JP4606325B2 - 基板分断装置および基板分断方法 - Google Patents

基板分断装置および基板分断方法 Download PDF

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Publication number
JP4606325B2
JP4606325B2 JP2005504731A JP2005504731A JP4606325B2 JP 4606325 B2 JP4606325 B2 JP 4606325B2 JP 2005504731 A JP2005504731 A JP 2005504731A JP 2005504731 A JP2005504731 A JP 2005504731A JP 4606325 B2 JP4606325 B2 JP 4606325B2
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forming
substrate
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Expired - Fee Related
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JP2005504731A
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Japanese (ja)
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JPWO2004067243A1 (ja
Inventor
仁孝 西尾
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • C03B33/107—Wheel design, e.g. materials, construction, shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0041—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking
    • B28D5/0047—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking using fluid or gas pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/304—Including means to apply thermal shock to work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y10T225/325—With means to apply moment of force to weakened work

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
JP2005504731A 2003-01-29 2004-01-28 基板分断装置および基板分断方法 Expired - Fee Related JP4606325B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003021109 2003-01-29
JP2003021109 2003-01-29
PCT/JP2004/000780 WO2004067243A1 (ja) 2003-01-29 2004-01-28 基板分断装置および基板分断方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010058526A Division JP5328049B2 (ja) 2003-01-29 2010-03-15 基板分断装置および基板分断方法

Publications (2)

Publication Number Publication Date
JPWO2004067243A1 JPWO2004067243A1 (ja) 2006-06-01
JP4606325B2 true JP4606325B2 (ja) 2011-01-05

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
JP2005504731A Expired - Fee Related JP4606325B2 (ja) 2003-01-29 2004-01-28 基板分断装置および基板分断方法
JP2010058526A Expired - Fee Related JP5328049B2 (ja) 2003-01-29 2010-03-15 基板分断装置および基板分断方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2010058526A Expired - Fee Related JP5328049B2 (ja) 2003-01-29 2010-03-15 基板分断装置および基板分断方法

Country Status (7)

Country Link
US (1) US20070164072A1 (enExample)
EP (1) EP1600270A4 (enExample)
JP (2) JP4606325B2 (enExample)
KR (1) KR100822322B1 (enExample)
CN (4) CN101585657B (enExample)
TW (1) TW200420510A (enExample)
WO (1) WO2004067243A1 (enExample)

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CN110590147B (zh) * 2019-09-18 2022-08-02 彩虹（合肥）液晶玻璃有限公司 分离方法、装置、设备和切割设备
TWI715429B (zh) * 2020-02-03 2021-01-01 晶達光電股份有限公司 液晶面板切割裝置以及液晶面板切割方法
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JP7448970B2 (ja) 2021-08-02 2024-03-13 三星ダイヤモンド工業株式会社 基板ブレイク装置および基板ブレイク方法
JP7408162B2 (ja) 2021-08-17 2024-01-05 三星ダイヤモンド工業株式会社 基板ブレイク装置および基板ブレイク方法
CN114163118B (zh) * 2021-12-01 2023-09-01 成都晶华光电科技股份有限公司 一种用于切割光学玻璃的二次激光裂片装置
CN115432920A (zh) * 2022-10-25 2022-12-06 深圳市益铂晶科技有限公司 一种玻璃激光切割的浸湿裂片方法

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JP2010180127A (ja) 2010-08-19
CN101585655B (zh) 2013-04-24
CN101585657A (zh) 2009-11-25
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EP1600270A4 (en) 2006-09-20
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CN1758993B (zh) 2012-03-21
WO2004067243B1 (ja) 2004-11-11
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TWI342300B (enExample) 2011-05-21
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