * 2008-02-11 2013-09-03 엘지디스플레이 주식회사 평판표시패널 절단장치
JP5325209B2 (ja) * 2008-04-14 2013-10-23 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法
KR100890360B1 (ko) * 2008-04-21 2009-03-25 주식회사 탑 엔지니어링 취성 기판의 브레이크 장치
DE102008059813A1 (de) * 2008-07-17 2010-01-21 Lss Laser Scribing Systems Ag Laser-Scribing-System zum Strukturieren von Substraten für Dünnschichtsolarmodule
KR100953084B1 (ko) * 2008-12-23 2010-04-19 주식회사 탑 엔지니어링 취성 기판의 브레이크 장치
JP5504631B2 (ja) * 2009-01-07 2014-05-28 三星ダイヤモンド工業株式会社 カッター装置及びカッターホルダ
JP5173885B2 (ja) * 2009-02-24 2013-04-03 三星ダイヤモンド工業株式会社 スクライブ装置及びスクライブ方法
CN101503274B (zh) * 2009-02-27 2011-07-27 山东淄博民康药业包装有限公司 玻璃管自动割管机
KR101041137B1 (ko) * 2009-03-25 2011-06-13 삼성모바일디스플레이주식회사 기판 절단 장치 및 이를 이용한 기판 절단 방법
KR20100107253A (ko) * 2009-03-25 2010-10-05 삼성모바일디스플레이주식회사 기판 절단 장치 및 이를 이용한 기판 절단 방법
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CN106200098B (zh) * 2016-08-30 2019-12-31 武汉华星光电技术有限公司 液晶显示基板切割装置及切割方法
CN106542727B (zh) * 2016-10-10 2019-03-05 华南理工大学 一种微磨削尖端精准诱导的曲面镜面脆裂成型方法
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CN107379292B (zh) * 2017-09-15 2019-07-02 京东方科技集团股份有限公司 显示面板的切割方法、系统和存储介质
JP6911720B2 (ja) * 2017-11-14 2021-07-28 日本電気硝子株式会社 ガラス板の製造方法及びガラス板
CN107942566A (zh) * 2018-01-04 2018-04-20 京东方科技集团股份有限公司 基板切割方法
CN110590147B (zh) * 2019-09-18 2022-08-02 彩虹（合肥）液晶玻璃有限公司 分离方法、装置、设备和切割设备
TWI715429B (zh) * 2020-02-03 2021-01-01 晶達光電股份有限公司 液晶面板切割裝置以及液晶面板切割方法
US11372278B2 (en) 2020-02-19 2022-06-28 Litemax Electronics Inc. Liquid crystal panel cutting device and method for cutting liquid crystal panel
CN111517629B (zh) * 2020-05-29 2022-04-19 昆山龙腾光电股份有限公司 一种玻璃切割方法
WO2022096064A1 (de) * 2020-11-05 2022-05-12 centrotherm international AG Verfahren und system zum herstellen eines substrats
JP7448970B2 (ja) 2021-08-02 2024-03-13 三星ダイヤモンド工業株式会社 基板ブレイク装置および基板ブレイク方法
JP7408162B2 (ja) 2021-08-17 2024-01-05 三星ダイヤモンド工業株式会社 基板ブレイク装置および基板ブレイク方法
CN114163118B (zh) * 2021-12-01 2023-09-01 成都晶华光电科技股份有限公司 一种用于切割光学玻璃的二次激光裂片装置
CN115432920A (zh) * 2022-10-25 2022-12-06 深圳市益铂晶科技有限公司 一种玻璃激光切割的浸湿裂片方法

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US20070164072A1 (en) 2007-07-19
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