GB8804300D0 - Improvements in integrated circuits - Google Patents

Improvements in integrated circuits

Info

Publication number
GB8804300D0
GB8804300D0 GB8804300A GB8804300A GB8804300D0 GB 8804300 D0 GB8804300 D0 GB 8804300D0 GB 8804300 A GB8804300 A GB 8804300A GB 8804300 A GB8804300 A GB 8804300A GB 8804300 D0 GB8804300 D0 GB 8804300D0
Authority
GB
United Kingdom
Prior art keywords
integrated circuits
circuits
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB8804300A
Other versions
GB2215512A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
STC PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STC PLC filed Critical STC PLC
Priority to GB8804300A priority Critical patent/GB2215512A/en
Publication of GB8804300D0 publication Critical patent/GB8804300D0/en
Publication of GB2215512A publication Critical patent/GB2215512A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118—Masterslice integrated circuits
    • H01L27/11801—Masterslice integrated circuits using bipolar technology
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
GB8804300A 1988-02-24 1988-02-24 Semiconductor integrated circuits Withdrawn GB2215512A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8804300A GB2215512A (en) 1988-02-24 1988-02-24 Semiconductor integrated circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8804300A GB2215512A (en) 1988-02-24 1988-02-24 Semiconductor integrated circuits

Publications (2)

Publication Number Publication Date
GB8804300D0 true GB8804300D0 (en) 1988-03-23
GB2215512A GB2215512A (en) 1989-09-20

Family

ID=10632275

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8804300A Withdrawn GB2215512A (en) 1988-02-24 1988-02-24 Semiconductor integrated circuits

Country Status (1)

Country Link
GB (1) GB2215512A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5698903A (en) * 1995-05-09 1997-12-16 United Memories, Inc. Bond pad option for integrated circuits
US9347441B2 (en) * 2012-03-30 2016-05-24 Sabic Global Technologies B.V. Compressors including polymeric components

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1812129A1 (en) * 1968-12-02 1971-06-24 Telefunken Patent Method for dicing a semiconductor wafer
JPS593950A (en) * 1982-06-30 1984-01-10 Fujitsu Ltd Gate array chip
GB2168840A (en) * 1984-08-22 1986-06-25 Plessey Co Plc Customerisation of integrated logic devices
US4612408A (en) * 1984-10-22 1986-09-16 Sera Solar Corporation Electrically isolated semiconductor integrated photodiode circuits and method

Also Published As

Publication number Publication date
GB2215512A (en) 1989-09-20

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)