CN1229857C - 用红外线加热的焊锡凸块和引线接合 - Google Patents

用红外线加热的焊锡凸块和引线接合 Download PDF

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Publication number
CN1229857C
CN1229857C CNB008196419A CN00819641A CN1229857C CN 1229857 C CN1229857 C CN 1229857C CN B008196419 A CNB008196419 A CN B008196419A CN 00819641 A CN00819641 A CN 00819641A CN 1229857 C CN1229857 C CN 1229857C
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substrate
chip
bonding
infrared
die
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CNB008196419A
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CN1454393A (zh
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P·C·翁
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GlobalFoundries Inc
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Advanced Micro Devices Inc
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    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
    • H01L2924/15747—Copper [Cu] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/1579—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
CNB008196419A 2000-06-12 2000-12-01 用红外线加热的焊锡凸块和引线接合 Expired - Fee Related CN1229857C (zh)

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US09/592,275 US6384366B1 (en) 2000-06-12 2000-06-12 Top infrared heating for bonding operations
US09/592,275 2000-06-12

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CN1229857C true CN1229857C (zh) 2005-11-30

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CN103111698A (zh) * 2011-11-16 2013-05-22 台湾积体电路制造股份有限公司 在接合工艺中实施回流的方法

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CN102456588A (zh) * 2010-11-05 2012-05-16 三星电子株式会社 引线接合设备及使用该设备的方法
CN102456588B (zh) * 2010-11-05 2016-06-22 三星电子株式会社 引线接合设备及使用该设备的方法
CN103111698A (zh) * 2011-11-16 2013-05-22 台湾积体电路制造股份有限公司 在接合工艺中实施回流的方法
CN103111698B (zh) * 2011-11-16 2016-08-03 台湾积体电路制造股份有限公司 用于形成半导体封装件的方法

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JP2004503939A (ja) 2004-02-05
CN1454393A (zh) 2003-11-05
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KR20030011887A (ko) 2003-02-11
EP1290725A1 (en) 2003-03-12
KR100747134B1 (ko) 2007-08-09
KR100747131B1 (ko) 2007-08-09
US6384366B1 (en) 2002-05-07
WO2001097278A1 (en) 2001-12-20

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