CN101585657B - 基板切割设备和基板切割方法 - Google Patents

基板切割设备和基板切割方法 Download PDF

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Publication number
CN101585657B
CN101585657B CN2009101320256A CN200910132025A CN101585657B CN 101585657 B CN101585657 B CN 101585657B CN 2009101320256 A CN2009101320256 A CN 2009101320256A CN 200910132025 A CN200910132025 A CN 200910132025A CN 101585657 B CN101585657 B CN 101585657B
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CN
China
Prior art keywords
line
substrate
cut
glass substrate
female glass
Prior art date
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Expired - Fee Related
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CN2009101320256A
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English (en)
Chinese (zh)
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CN101585657A (zh
Inventor
西尾仁孝
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Publication of CN101585657A publication Critical patent/CN101585657A/zh
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • C03B33/107—Wheel design, e.g. materials, construction, shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0041—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking
    • B28D5/0047—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking using fluid or gas pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/304—Including means to apply thermal shock to work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y10T225/325—With means to apply moment of force to weakened work

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
CN2009101320256A 2003-01-29 2004-01-28 基板切割设备和基板切割方法 Expired - Fee Related CN101585657B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003021109 2003-01-29
JP2003021109 2003-01-29
JP2003-021109 2003-01-29

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2004800063132A Division CN1758993B (zh) 2003-01-29 2004-01-28 基板切割设备和基板切割方法

Publications (2)

Publication Number Publication Date
CN101585657A CN101585657A (zh) 2009-11-25
CN101585657B true CN101585657B (zh) 2012-03-21

Family

ID=32820647

Family Applications (4)

Application Number Title Priority Date Filing Date
CN2009101320256A Expired - Fee Related CN101585657B (zh) 2003-01-29 2004-01-28 基板切割设备和基板切割方法
CN2009101320237A Expired - Fee Related CN101585656B (zh) 2003-01-29 2004-01-28 基板切割设备和基板切割方法
CN2009101320241A Expired - Fee Related CN101585655B (zh) 2003-01-29 2004-01-28 基板切割设备和基板切割方法
CN2004800063132A Expired - Fee Related CN1758993B (zh) 2003-01-29 2004-01-28 基板切割设备和基板切割方法

Family Applications After (3)

Application Number Title Priority Date Filing Date
CN2009101320237A Expired - Fee Related CN101585656B (zh) 2003-01-29 2004-01-28 基板切割设备和基板切割方法
CN2009101320241A Expired - Fee Related CN101585655B (zh) 2003-01-29 2004-01-28 基板切割设备和基板切割方法
CN2004800063132A Expired - Fee Related CN1758993B (zh) 2003-01-29 2004-01-28 基板切割设备和基板切割方法

Country Status (7)

Country Link
US (1) US20070164072A1 (enExample)
EP (1) EP1600270A4 (enExample)
JP (2) JP4606325B2 (enExample)
KR (1) KR100822322B1 (enExample)
CN (4) CN101585657B (enExample)
TW (1) TW200420510A (enExample)
WO (1) WO2004067243A1 (enExample)

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KR100628276B1 (ko) * 2004-11-05 2006-09-27 엘지.필립스 엘시디 주식회사 스크라이브 장비 및 이를 구비한 기판의 절단장치 및이것을 이용한 기판의 절단방법
JP2006206361A (ja) * 2005-01-27 2006-08-10 Optrex Corp ガラス板の切断方法及び切断装置
KR100978259B1 (ko) * 2005-06-20 2010-08-26 엘지디스플레이 주식회사 액정패널 절단시스템 및 이를 이용한 액정표시소자제조방법
US7975589B2 (en) * 2005-07-06 2011-07-12 Mitsuboshi Diamond Industrial Co., Ltd. Scribing wheel for brittle material and manufacturing method for same, as well as scribing method, scribing apparatus and scribing tool using the same
JP2007069477A (ja) * 2005-09-07 2007-03-22 Citizen Seimitsu Co Ltd スクライブ装置およびそれを用いて製作した表示板
KR100960468B1 (ko) * 2005-12-29 2010-05-28 엘지디스플레이 주식회사 액정표시패널의 절단방법 및 이를 이용한 액정표시패널의제조방법
KR100596130B1 (ko) * 2006-02-06 2006-07-03 주식회사 탑 엔지니어링 평판 디스플레이용 기판 절단장치
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TWI715429B (zh) * 2020-02-03 2021-01-01 晶達光電股份有限公司 液晶面板切割裝置以及液晶面板切割方法
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JP7448970B2 (ja) 2021-08-02 2024-03-13 三星ダイヤモンド工業株式会社 基板ブレイク装置および基板ブレイク方法
JP7408162B2 (ja) 2021-08-17 2024-01-05 三星ダイヤモンド工業株式会社 基板ブレイク装置および基板ブレイク方法
CN114163118B (zh) * 2021-12-01 2023-09-01 成都晶华光电科技股份有限公司 一种用于切割光学玻璃的二次激光裂片装置
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US20070164072A1 (en) 2007-07-19
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JP2010180127A (ja) 2010-08-19
CN101585655B (zh) 2013-04-24
CN101585657A (zh) 2009-11-25
CN101585656A (zh) 2009-11-25
JPWO2004067243A1 (ja) 2006-06-01
JP4606325B2 (ja) 2011-01-05
CN101585656B (zh) 2012-03-21
EP1600270A4 (en) 2006-09-20
EP1600270A1 (en) 2005-11-30
WO2004067243A1 (ja) 2004-08-12
CN1758993B (zh) 2012-03-21
WO2004067243B1 (ja) 2004-11-11
TW200420510A (en) 2004-10-16
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