KR100581340B1 - 1액 습기경화형 에폭시수지 조성물 - Google Patents

1액 습기경화형 에폭시수지 조성물 Download PDF

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Publication number
KR100581340B1
KR100581340B1 KR1020037007676A KR20037007676A KR100581340B1 KR 100581340 B1 KR100581340 B1 KR 100581340B1 KR 1020037007676 A KR1020037007676 A KR 1020037007676A KR 20037007676 A KR20037007676 A KR 20037007676A KR 100581340 B1 KR100581340 B1 KR 100581340B1
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KR
South Korea
Prior art keywords
compound
epoxy resin
group
resin composition
compound represented
Prior art date
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Expired - Fee Related
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KR1020037007676A
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English (en)
Korean (ko)
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KR20030061426A (ko
Inventor
엔도타케시
산다후미오
호리이히사카즈
스즈키켄타로
마츠우라노부키
Original Assignee
코니시 가부시키가이샤
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Publication date
Priority claimed from JP2000383380A external-priority patent/JP3404378B2/ja
Priority claimed from JP2001058696A external-priority patent/JP3404385B2/ja
Application filed by 코니시 가부시키가이샤 filed Critical 코니시 가부시키가이샤
Publication of KR20030061426A publication Critical patent/KR20030061426A/ko
Application granted granted Critical
Publication of KR100581340B1 publication Critical patent/KR100581340B1/ko
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014Nitrogen containing compounds
    • C08G59/4042Imines; Imides
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/02Phosphorus compounds
    • C07F9/28Phosphorus compounds with one or more P—C bonds
    • C07F9/38Phosphonic acids [RP(=O)(OH)2]; Thiophosphonic acids ; [RP(=X1)(X2H)2(X1, X2 are each independently O, S or Se)]
    • C07F9/3804Phosphonic acids [RP(=O)(OH)2]; Thiophosphonic acids ; [RP(=X1)(X2H)2(X1, X2 are each independently O, S or Se)] not used, see subgroups
    • C07F9/3808Acyclic saturated acids which can have further substituents on alkyl
    • C07F9/3813N-Phosphonomethylglycine; Salts or complexes thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007Curing agents not provided for by the groups C08G59/42 - C08G59/66

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020037007676A 2000-12-18 2001-12-17 1액 습기경화형 에폭시수지 조성물 Expired - Fee Related KR100581340B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2000-00383380 2000-12-18
JP2000383380A JP3404378B2 (ja) 2000-12-18 2000-12-18 一液湿気硬化型エポキシ樹脂組成物
JPJP-P-2001-00058696 2001-03-02
JP2001058696A JP3404385B2 (ja) 2001-03-02 2001-03-02 一液湿気硬化型エポキシ樹脂組成物
PCT/JP2001/011072 WO2002050155A1 (en) 2000-12-18 2001-12-17 One-pack moisture-curing epoxy resin composition

Publications (2)

Publication Number Publication Date
KR20030061426A KR20030061426A (ko) 2003-07-18
KR100581340B1 true KR100581340B1 (ko) 2006-05-22

Family

ID=26606001

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020037007676A Expired - Fee Related KR100581340B1 (ko) 2000-12-18 2001-12-17 1액 습기경화형 에폭시수지 조성물

Country Status (7)

Country Link
US (1) US7022779B2 (https=)
EP (1) EP1362877B1 (https=)
KR (1) KR100581340B1 (https=)
CN (1) CN1266186C (https=)
DE (1) DE60124774T2 (https=)
TW (1) TWI300417B (https=)
WO (1) WO2002050155A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101011017B1 (ko) * 2010-05-10 2011-01-26 김학건 상하수도용 관 이음용 패킹의 연결방법
FI20155933A (fi) 2015-12-09 2017-06-10 Paint & Aerosol Consultancy Kaksikomponenttinen aerosoliformulaatio
CN113698844B (zh) * 2021-09-03 2023-03-03 厦门市金泰祥新科技有限公司 环氧改性有机硅化合物、可室温湿气固化的组合物及其制备方法和应用

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1577305A (https=) * 1968-02-09 1969-08-08
JPH0778110B2 (ja) * 1987-05-01 1995-08-23 横浜ゴム株式会社 一液系可撓性エポキシ樹脂組成物
JP3097960B2 (ja) * 1989-08-22 2000-10-10 コニシ株式会社 エポキシ樹脂組成物
JPH03192183A (ja) * 1989-12-22 1991-08-22 Yokohama Rubber Co Ltd:The ホットメルト型エポキシ樹脂組成物
US5198524A (en) * 1991-04-22 1993-03-30 W.R. Grace & Co.-Conn. Moisture-curing acrylate/epoxy hybrid adhesives
JPH059267A (ja) * 1991-07-02 1993-01-19 Yokohama Rubber Co Ltd:The 一液型エポキシ樹脂組成物
JPH05194618A (ja) * 1992-01-23 1993-08-03 Ajinomoto Co Inc 密着性に優れた紫外線硬化型樹脂組成物
JPH07188634A (ja) 1993-12-27 1995-07-25 Konishi Kk 一液硬化型エポキシ樹脂系粘接着型接着剤、及びこれを用いた粘接着型テープ
JP3494722B2 (ja) * 1994-12-08 2004-02-09 横浜ゴム株式会社 一液湿気硬化型エポキシ樹脂組成物
JP3370213B2 (ja) 1994-12-16 2003-01-27 関西ペイント株式会社 一液形エポキシ樹脂組成物、一液形防食塗料組成物及びこれらを用いた被覆方法
DE69635805T2 (de) * 1995-08-23 2006-10-19 Kansai Paint Co., Ltd., Amagasaki Einkomponenten-epoxidharzzusammensetzung, einkomponenten-korrosionsbeständige lckzusammensetzung, verfahren zum anstreichen mit dieser zusammensetzung
JP3512938B2 (ja) * 1996-03-04 2004-03-31 鐘淵化学工業株式会社 硬化性樹脂組成物
JPH09328668A (ja) * 1996-06-10 1997-12-22 Sekisui Chem Co Ltd 室温硬化型樹脂組成物、室温硬化型接着剤、反応性ホットメルト型接着剤及び室温硬化型粘着剤
JP3230819B2 (ja) * 1997-01-21 2001-11-19 横浜ゴム株式会社 一液型常温湿気硬化性樹脂組成物
JP3973266B2 (ja) * 1997-07-01 2007-09-12 横浜ゴム株式会社 湿気硬化型1液エポキシ樹脂接着剤組成物
JPH11302327A (ja) * 1998-04-21 1999-11-02 Yokohama Rubber Co Ltd:The 一液型硬化性樹脂組成物
JP3863661B2 (ja) * 1998-06-05 2006-12-27 横浜ゴム株式会社 一成分形弾性エポキシ樹脂組成物
JP2000044773A (ja) * 1998-07-28 2000-02-15 Konishi Co Ltd 1液湿気硬化型組成物
JP4043608B2 (ja) * 1998-08-03 2008-02-06 横浜ゴム株式会社 一液エポキシ樹脂接着剤組成物

Also Published As

Publication number Publication date
TWI300417B (https=) 2008-09-01
WO2002050155A1 (en) 2002-06-27
US20040019161A1 (en) 2004-01-29
HK1062021A1 (en) 2004-10-15
CN1468271A (zh) 2004-01-14
DE60124774T2 (de) 2007-09-13
CN1266186C (zh) 2006-07-26
EP1362877A4 (en) 2005-03-16
DE60124774D1 (de) 2007-01-04
KR20030061426A (ko) 2003-07-18
US7022779B2 (en) 2006-04-04
EP1362877A1 (en) 2003-11-19
EP1362877B1 (en) 2006-11-22

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