KR100193591B1 - 수지몰드장치 및 수지몰드방법 - Google Patents
수지몰드장치 및 수지몰드방법 Download PDFInfo
- Publication number
- KR100193591B1 KR100193591B1 KR1019950043096A KR19950043096A KR100193591B1 KR 100193591 B1 KR100193591 B1 KR 100193591B1 KR 1019950043096 A KR1019950043096 A KR 1019950043096A KR 19950043096 A KR19950043096 A KR 19950043096A KR 100193591 B1 KR100193591 B1 KR 100193591B1
- Authority
- KR
- South Korea
- Prior art keywords
- mold
- resin
- release film
- port
- resin molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/0038—Moulds or cores; Details thereof or accessories therefor with sealing means or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/68—Release sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
- B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/10—Moulds or cores; Details thereof or accessories therefor with incorporated venting means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP94-289428 | 1994-11-24 | ||
| JP28942894A JP3214789B2 (ja) | 1994-11-24 | 1994-11-24 | 樹脂モールド装置及び樹脂モールド方法 |
| JP12765895A JP3165350B2 (ja) | 1995-05-26 | 1995-05-26 | 樹脂モールド方法及び樹脂モールド装置 |
| JP95-127658 | 1995-05-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR960017104A KR960017104A (ko) | 1996-06-17 |
| KR100193591B1 true KR100193591B1 (ko) | 1999-06-15 |
Family
ID=26463556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950043096A Expired - Lifetime KR100193591B1 (ko) | 1994-11-24 | 1995-11-23 | 수지몰드장치 및 수지몰드방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US5800841A (enExample) |
| EP (1) | EP0719624B1 (enExample) |
| KR (1) | KR100193591B1 (enExample) |
| CN (1) | CN1057248C (enExample) |
| DE (1) | DE69509203T2 (enExample) |
| MY (1) | MY114536A (enExample) |
| SG (1) | SG96151A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230002911A (ko) * | 2020-06-24 | 2023-01-05 | 토와 가부시기가이샤 | 수지 성형품의 제조 방법 |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6048483A (en) * | 1996-07-23 | 2000-04-11 | Apic Yamada Corporation | Resin sealing method for chip-size packages |
| JP2970569B2 (ja) * | 1997-01-13 | 1999-11-02 | 日本電気株式会社 | 樹脂封止方法および樹脂封止金型装置 |
| JP3282988B2 (ja) * | 1997-05-01 | 2002-05-20 | アピックヤマダ株式会社 | 樹脂モールド方法及び樹脂モールド装置 |
| DE19731780A1 (de) * | 1997-07-24 | 1999-01-28 | Inst Mikrotechnik Mainz Gmbh | Verfahren zur Herstellung empfindlicher Formteile unter Einsatz einer Folie |
| JP3017485B2 (ja) * | 1998-01-23 | 2000-03-06 | アピックヤマダ株式会社 | 半導体装置の樹脂封止方法及び樹脂封止装置 |
| US6117382A (en) * | 1998-02-05 | 2000-09-12 | Micron Technology, Inc. | Method for encasing array packages |
| US6632457B1 (en) | 1998-08-14 | 2003-10-14 | Incept Llc | Composite hydrogel drug delivery systems |
| US6409949B1 (en) * | 1999-03-29 | 2002-06-25 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Method for thickening a polyester resin |
| JP3510554B2 (ja) * | 2000-02-10 | 2004-03-29 | 山形日本電気株式会社 | 樹脂モールド方法、モールド成形用金型及び配線基材 |
| US6770236B2 (en) * | 2000-08-22 | 2004-08-03 | Apic Yamada Corp. | Method of resin molding |
| US6785137B2 (en) | 2002-07-26 | 2004-08-31 | Stmicroelectronics, Inc. | Method and system for removing heat from an active area of an integrated circuit device |
| US6700190B2 (en) | 2002-07-26 | 2004-03-02 | Stmicroelectronics, Inc. | Integrated circuit device with exposed upper and lower die surfaces |
| DE20214006U1 (de) * | 2002-09-11 | 2004-02-12 | Marbach Werkzeugbau Gmbh | Thermoformwerkzeug |
| JP2004134591A (ja) * | 2002-10-10 | 2004-04-30 | Renesas Technology Corp | 半導体集積回路装置の製造方法 |
| WO2005106942A1 (ja) * | 2004-04-30 | 2005-11-10 | Sumitomo Bakelite Co., Ltd. | 樹脂封止型半導体パッケージ並びにその製造方法及び製造装置 |
| US8011917B2 (en) * | 2007-05-09 | 2011-09-06 | Asm Technology Singapore Pte Ltd | Compression molding of an electronic device |
| FR2943268B1 (fr) * | 2009-03-20 | 2014-02-28 | Arcil | Moule de thermofromage a isolation thermique et procede associe. |
| US7943077B2 (en) * | 2009-06-30 | 2011-05-17 | Tyco Healthcare Group Lp | Method for manufacturing a catheter having a separated tip configuration |
| US8439663B2 (en) | 2011-04-28 | 2013-05-14 | Lockheed Martin Corporation | De-mold liner based injection tool |
| US10226417B2 (en) | 2011-09-16 | 2019-03-12 | Peter Jarrett | Drug delivery systems and applications |
| CN109200013A (zh) | 2011-12-05 | 2019-01-15 | 因赛普特有限责任公司 | 医用有机凝胶方法和组合物 |
| CN103465419A (zh) * | 2013-09-16 | 2013-12-25 | 铜陵荣鑫机械有限公司 | 大功率led球形封装成型机 |
| KR102376487B1 (ko) | 2015-02-12 | 2022-03-21 | 삼성전자주식회사 | 반도체 패키지의 제조 장치 및 그 제조 방법 |
| JP6491508B2 (ja) | 2015-03-23 | 2019-03-27 | Towa株式会社 | 樹脂封止装置及び樹脂成形品の製造方法 |
| CN116134613A (zh) * | 2020-09-25 | 2023-05-16 | 华为技术有限公司 | 一种芯片封装结构、电子设备及芯片封装结构的制备方法 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1110855B (de) * | 1956-08-13 | 1961-07-13 | Hans Behringer Dr Ing | Ziehwerkzeug fuer Folien aus thermoplastischem Kunststoff |
| US3083408A (en) * | 1957-11-21 | 1963-04-02 | Bichl Josef | Machine for injection molding of selfhardening resins |
| US3216060A (en) * | 1960-12-05 | 1965-11-09 | Trojanowski George | Apparatus for the manufacture of molded articles |
| US3410699A (en) * | 1964-10-21 | 1968-11-12 | Peters Leo | Method of and means for embossment and packaging of cold butter |
| US4442056A (en) * | 1980-12-06 | 1984-04-10 | Dusan Slepcevic | Encapsulation mold with gate plate and method of using same |
| US4872825A (en) * | 1984-05-23 | 1989-10-10 | Ross Milton I | Method and apparatus for making encapsulated electronic circuit devices |
| JPS61167515A (ja) * | 1985-01-21 | 1986-07-29 | Hitachi Ltd | モ−ルド装置 |
| DE3930414C2 (de) * | 1989-09-12 | 2002-01-10 | Saint Gobain Sekurit D Gmbh | Verfahren und Vorrichtung zur Herstellung einer für die Direktverklebung mit dem Befestigungsflansch einer Fensteröffnung vorgesehenen Glasscheibe |
| JPH01293523A (ja) * | 1988-05-20 | 1989-11-27 | Mitsubishi Electric Corp | 樹脂封止型半導体装置用封止金型 |
| JPH01299008A (ja) * | 1988-05-27 | 1989-12-01 | Mitsubishi Electric Corp | モールド装置 |
| NL8802879A (nl) * | 1988-11-22 | 1990-06-18 | Ireneus Johannes Theodorus Mar | Werkwijze voor het verpakken van een afgepaste, voor het omhullen van een component bestemde hoeveelheid thermohardende kunststof, met deze werkwijze verkregen verpakking, werkwijze voor het bedrijven van een matrijs en matrijs voor het uitvoeren van deze werkwijze. |
| US5000903A (en) * | 1989-04-06 | 1991-03-19 | Libbey-Owens-Ford Co. | Method of molding plastic products having chemically bonded protective coatings |
| US4956141A (en) * | 1989-04-07 | 1990-09-11 | Libbey-Owens-Ford Co. | Molding process utilizing a mold release membrane |
| JPH032911A (ja) * | 1989-05-30 | 1991-01-09 | Omron Corp | 浮力制御装置 |
| US4965037A (en) * | 1989-07-17 | 1990-10-23 | Libbey-Owens-Ford Co. | Method of molding a composite |
| EP0437345A3 (en) * | 1990-01-10 | 1992-08-19 | Taiyo Manufacturing Works Co., Ltd. | Mold used for fabricating thermoplastic resin articles |
| JPH03234605A (ja) * | 1990-02-13 | 1991-10-18 | Toshiba Corp | レジン成形装置 |
| JPH0437507A (ja) * | 1990-06-02 | 1992-02-07 | Yamada Seisakusho Co Ltd | 成形機のエジェクタピン取付構造 |
| DE4208642A1 (de) * | 1992-03-18 | 1993-09-23 | Thomae Gmbh Dr K | Werkzeuge zur kaltverformung von kunststoff-folien, speziell von polypropylenfolien unterschiedlicher dicken |
| JP3138842B2 (ja) * | 1992-08-18 | 2001-02-26 | 株式会社ジェルテック | シリコーンゲルパーツの製造方法 |
| US5529474A (en) * | 1992-09-25 | 1996-06-25 | Texas Instruments Incorporated | System for preheating a molding compound |
| NL9400119A (nl) * | 1994-01-27 | 1995-09-01 | 3P Licensing Bv | Werkwijze voor het met een hardende kunststof omhullen van een electronische component, electronische componenten met kunststofomhulling verkregen door middel van deze werkwijze en matrijs voor het uitvoeren der werkwijze. |
| US5674343A (en) * | 1994-04-19 | 1997-10-07 | Nitto Denko Corporation | Method for manufacturing a semiconductor |
| US5542978A (en) * | 1994-06-10 | 1996-08-06 | Johnson & Johnson Vision Products, Inc. | Apparatus for applying a surfactant to mold surfaces |
| US5846477A (en) * | 1994-12-08 | 1998-12-08 | Nitto Denko Corporation | Production method for encapsulating a semiconductor device |
| USH1654H (en) * | 1995-01-10 | 1997-06-03 | Rounds; Nicholas A. | Transfer molding process for encapsulating semiconductor devices |
-
1995
- 1995-11-14 MY MYPI95003451A patent/MY114536A/en unknown
- 1995-11-17 EP EP95308257A patent/EP0719624B1/en not_active Expired - Lifetime
- 1995-11-17 DE DE69509203T patent/DE69509203T2/de not_active Expired - Fee Related
- 1995-11-22 US US08/562,151 patent/US5800841A/en not_active Expired - Lifetime
- 1995-11-23 KR KR1019950043096A patent/KR100193591B1/ko not_active Expired - Lifetime
- 1995-11-23 SG SG9501906A patent/SG96151A1/en unknown
- 1995-11-24 CN CN95119080A patent/CN1057248C/zh not_active Expired - Lifetime
-
1998
- 1998-06-02 US US09/090,153 patent/US6444157B1/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230002911A (ko) * | 2020-06-24 | 2023-01-05 | 토와 가부시기가이샤 | 수지 성형품의 제조 방법 |
| KR102917003B1 (ko) * | 2020-06-24 | 2026-01-23 | 토와 가부시기가이샤 | 수지 성형품의 제조 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0719624A3 (enExample) | 1996-07-24 |
| EP0719624B1 (en) | 1999-04-21 |
| SG96151A1 (en) | 2003-05-23 |
| EP0719624A2 (en) | 1996-07-03 |
| CN1131082A (zh) | 1996-09-18 |
| CN1057248C (zh) | 2000-10-11 |
| US5800841A (en) | 1998-09-01 |
| DE69509203D1 (de) | 1999-05-27 |
| US6444157B1 (en) | 2002-09-03 |
| MY114536A (en) | 2002-11-30 |
| KR960017104A (ko) | 1996-06-17 |
| DE69509203T2 (de) | 1999-10-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100193591B1 (ko) | 수지몰드장치 및 수지몰드방법 | |
| EP0933808B1 (en) | Resin sealing method and apparatus for a semiconductor device | |
| KR20140125716A (ko) | 수지 밀봉 장치 및 수지 밀봉 방법 | |
| KR960017105A (ko) | 릴리스필름을 이용한 수지몰드 장치와 수지몰드방법 및 거기에 이용되는 릴리스필름 | |
| JP2001079878A (ja) | 樹脂封止方法及び樹脂封止装置 | |
| US5204122A (en) | Mold for use in resin encapsulation molding | |
| TWI657910B (zh) | 樹脂成形模具、樹脂成形方法、及成形品的製造方法 | |
| KR20210045922A (ko) | 수지 성형품의 제조 방법 및 수지 성형 장치 | |
| CN102756458A (zh) | 成形同时装饰用模具和成形同时装饰品的制造方法 | |
| US6478569B1 (en) | Hybrid injection molding apparatus for enhancing cosmetic appearance of molded articles | |
| JP3214788B2 (ja) | 樹脂モールド装置および樹脂モールド方法 | |
| TWI802220B (zh) | 成型模、樹脂成型裝置及樹脂成型品之製造方法 | |
| JP3214789B2 (ja) | 樹脂モールド装置及び樹脂モールド方法 | |
| JP3241553B2 (ja) | リリースフィルムを用いる樹脂モールド装置 | |
| JP3321023B2 (ja) | 液体樹脂を用いる樹脂モールド方法及び樹脂モールド装置 | |
| JP2003291147A (ja) | 成型金型および樹脂封止装置 | |
| JPH09201846A (ja) | リリースフィルムを用いる樹脂モールド方法及び樹脂モールド装置並びにこれに用いる樹脂タブレット | |
| JP3214790B2 (ja) | 樹脂モールド装置及び樹脂モールド方法 | |
| KR100611519B1 (ko) | 반도체 장치 제조 방법 및 수지 몰딩 장치 | |
| JP2000167841A (ja) | 樹脂封止装置 | |
| JPH115230A (ja) | 射出成形同時絵付装置 | |
| JPH09193177A (ja) | 樹脂モールド方法及びこれに用いるリリースフィルム | |
| JP3590133B2 (ja) | 樹脂モールド方法及び樹脂モールド装置 | |
| JP3165341B2 (ja) | 樹脂モールド方法 | |
| JPH0976284A (ja) | プラスチック成形品の製造方法及び製造装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| A201 | Request for examination | ||
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 7 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 8 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 9 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 10 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 11 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 12 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 13 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 14 |
|
| FPAY | Annual fee payment |
Payment date: 20130125 Year of fee payment: 15 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 15 |
|
| FPAY | Annual fee payment |
Payment date: 20140124 Year of fee payment: 16 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 16 |
|
| FPAY | Annual fee payment |
Payment date: 20141231 Year of fee payment: 17 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 17 |
|
| EXPY | Expiration of term | ||
| PC1801 | Expiration of term |
St.27 status event code: N-4-6-H10-H14-oth-PC1801 Not in force date: 20151124 Ip right cessation event data comment text: Termination Category : EXPIRATION_OF_DURATION |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |