TWI804584B - 用於重工倒裝晶片組件的裝置及方法 - Google Patents

用於重工倒裝晶片組件的裝置及方法 Download PDF

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Publication number
TWI804584B
TWI804584B TW108106812A TW108106812A TWI804584B TW I804584 B TWI804584 B TW I804584B TW 108106812 A TW108106812 A TW 108106812A TW 108106812 A TW108106812 A TW 108106812A TW I804584 B TWI804584 B TW I804584B
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milling
flip chip
machine
solder
conductive pad
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TW108106812A
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TW201937614A (zh
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詹姆士 Ａ 羅賓斯
傑弗瑞 Ａ 舍布魯克斯
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美商瑞西恩公司
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  • Engineering & Computer Science (AREA)
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  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

本發明提供一種用於重工一倒裝晶片之系統及方法，包括使用一銑削機來移除一老舊倒裝晶片，及使用一取放裝置以將一新倒裝晶片恰當地置放於同一位置。製程可經自動化，其中移除及置放在不需要操作者干預之情況下依序進行。其他裝置及製程可為該系統/機器及製程之部分，例如，在銑削之後進行清潔、在置放之前進行助熔，及進行加熱以使得焊料回焊，從而將該新倒裝晶片緊固於適當位置。底膠可用以實現該新倒裝晶片之一較高機械穩固性安裝。

Description

用於重工倒裝晶片組件的裝置及方法
本申請案主張2018年2月28日申請之美國臨時申請案第62/636,319號之優先權，其以全文引用的方式併入。
本發明係關於用於移除並替換電子件總成上之半導體晶片之裝置及方法的領域。
美國專利5,542,601描述與將半導體晶片(「晶片」)黏著於電子裝置上相關的先前技術方法。
一種用於封裝一半導體積體電路裝置(下文中被稱作半導體晶片或僅晶片)之方法涉及將焊球附接至晶片之電路承載表面上的接觸襯墊。此等焊球具有包括例如97%(按重量計)Pb及3%(按重量計)Sn之組合物，其中對應熔融溫度為攝氏320度。此晶片接著以所謂倒裝晶片組態面朝下置放於陶瓷(例如，氧化鋁)基板上，其中焊球置放於陶瓷基板上之可焊接金屬接觸襯墊上。足夠熱接著經施加以熔融焊球。在冷卻及再凝固之後，焊球便用來將晶片機械且電連接至陶瓷基板，從而產生通常被稱作陶瓷晶片載體的晶片載體。陶瓷晶片載體接著使用例如引線框安裝於印刷電路板(printed circuitboard；PCB)或印刷電路卡(printed circuit card；PCC)上。
用於封裝一半導體晶片之另一方法涉及以倒裝晶片組態將晶片直接安裝於PCB或PCC上，該PCB或PCC習知地包含有機材料，諸如以商標名FR4及DriClad出售之環氧樹脂/玻璃纖維組合物以及聚四氟乙烯(polytetrafluoroethylene；PTFE)類材料。如前所述，焊球附接至晶片之電路承載表面上的接觸襯墊，該等焊球具有包括例如97%(按重量計)Pb及3%(按重量計)Sn的組合物。又如前所述，附接至晶片之焊球將被附接至PCB或PCC上之對應可焊接金屬接觸襯墊。然而，在此例子中，此附接並非藉由熔融焊球達成，此係因為包含PCB或PCC之有機材料不能耐受達成焊球熔融所需要的溫度。確切而言，具有共晶組合物亦即63%(按重量計)Pb及37%(按重量計)Sn之PB-Sn焊料區首先被施加至PCB或PCC上之每一可焊接金屬接觸襯墊。接著使附接至晶片之焊球與PCB或PCC上之共晶焊料接觸，且貼塊共晶焊料接著經加熱至其為攝氏183度的熔融溫度，該溫度必須不會不利地影響包含PCB或PCC的有機材料。在冷卻及再凝固之後，共晶焊料便用以機械且電連接至晶片上之焊球至PCB或PCC上的接觸襯墊。
此等方法為僅晶片安裝製程之實例。當需要缺陷晶片被替換，即需要稱作重工(reworking)之製程時，難題出現。避免重工可導致需要丟棄昂貴裝置，同時嘗試重工可為昂貴及/或耗時的，且可導致對電子裝置之損害，從而使裝置不可用或使困難之修復操作成為必要。
一種用於重工安裝於一電子裝置上之一倒裝晶片的系統及方法涉及使用一銑削機以移除晶片，及在經銑削區域中用新晶片替換該晶片。
根據本發明之一態樣，一種重工安裝於一電子裝置上之一經底膠填充倒裝晶片的方法包括以下步驟：銑削掉該倒裝晶片且在該倒裝晶片周圍進 行底膠填充；及在銑削之後，安裝新倒裝晶片替代正由銑削移除之倒裝晶片。
根據此概述之任何段落的具體實例，該銑削可用於安裝電子裝置之導電襯墊。
根據此概述之任何段落之具體實例，該銑削使用一端銑刀。
根據此概述之任何段落之具體實例，銑削在導電襯墊之1至10密耳內進行。
根據此概述之任何段落之具體實例，銑削在導電襯墊之1密耳或約1密耳內進行。
根據此概述之任何段落之具體實例，銑削暴露導電襯墊之頂部上的焊料，其中經暴露焊料原本用以將原始倒裝晶片電耦接至導電襯墊。
根據此概述之任何段落之具體實例，銑削移除倒裝晶片與導電襯墊之間的導電連接，諸如例如來自焊球之焊料。
根據此概述之任何段落之具體實例，方法進一步包括在銑削之後且安裝之前，清潔來自銑削之殘渣。
根據此概述之任何段落之具體實例，方法進一步包括在安裝之前將助熔劑置放於新倒裝晶片上。
根據此概述之任何段落之具體實例，置放助熔劑包括助熔劑浸漬。
根據此概述之任何段落之具體實例，安裝包括置放新倒裝晶片。
根據此概述之任何段落之具體實例，置放包括用取放裝置進行置放。
根據此概述之任何段落之具體實例，安裝包括在置放之後使焊料進行回焊以製造新倒裝晶片與導電襯墊之間的電連接。
根據此概述之任何段落之具體實例，回焊包括用加熱器進行加 熱。
根據此概述之任何段落之具體實例，方法進一步包括在安裝之後將底膠置放於新倒裝晶片周圍。
根據此概述之任何段落之具體實例，操作中之一些或全部在單一機器或系統上執行。
根據此概述之任何段落之具體實例，單一機器或系統相對於機器或系統的執行功能中之一些或全部之操作性部件對準/置放電子裝置。
根據此概述之任何段落之具體實例，機器或系統使得該電子裝置與操作性部件之間的相對移動成為可能。
根據本發明之另一態樣，一種用於重工安裝於一電子裝置上之一經底膠填充倒裝晶片的機器或系統，其包括：一銑削機；及一晶片置放器。該銑削機及該晶片置放器以操作方式耦接以便銑削並置放新倒裝晶片於該電子裝置上之同一位置。
根據此概述之任何段落之具體實例，機器或系統執行此概述之任何段落)之任一方法步驟的任何操作。
根據此概述之任何段落之具體實例，該銑削機為一端銑刀。
根據此概述之任何段落之具體實例，該銑削機為一精準銑削機。
根據此概述之任何段落之具體實例，晶片置放器為一取放裝置。
根據此概述之任何段落之具體實例，機器或系統進一步包括以操作方式耦接至該銑削機及晶片置放器的對準器。
根據此概述之任何段落之具體實例，對準器相對於機器或系統之銑削機、晶片置放器及/或其他操作性部件對準電子裝置。
根據此概述之任何段落之具體實例，機器或系統進一步包括用於清潔藉由銑削機之操作留下之殘渣的清潔器。
根據此概述之任何段落之具體實例，機器或系統進一步包括一加熱器，其用於加熱以將新倒裝晶片耦接至該電子裝置。
根據此概述之任何段落之具體實例，機器或系統進一步包括電子裝置緊固至的床。
根據此概述之任何段落之具體實例，該機器或系統進一步包括用於控制銑削機及/或晶片置放器的以操作方式耦接至銑削機及/或晶片置放器的一控制器。
根據此概述之任何段落之具體實例，該機器或系統進一步包括以操作方式耦接至該控制器及該銑削機之一高度感測器。
根據此概述之任何段落之具體實例，該高度感測器為該控制器提供回饋以促進該銑削機之移動以在置放新倒裝晶片之前移除材料。
根據此概述之任何段落之具體實例，該高度感測器為一雷射高度感測器。
根據此概述之任何段落之具體實例，該機器為能夠使用銑削機進行自動銑削且使用置放器進行置放的自動化機器。
根據本發明之又一態樣，一種重工安裝於一電子裝置上之一經底膠填充倒裝晶片之方法包括以下步驟：銑削掉倒裝晶片且底膠填充該倒裝晶片周圍；及在該銑削之後，安裝新倒裝晶片替代藉由銑削移除之該倒裝晶片；其中該銑削及該安裝為一自動化製程之部分。
根據本發明之再一態樣，一種用於自動化重工中之模組包括：一銑削機；以操作方式耦接至該銑削機之一控制器；及以操作方式耦接至該銑削機及/或該控制器的一介面。該介面經組態以與多功能自動化機器介接。
為實現前述及相關目的，本發明包含在下文中充分描述且在申請專利範圍中特別指出之特徵。以下描述及隨附圖式詳細闡述本發明之某些說明 性具體實例。然而，此等具體實例僅指示可使用本發明之原理之各種方式中的幾種。當結合圖式考慮時，本發明之其他目標、優點及新穎特徵將自本發明之以下詳細描述而變得顯而易見。
10:機器/系統
12:半導體晶片
14:電子裝置
16:底膠
20:平台/床
21:對準器
22:銑削機
24:清潔器/真空裝置
26:助熔劑施加器
28:置放器
30:加熱器
34:高度感測器
36:熱感測器
40:控制器
50:方法
52:步驟
54:步驟
56:步驟
58:步驟
60:步驟
62:步驟
64:步驟
72:導電襯墊
74:焊料導柱
76:殘渣
80:銑削區域
82:替換晶片
84:焊球
86:金屬化凸塊/金屬化觸點
92:焊料導柱
96:底膠
100:模組
122:銑削機
134:高度感測器
140:控制器
144:介面
隨附圖式展示本發明之各種態樣。
圖1為根據本發明之具體實例的重工機器或裝置之示意圖。
圖2為展示使用圖1之機器或裝置之重工方法之步驟的高階流程圖。
圖3說明圖2之方法之一個步驟。
圖4說明圖2之方法之另一步驟。
圖5說明圖2之方法之再一步驟。
圖6說明圖2之方法之又一步驟。
圖7說明圖2之方法之再一步驟。
圖8為根據本發明之另一具體實例之模組的示意圖。
一種用於重工一倒裝晶片之系統及方法包括使用一銑削機來移除一老舊倒裝晶片及使用一取放裝置以將一新倒裝晶片恰當地置放於同一位置。製程可經自動化，其中該移除及該置放在不需要操作者干預情況下依序進行。其他裝置及製程可為該系統/機器及製程之部分，例如，在該銑削之後進行清潔、在該置放之前進行助熔及進行加熱以使得焊料進行回焊，從而將該新倒裝晶片緊固於適當位置。底膠可用以實現該新倒裝晶片之一較高機械穩固性安裝。
圖1展示用於重工半導體晶片12之機器或系統(或裝置)10，該半導體晶片作為一電子裝置14之部分以一倒裝晶片組態耦接。以倒裝晶片組態耦接之半導體晶片本文中有時被稱作倒裝晶片。電子裝置14可為具有導電襯墊之基板，該等導電襯墊用以例如使用來自最初在倒裝晶片12上之觸點之底部上的焊球之焊料進行與倒裝晶片12的電連接。電子裝置14可為用於多種裝置中之任一者中的具有各種電及/或電子組件的廣泛之多種板中的任一者，諸如印刷電路板。在一個非限制性實例中，電子裝置14可為雷達系統之組件。
機器或系統10用以重工倒裝晶片12，從而移除倒裝晶片12且用另一倒裝晶片替換該倒裝晶片12。重工可藉由倒裝晶片12之操作(或連接)故障來促成。應瞭解，電子裝置14可具有大量晶片及/或其他組件，且將為非所要的是因為單一晶片故障而必須丟棄整個電子裝置14。
倒裝晶片12為經底膠填充之倒裝晶片，從而意謂倒裝晶片12藉由底膠16、電絕緣材料包圍，該電絕緣材料包圍並緊固倒裝晶片12於適當位置。底膠16亦輔助緩解倒裝晶片12上之應力，諸如來自熱膨脹之應力或來自電子裝置14上之機械應力諸如撓曲的應力。
機器或系統10包括：用於收納電子裝置14之平台或床20，其具有用於相對於系統10之其他部件將電子裝置14定位於所要位置的對準器21；用於移除倒裝晶片12及底部16的銑削機22；用於清潔掉來自銑削之殘渣的清潔器24；用於施加助熔劑至替換晶片之焊球的助熔劑施加器26；用於將新倒裝晶片置放於倒裝晶片12處的置放器28；及一加熱器30，其用於提供局部加熱以使來自新倒裝晶片之焊球的焊料回焊以進行與電子裝置14上之導電襯墊的電連接。
對準器21可例如為用於將裝置14置放於所要位置的對準攝影機。銑削機22可結合雷射高度量測系統或用於控制銑削機22在床20上方之高度之其他高度感測器34使用以精準地控制銑削製程，如下文進一步描述。助熔劑 施加器26可為浸漬助熔台(dip flux station)。加熱器30可結合諸如紅外(infrared；IR)熱管理裝置或系統之熱感測器36使用，以控制藉由加熱器30提供之加熱的量。
系統10之各種工具(先前兩個段落中描述之部件)可儲存於工具改變機架(圖中未示)中。系統10可包括例如以x、y及z方向上之移動相對於床20移動工具從而允許三個自由度的機器人臂或其他裝置。機器或系統10亦可包括圖1中未展示之額外部件。舉例而言，系統10可包括用於在藉由置放器28置放之前將替換晶片固持於裝置14上的取放托盤固持器。
工具中之一些或全部的操作可藉由控制器40控制。控制器40可經程式化，且可能能夠控制對於重工製程特定之操作。舉例而言，控制器40可能能夠控制銑削製程，使用來自高度感測器之回饋來定位銑削機22的銑削頭端。控制器40亦可經組態以控制其他操作，諸如取放操作及加熱操作。在控制此類操作中，控制器40可自諸如以下各者之各種感測器或系統之其他部件接收回饋：用於感測床或裝置基板上方銑削頭端之高度的高度感測器34，及用於控制藉由加熱器30進行之加熱中的溫度或熱感測器36。
控制器40可以諸如處理器、積體電路或類似者之多種形式中的任一者來具體化，且可具體化為硬體及/或軟體。
圖2為將系統10用於重工倒裝晶片之方法50的高階流程圖。該方法50以步驟52開始，其中電子裝置14(圖1)被帶入至機器10(圖1)。裝置14緊固至平台或床20，且按需要對準(使用對準器21)，以便對裝置14之倒裝晶片12位於的區域起作用。對準器21可包括例如用於相對於機器10之其他部件移動床20的馬達。如圖3中所示，倒裝晶片12在此步驟期間仍處於適當位置，其中倒裝晶片12用焊料導柱74電耦接至裝置14之導電襯墊72，該等焊料導柱例如在倒裝晶片12最初安設於電子裝置14上或作為該電子裝置之部分安設時藉由使來 自焊球之焊料回焊來產生。倒裝晶片12藉由底膠16包圍。
步驟54中，倒裝晶片12及底膠16藉由銑削被移除，如圖4中所說明。銑削機22可為高精確度銑削機，且高度感測用以避免銑削過深。高度感測可涉及使用雷射高度感測器，如較早所描述。銑削機22可為端銑刀，或可執行端銑操作。銑削之目標為移除倒裝晶片12及底膠16而不損害導電襯墊72。銑削可進行達導電襯墊72之頂部上方1密耳的位準。此銑削位準可更廣泛地為1至10密耳，或約1密耳，例如1密耳±10%、±20%或±50%，或至多50%之任何百分數，或另一合適百分數。銑削可使焊料導柱74之數個部分暴露於導電襯墊72之頂部上。步驟52之銑削製程可在銑削區域80中或附近留下殘渣76。此殘渣76可藉由合適製程諸如藉由使用清潔器或真空裝置24抽吸掉殘渣76而在步驟56中被移除。
步驟58中，替換晶片82(圖5中示出)藉由以下操作準備好用於安設：例如藉由使焊球84附接至晶片82之金屬化凸塊86，及藉由諸如藉由助熔劑浸漬或其他助熔劑施加器26使助熔劑施加至焊球84。助熔劑亦可在經銑削區域80內之任何合適位置施加。步驟60中，替換晶片82藉由置放器28諸如合適取放裝置而置放於經銑削區域80中，該合適取放裝置在晶片被運輸至合適位置且置放於恰當位置同時使用抽吸以固持晶片。替換晶片82經置放以便與裝置14之導電襯墊72合適接觸。
在置放替換倒裝晶片82之後，焊料回焊藉由使用加熱器30進行加熱而在步驟62中起始。加熱器30可為用於進行以下操作之任何合適裝置：施加區域化加熱以使來自焊球84之焊料回焊，產生焊料導柱92(圖6)從而將裝置14之導電襯墊72電連接至替換晶片82之金屬化觸點86。給出兩個非限制性實例，加熱器30可諸如藉由導引熱空氣使用輻射加熱或對流加熱。
上述製程中之一些可使用單一工具組合在一起。舉例而言，置放 器28可用以在將替換晶片82移動至裝置14之前移動替換晶片82。作為另一實例，置放器28可在單一工具中與加熱器30組合，其中在置放器28仍固持替換晶片82同時啟動加熱。
最終，在步驟64中，底膠96圍繞替換倒裝晶片82置放。此步驟說明於圖7中。與用於原始倒裝晶片12之原始底膠16相比，底膠96可藉由相同方法置放，且可具有相同功能。
應瞭解，上述步驟可在適當時以不同次序執行。舉例而言，可有可能的是在加熱/回焊步驟之前置放底膠。
機器或系統10有利地在單一裝置中執行方法50之許多步驟。舉例而言，銑削、清潔、置放及回焊可皆使用單一裝置進行，其中電子裝置14保持在平台或床20上緊固於適當位置。特定重工裝置(機器單元)之使用可減小用於重工之時間，且藉此減小成本及/或改良效率。許多操作可經自動化，從而減小勞力需要且改良結果。如本文中所使用，自動化指多個操作在不需要操作者之動作或干預情況下諸如依序的執行。重工時間可小於先前方法之重工時間的一半，從而具有減小之部件報廢及重工先前將已所要報廢之部件的能力。
系統10之組件中的一些可類似於用於先前自動化系統中例如IC生產單元中的彼等組件，該等IC生產單元係諸如IC-900、IC-1200或IC-1600，資訊技術自動化(INFOTECH AUTOMATION)系統之實例經由Air-Vac Automation可得。此類自動化系統可用於微電子操作中，該等自動化系統例如包括高精度多功能定位系統。現參看圖8，系統10之組件中的一些可係在模組100中，該模組可藉由此類系統利用，該等系統例如係用於本文所描述之重工操作的應用特定周邊件。舉例而言，模組100可包括銑削機122、高度感測器134、控制器140及用於與先前自動化系統介接的介面144，該等先前自動化系統用於以自動化樣式執行製程。銑削機122、高度感測器134及控制器140可類似於銑削機22(圖1)、 感測器34(圖1)及控制器40(圖1)。介面144可包括機械連接、電連接或用於操作性控制之連接，該操作性控制系諸如用於交換資料及/或傳輸及/或接收指令從而諸如用於控制自動化程序。
雖然已關於某一或某些較佳具體實例展示且描述了本發明，但顯而易見的是，在閱讀並理解本說明書及隨附圖式之後，所屬領域中具通常知識者將想到等效變更及修改。詳言之，關於藉由上述元件(組件、總成、裝置、組合物等)執行之各種功能，用以描述此等元件之術語(包括對「構件」之參考)除非以其他方式指定否則意欲對應於執行所描述元件之指定功能(亦即，功能上等效)的任何元件，儘管並非結構上等效於執行本發明的本文中所說明之例示性具體實例之功能的所揭示結構。另外，雖然本發明之特定特徵已關於若干所說明具體實例中之僅一或多個在上文予以描述，但若需要且對任何給定或特定應用有利，則該特徵可與其他具體實例之一或多種其他特徵組合。
10:機器/系統
12:半導體晶片
14:電子裝置
16:底膠
20:平台/床
21:對準器
22:銑削機
24:清潔器/真空裝置
26:助熔劑施加器
28:置放器
30:加熱器
34:高度感測器
36:熱感測器
40:控制器

Claims (18)

  1. 一種重工安裝於一電子裝置上之一經底膠填充的倒裝晶片的方法，該方法包含：將該倒裝晶片以及在該倒裝晶片周圍的底膠銑削掉；及在該銑削之後，安裝一新倒裝晶片以替代正藉由該銑削移除之該倒裝晶片；其中該銑削及該安裝為一自動化製程的部分；其中所述銑削步驟和所述安裝步驟在一單一機器或系統中執行。
  2. 如請求項1所述之方法，其中該銑削可用於安裝該電子裝置之導電襯墊。
  3. 如請求項1所述之方法，其中該銑削使用一端銑刀。
  4. 如請求項1所述之方法，其中該銑削在所述導電襯墊之1至10密耳內進行。
  5. 如請求項1所述之方法，其中該銑削在所述導電襯墊之1密耳內或約1密耳內進行。
  6. 如請求項1所述之方法，其中該銑削暴露所述導電襯墊之頂部上之焊料，其中被暴露的該焊料原本用於將原始的該倒裝晶片電耦接至所述導電襯墊。
  7. 如請求項1所述之方法，其中該銑削移除該倒裝晶片與所述導電襯墊之間的導電連接，諸如焊料，其例如來自焊球。
  8. 如請求項1所述之方法，其中該安裝包括用一取放裝置置放該新倒裝晶片。
  9. 一種用於重工安裝於一電子裝置上之一經底膠填充的倒裝晶片的機器或系統，該機器或系統包含：一銑削機；及 一晶片置放器；其中該銑削機及該晶片置放器以操作方式耦接以便將一倒裝晶片和該倒裝晶片周圍的底膠銑削掉，並且，作為一自動化製程的部分，置放一新倒裝晶片於該電子裝置上之一單一位置；其中該銑削機被佈置成使得銑削在該導電襯墊之1密耳內或約1密耳內進行，並且該銑削暴露該導電襯墊之頂部上之焊料，其中被暴露的該焊料原本用於將原始的該倒裝晶片電耦接至所述導電襯墊；以及其中該晶片置放器被佈置成使得新倒裝晶片被安裝成與暴露的焊料接觸。
  10. 如請求項9所述之機器或系統，其中該銑削機為一端銑刀。
  11. 如請求項9所述之機器或系統，其中該銑削機為一精準銑削機。
  12. 如請求項9所述之機器或系統，其中該晶片置放器為一取放裝置。
  13. 如請求項9所述之機器或系統，其進一步包含以操作方式耦接至該銑削機及/或該晶片置放器的一控制器，用於控制該銑削機及/或該晶片置放器。
  14. 如請求項9所述之機器，其進一步包含用於在置放該新倒裝晶片之前施加助熔劑至該新倒裝晶片的一助熔劑施加器。
  15. 如請求項9所述之機器或系統，其進一步包含以操作方式耦接至該控制器及該銑削機的一高度感測器；其中該高度感測器提供回饋至該控制器，以在置放該新倒裝晶片之前促進該銑削機的移動以移除材料。
  16. 如請求項15所述之機器或系統，其中該高度感測器為一雷射高度感測器。
  17. 如請求項9所述之機器或系統，其中該機器為能夠使用該銑削機自動地進行銑削且使用該置放器進行置放的一自動化機器。
  18. 一種用於自動化重工安裝於一電子裝置上之一經底膠填充的倒裝晶片中之模組，該模組包含：一銑削機，其中該銑削機配置成將一倒裝晶片和該倒裝晶片周圍的底膠銑削掉，使得銑削在該導電襯墊之1密耳內或約1密耳內進行，並且該銑削暴露該導電襯墊之頂部上之焊料，其中被暴露的該焊料原本用於將原始的該倒裝晶片電耦接至所述導電襯墊；以及；一控制器，其以操作方式耦接至該銑削機；及一介面，其以操作方式耦接至該銑削機及/或該控制器；其中該介面經組態以與一多功能自動化機器介接，該多功能自動化機器配置成在電子設備上安裝一個新倒裝晶片以接觸被暴露的該焊料。
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