GB2260219B - Improvements in integrated circuits - Google Patents

Improvements in integrated circuits

Info

Publication number
GB2260219B
GB2260219B GB9120815A GB9120815A GB2260219B GB 2260219 B GB2260219 B GB 2260219B GB 9120815 A GB9120815 A GB 9120815A GB 9120815 A GB9120815 A GB 9120815A GB 2260219 B GB2260219 B GB 2260219B
Authority
GB
United Kingdom
Prior art keywords
integrated circuits
circuits
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9120815A
Other versions
GB9120815D0 (en
GB2260219A (en
Inventor
George Hedley Storm Rokos
Robert James Forbes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nortel Networks Ltd
Original Assignee
Northern Telecom Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Northern Telecom Ltd filed Critical Northern Telecom Ltd
Priority to GB9120815A priority Critical patent/GB2260219B/en
Publication of GB9120815D0 publication Critical patent/GB9120815D0/en
Publication of GB2260219A publication Critical patent/GB2260219A/en
Application granted granted Critical
Publication of GB2260219B publication Critical patent/GB2260219B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118—Masterslice integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
GB9120815A 1991-10-01 1991-10-01 Improvements in integrated circuits Expired - Fee Related GB2260219B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9120815A GB2260219B (en) 1991-10-01 1991-10-01 Improvements in integrated circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9120815A GB2260219B (en) 1991-10-01 1991-10-01 Improvements in integrated circuits

Publications (3)

Publication Number Publication Date
GB9120815D0 GB9120815D0 (en) 1991-11-13
GB2260219A GB2260219A (en) 1993-04-07
GB2260219B true GB2260219B (en) 1995-08-30

Family

ID=10702229

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9120815A Expired - Fee Related GB2260219B (en) 1991-10-01 1991-10-01 Improvements in integrated circuits

Country Status (1)

Country Link
GB (1) GB2260219B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5554545A (en) * 1994-09-01 1996-09-10 United Microelectronics Corporation Method of forming neuron mosfet with different interpolysilicon oxide thickness
US6222244B1 (en) * 1998-06-08 2001-04-24 International Business Machines Corporation Electrically blowable fuse with reduced cross-sectional area
KR100268438B1 (en) * 1998-07-03 2000-10-16 윤종용 A semiconductor memory device with plurality of fuses
CN1222997C (en) * 2000-12-22 2005-10-12 皇家菲利浦电子有限公司 Semiconductor device comprising an arrangement of an electrically programmable non-volatile memory element

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0078165A2 (en) * 1981-10-28 1983-05-04 Kabushiki Kaisha Toshiba A semiconductor device having a control wiring layer
EP0112675A1 (en) * 1982-12-28 1984-07-04 Fujitsu Limited A link structure selectively activable to create a conducting link in an integrated circuit
US4661214A (en) * 1985-12-11 1987-04-28 Optical Materials, Inc. Method and apparatus for electrically disconnecting conductors
US4751197A (en) * 1984-07-18 1988-06-14 Texas Instruments Incorporated Make-link programming of semiconductor devices using laser enhanced thermal breakdown of insulator

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0078165A2 (en) * 1981-10-28 1983-05-04 Kabushiki Kaisha Toshiba A semiconductor device having a control wiring layer
EP0112675A1 (en) * 1982-12-28 1984-07-04 Fujitsu Limited A link structure selectively activable to create a conducting link in an integrated circuit
US4751197A (en) * 1984-07-18 1988-06-14 Texas Instruments Incorporated Make-link programming of semiconductor devices using laser enhanced thermal breakdown of insulator
US4661214A (en) * 1985-12-11 1987-04-28 Optical Materials, Inc. Method and apparatus for electrically disconnecting conductors

Also Published As

Publication number Publication date
GB9120815D0 (en) 1991-11-13
GB2260219A (en) 1993-04-07

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20041001