GB2244374B - Improvements in hybrid circuits - Google Patents

Improvements in hybrid circuits

Info

Publication number
GB2244374B
GB2244374B GB9011399A GB9011399A GB2244374B GB 2244374 B GB2244374 B GB 2244374B GB 9011399 A GB9011399 A GB 9011399A GB 9011399 A GB9011399 A GB 9011399A GB 2244374 B GB2244374 B GB 2244374B
Authority
GB
United Kingdom
Prior art keywords
hybrid circuits
hybrid
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9011399A
Other versions
GB9011399D0 (en
GB2244374A (en
Inventor
Paul John Rosser
Stephen Robert Jennings
Kevin Bryan Affolter
Kenneth George Snowdon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nortel Networks Ltd
STC PLC
Alcatel Submarine Networks UK Ltd
Nortel Networks Optical Components Ltd
Original Assignee
Northern Telecom Ltd
STC PLC
Northern Telecom Europe Ltd
STC Submarine Systems Ltd
STC Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Northern Telecom Ltd, STC PLC, Northern Telecom Europe Ltd, STC Submarine Systems Ltd, STC Ltd filed Critical Northern Telecom Ltd
Priority to GB9011399A priority Critical patent/GB2244374B/en
Publication of GB9011399D0 publication Critical patent/GB9011399D0/en
Publication of GB2244374A publication Critical patent/GB2244374A/en
Application granted granted Critical
Publication of GB2244374B publication Critical patent/GB2244374B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/812—Applying energy for connecting
    • H01L2224/8122—Applying energy for connecting with energy being in the form of electromagnetic radiation
    • H01L2224/81224—Applying energy for connecting with energy being in the form of electromagnetic radiation using a laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
GB9011399A 1990-05-22 1990-05-22 Improvements in hybrid circuits Expired - Fee Related GB2244374B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9011399A GB2244374B (en) 1990-05-22 1990-05-22 Improvements in hybrid circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9011399A GB2244374B (en) 1990-05-22 1990-05-22 Improvements in hybrid circuits

Publications (3)

Publication Number Publication Date
GB9011399D0 GB9011399D0 (en) 1990-07-11
GB2244374A GB2244374A (en) 1991-11-27
GB2244374B true GB2244374B (en) 1994-10-05

Family

ID=10676349

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9011399A Expired - Fee Related GB2244374B (en) 1990-05-22 1990-05-22 Improvements in hybrid circuits

Country Status (1)

Country Link
GB (1) GB2244374B (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2813507B2 (en) * 1992-04-23 1998-10-22 三菱電機株式会社 Bonding method and bonding apparatus
JPH0737911A (en) * 1993-07-19 1995-02-07 Mitsubishi Electric Corp Apparatus and method for die bonding semiconductor element
JP3285294B2 (en) * 1995-08-08 2002-05-27 太陽誘電株式会社 Circuit module manufacturing method
KR100426839B1 (en) 1997-07-23 2004-04-13 인피니언 테크놀로지스 아게 Device and method for producing a chip-substrate connection
DE19751487A1 (en) 1997-11-20 1999-06-02 Pac Tech Gmbh Method and device for the thermal connection of pads of two substrates
EP0964608A3 (en) 1998-06-12 2001-09-05 Ford Motor Company Method for laser soldering
US6384366B1 (en) * 2000-06-12 2002-05-07 Advanced Micro Devices, Inc. Top infrared heating for bonding operations
TWI286623B (en) * 2000-09-06 2007-09-11 Hannstar Display Corp Process for repairing defect applied in liquid crystal display
DE10147789B4 (en) * 2001-09-27 2004-04-15 Infineon Technologies Ag Device for soldering contacts on semiconductor chips
DE10149140A1 (en) 2001-10-05 2003-04-17 Bosch Gmbh Robert Process for connecting a silicon plate to a further plate comprises directing a laser beam onto the further plate through the silicon plate
US20030224581A1 (en) * 2002-06-03 2003-12-04 Robert Bosch Gmbh Flip chip packaging process using laser-induced metal bonding technology, system utilizing the method, and device created by the method
EP1569263B1 (en) 2004-02-27 2011-11-23 OSRAM Opto Semiconductors GmbH Method for joining two wafers
SG155779A1 (en) 2008-03-10 2009-10-29 Micron Technology Inc Apparatus and methods of forming wire bonds
DE202010016958U1 (en) * 2010-12-23 2011-06-27 Automotive Lighting Reutlingen GmbH, 72762 Luminous module for a lighting device of a motor vehicle with arranged on a silicon substrate semiconductor light sources
DE102017201679A1 (en) * 2017-02-02 2018-08-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for joining components to a support structure using electromagnetic radiation
CN114120847A (en) * 2020-08-26 2022-03-01 东捷科技股份有限公司 Self-luminous pixel device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB991267A (en) * 1962-04-10 1965-05-05 United Aircraft Corp Hermetically sealed semiconductor devices
GB1162184A (en) * 1966-03-09 1969-08-20 Ibm Improvements in and relating to Connections to Solid State Devices
GB1238335A (en) * 1967-08-31 1971-07-07
GB1385112A (en) * 1971-08-09 1975-02-26 Licentia Gmbh Method and apparatus for electrically connecting components of solar cell generators
EP0019186A1 (en) * 1979-05-17 1980-11-26 Siemens Aktiengesellschaft Joining the connection wires of semiconductor systems to the carrier elements

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB991267A (en) * 1962-04-10 1965-05-05 United Aircraft Corp Hermetically sealed semiconductor devices
GB1162184A (en) * 1966-03-09 1969-08-20 Ibm Improvements in and relating to Connections to Solid State Devices
GB1238335A (en) * 1967-08-31 1971-07-07
GB1385112A (en) * 1971-08-09 1975-02-26 Licentia Gmbh Method and apparatus for electrically connecting components of solar cell generators
EP0019186A1 (en) * 1979-05-17 1980-11-26 Siemens Aktiengesellschaft Joining the connection wires of semiconductor systems to the carrier elements

Also Published As

Publication number Publication date
GB9011399D0 (en) 1990-07-11
GB2244374A (en) 1991-11-27

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20040522