KR100747134B1 - 적외선 가열에 의한 솔더 범프 및 와이어 본딩 - Google Patents

적외선 가열에 의한 솔더 범프 및 와이어 본딩 Download PDF

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KR100747134B1
KR100747134B1 KR1020077003602A KR20077003602A KR100747134B1 KR 100747134 B1 KR100747134 B1 KR 100747134B1 KR 1020077003602 A KR1020077003602 A KR 1020077003602A KR 20077003602 A KR20077003602 A KR 20077003602A KR 100747134 B1 KR100747134 B1 KR 100747134B1
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substrate
bonding
die
wire bonding
flip chip
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Korean (ko)
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KR20070034630A (ko
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팩 씨. 옹
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어드밴스드 마이크로 디바이시즈, 인코포레이티드
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
    • H01L2924/15747—Copper [Cu] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/1579—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
KR1020077003602A 2000-06-12 2000-12-01 적외선 가열에 의한 솔더 범프 및 와이어 본딩 Expired - Fee Related KR100747134B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/592,275 US6384366B1 (en) 2000-06-12 2000-06-12 Top infrared heating for bonding operations
US09/592,275 2000-06-12
PCT/US2000/032700 WO2001097278A1 (en) 2000-06-12 2000-12-01 Solder bump and wire bonding by infrared heating

Related Parent Applications (1)

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KR1020027016900A Division KR100747131B1 (ko) 2000-06-12 2000-12-01 적외선 가열에 의한 솔더 범프 및 와이어 본딩

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EP (1) EP1290725A1 (enExample)
JP (1) JP2004503939A (enExample)
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CN (1) CN1229857C (enExample)
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US8440503B1 (en) * 2011-11-16 2013-05-14 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for performing reflow in bonding processes
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TWI804584B (zh) * 2018-02-28 2023-06-11 美商瑞西恩公司 用於重工倒裝晶片組件的裝置及方法
CN109003969A (zh) * 2018-08-21 2018-12-14 佛山市国星光电股份有限公司 一种基于高密度显示的cob封装方法、系统及cob器件
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TW529111B (en) 2003-04-21
JP2004503939A (ja) 2004-02-05
CN1454393A (zh) 2003-11-05
KR20070034630A (ko) 2007-03-28
KR20030011887A (ko) 2003-02-11
EP1290725A1 (en) 2003-03-12
KR100747131B1 (ko) 2007-08-09
CN1229857C (zh) 2005-11-30
US6384366B1 (en) 2002-05-07
WO2001097278A1 (en) 2001-12-20

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