DE69509203T2 - Formvorrichtung und Formverfahren für ein Harz - Google Patents

Formvorrichtung und Formverfahren für ein Harz

Info

Publication number
DE69509203T2
DE69509203T2 DE69509203T DE69509203T DE69509203T2 DE 69509203 T2 DE69509203 T2 DE 69509203T2 DE 69509203 T DE69509203 T DE 69509203T DE 69509203 T DE69509203 T DE 69509203T DE 69509203 T2 DE69509203 T2 DE 69509203T2
Authority
DE
Germany
Prior art keywords
resin
release film
crucible
molding
molds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69509203T
Other languages
German (de)
English (en)
Other versions
DE69509203D1 (de
Inventor
Fumio Miyajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Apic Yamada Corp
Original Assignee
Apic Yamada Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP28942894A external-priority patent/JP3214789B2/ja
Priority claimed from JP12765895A external-priority patent/JP3165350B2/ja
Application filed by Apic Yamada Corp filed Critical Apic Yamada Corp
Publication of DE69509203D1 publication Critical patent/DE69509203D1/de
Application granted granted Critical
Publication of DE69509203T2 publication Critical patent/DE69509203T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0038—Moulds or cores; Details thereof or accessories therefor with sealing means or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/10—Moulds or cores; Details thereof or accessories therefor with incorporated venting means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
DE69509203T 1994-11-24 1995-11-17 Formvorrichtung und Formverfahren für ein Harz Expired - Fee Related DE69509203T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP28942894A JP3214789B2 (ja) 1994-11-24 1994-11-24 樹脂モールド装置及び樹脂モールド方法
JP12765895A JP3165350B2 (ja) 1995-05-26 1995-05-26 樹脂モールド方法及び樹脂モールド装置

Publications (2)

Publication Number Publication Date
DE69509203D1 DE69509203D1 (de) 1999-05-27
DE69509203T2 true DE69509203T2 (de) 1999-10-14

Family

ID=26463556

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69509203T Expired - Fee Related DE69509203T2 (de) 1994-11-24 1995-11-17 Formvorrichtung und Formverfahren für ein Harz

Country Status (7)

Country Link
US (2) US5800841A (enExample)
EP (1) EP0719624B1 (enExample)
KR (1) KR100193591B1 (enExample)
CN (1) CN1057248C (enExample)
DE (1) DE69509203T2 (enExample)
MY (1) MY114536A (enExample)
SG (1) SG96151A1 (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6048483A (en) * 1996-07-23 2000-04-11 Apic Yamada Corporation Resin sealing method for chip-size packages
JP2970569B2 (ja) * 1997-01-13 1999-11-02 日本電気株式会社 樹脂封止方法および樹脂封止金型装置
JP3282988B2 (ja) * 1997-05-01 2002-05-20 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置
DE19731780A1 (de) * 1997-07-24 1999-01-28 Inst Mikrotechnik Mainz Gmbh Verfahren zur Herstellung empfindlicher Formteile unter Einsatz einer Folie
JP3017485B2 (ja) * 1998-01-23 2000-03-06 アピックヤマダ株式会社 半導体装置の樹脂封止方法及び樹脂封止装置
US6117382A (en) * 1998-02-05 2000-09-12 Micron Technology, Inc. Method for encasing array packages
US6632457B1 (en) 1998-08-14 2003-10-14 Incept Llc Composite hydrogel drug delivery systems
US6409949B1 (en) * 1999-03-29 2002-06-25 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Method for thickening a polyester resin
JP3510554B2 (ja) * 2000-02-10 2004-03-29 山形日本電気株式会社 樹脂モールド方法、モールド成形用金型及び配線基材
US6770236B2 (en) * 2000-08-22 2004-08-03 Apic Yamada Corp. Method of resin molding
US6785137B2 (en) 2002-07-26 2004-08-31 Stmicroelectronics, Inc. Method and system for removing heat from an active area of an integrated circuit device
US6700190B2 (en) 2002-07-26 2004-03-02 Stmicroelectronics, Inc. Integrated circuit device with exposed upper and lower die surfaces
DE20214006U1 (de) * 2002-09-11 2004-02-12 Marbach Werkzeugbau Gmbh Thermoformwerkzeug
JP2004134591A (ja) * 2002-10-10 2004-04-30 Renesas Technology Corp 半導体集積回路装置の製造方法
WO2005106942A1 (ja) * 2004-04-30 2005-11-10 Sumitomo Bakelite Co., Ltd. 樹脂封止型半導体パッケージ並びにその製造方法及び製造装置
US8011917B2 (en) * 2007-05-09 2011-09-06 Asm Technology Singapore Pte Ltd Compression molding of an electronic device
FR2943268B1 (fr) * 2009-03-20 2014-02-28 Arcil Moule de thermofromage a isolation thermique et procede associe.
US7943077B2 (en) * 2009-06-30 2011-05-17 Tyco Healthcare Group Lp Method for manufacturing a catheter having a separated tip configuration
US8439663B2 (en) 2011-04-28 2013-05-14 Lockheed Martin Corporation De-mold liner based injection tool
US10226417B2 (en) 2011-09-16 2019-03-12 Peter Jarrett Drug delivery systems and applications
CN109200013A (zh) 2011-12-05 2019-01-15 因赛普特有限责任公司 医用有机凝胶方法和组合物
CN103465419A (zh) * 2013-09-16 2013-12-25 铜陵荣鑫机械有限公司 大功率led球形封装成型机
KR102376487B1 (ko) 2015-02-12 2022-03-21 삼성전자주식회사 반도체 패키지의 제조 장치 및 그 제조 방법
JP6491508B2 (ja) 2015-03-23 2019-03-27 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂成形品の製造方法
JP7341343B2 (ja) * 2020-06-24 2023-09-08 Ｔｏｗａ株式会社 樹脂成形品の製造方法
CN116134613A (zh) * 2020-09-25 2023-05-16 华为技术有限公司 一种芯片封装结构、电子设备及芯片封装结构的制备方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1110855B (de) * 1956-08-13 1961-07-13 Hans Behringer Dr Ing Ziehwerkzeug fuer Folien aus thermoplastischem Kunststoff
US3083408A (en) * 1957-11-21 1963-04-02 Bichl Josef Machine for injection molding of selfhardening resins
US3216060A (en) * 1960-12-05 1965-11-09 Trojanowski George Apparatus for the manufacture of molded articles
US3410699A (en) * 1964-10-21 1968-11-12 Peters Leo Method of and means for embossment and packaging of cold butter
US4442056A (en) * 1980-12-06 1984-04-10 Dusan Slepcevic Encapsulation mold with gate plate and method of using same
US4872825A (en) * 1984-05-23 1989-10-10 Ross Milton I Method and apparatus for making encapsulated electronic circuit devices
JPS61167515A (ja) * 1985-01-21 1986-07-29 Hitachi Ltd モ−ルド装置
DE3930414C2 (de) * 1989-09-12 2002-01-10 Saint Gobain Sekurit D Gmbh Verfahren und Vorrichtung zur Herstellung einer für die Direktverklebung mit dem Befestigungsflansch einer Fensteröffnung vorgesehenen Glasscheibe
JPH01293523A (ja) * 1988-05-20 1989-11-27 Mitsubishi Electric Corp 樹脂封止型半導体装置用封止金型
JPH01299008A (ja) * 1988-05-27 1989-12-01 Mitsubishi Electric Corp モールド装置
NL8802879A (nl) * 1988-11-22 1990-06-18 Ireneus Johannes Theodorus Mar Werkwijze voor het verpakken van een afgepaste, voor het omhullen van een component bestemde hoeveelheid thermohardende kunststof, met deze werkwijze verkregen verpakking, werkwijze voor het bedrijven van een matrijs en matrijs voor het uitvoeren van deze werkwijze.
US5000903A (en) * 1989-04-06 1991-03-19 Libbey-Owens-Ford Co. Method of molding plastic products having chemically bonded protective coatings
US4956141A (en) * 1989-04-07 1990-09-11 Libbey-Owens-Ford Co. Molding process utilizing a mold release membrane
JPH032911A (ja) * 1989-05-30 1991-01-09 Omron Corp 浮力制御装置
US4965037A (en) * 1989-07-17 1990-10-23 Libbey-Owens-Ford Co. Method of molding a composite
EP0437345A3 (en) * 1990-01-10 1992-08-19 Taiyo Manufacturing Works Co., Ltd. Mold used for fabricating thermoplastic resin articles
JPH03234605A (ja) * 1990-02-13 1991-10-18 Toshiba Corp レジン成形装置
JPH0437507A (ja) * 1990-06-02 1992-02-07 Yamada Seisakusho Co Ltd 成形機のエジェクタピン取付構造
DE4208642A1 (de) * 1992-03-18 1993-09-23 Thomae Gmbh Dr K Werkzeuge zur kaltverformung von kunststoff-folien, speziell von polypropylenfolien unterschiedlicher dicken
JP3138842B2 (ja) * 1992-08-18 2001-02-26 株式会社ジェルテック シリコーンゲルパーツの製造方法
US5529474A (en) * 1992-09-25 1996-06-25 Texas Instruments Incorporated System for preheating a molding compound
NL9400119A (nl) * 1994-01-27 1995-09-01 3P Licensing Bv Werkwijze voor het met een hardende kunststof omhullen van een electronische component, electronische componenten met kunststofomhulling verkregen door middel van deze werkwijze en matrijs voor het uitvoeren der werkwijze.
US5674343A (en) * 1994-04-19 1997-10-07 Nitto Denko Corporation Method for manufacturing a semiconductor
US5542978A (en) * 1994-06-10 1996-08-06 Johnson & Johnson Vision Products, Inc. Apparatus for applying a surfactant to mold surfaces
US5846477A (en) * 1994-12-08 1998-12-08 Nitto Denko Corporation Production method for encapsulating a semiconductor device
USH1654H (en) * 1995-01-10 1997-06-03 Rounds; Nicholas A. Transfer molding process for encapsulating semiconductor devices

Also Published As

Publication number Publication date
EP0719624A3 (enExample) 1996-07-24
EP0719624B1 (en) 1999-04-21
SG96151A1 (en) 2003-05-23
EP0719624A2 (en) 1996-07-03
CN1131082A (zh) 1996-09-18
CN1057248C (zh) 2000-10-11
US5800841A (en) 1998-09-01
KR100193591B1 (ko) 1999-06-15
DE69509203D1 (de) 1999-05-27
US6444157B1 (en) 2002-09-03
MY114536A (en) 2002-11-30
KR960017104A (ko) 1996-06-17

Similar Documents

Publication Publication Date Title
DE69509203T2 (de) Formvorrichtung und Formverfahren für ein Harz
DE69501632T2 (de) Harzformmaschine mit Trennfolie
DE69608153T2 (de) Verfahren und Maschine zum Giessen von Kunststoff
DE19581043C2 (de) Verfahren und Vorrichtung zum Bewirken von beim Spritzformen angebrachter Dekoration
DE4426127C2 (de) Verfahren und Vorrichtung zum Vergießen elektronischer Teile mit Gießharz
AT517754B1 (de) Anordnung zum Konsolidieren thermoplastischer Halbzeuge
EP1300086B1 (de) Verfahren zum Herstellen von schalenförmigen Verzehrgütern
DE1454962B1 (de) Vorrichtung zur Vakuumverformung eines thermoplastischen Kunststoffbandes
DE2615177A1 (de) Arbeitsverfahren und vorrichtung zum herstellen von austriebfreien formteilen
DE2505618C3 (de) Formwerkzeug
DE10133672B4 (de) Verfahren zum Spritzgießen metallischer Materialien
DE3312539C1 (de) Vorrichtung zum Herstellen von kastenlosen Sandgießformen
EP0557614A1 (de) Verfahren zum Verschweissen von halogenfreien Thermoplastfolien
DE3446650A1 (de) Verpackungsmaschine
EP0326846B1 (de) Verfahren und Vorrichtung zum Herstellen von Blister-Verpackungen
EP0767760B2 (de) Verfahren zur herstellung von glasformlingen nach dem pressverfahren sowie zur anwendung des verfahrens besonders geeignete vorrichtung
EP3883856B1 (de) 3d gedruckte siegelmaske oder siegelbrille
DE1963573A1 (de) Vorrichtung zum Tiefziehen von thermoplastisch verformbaren Folien
DE2328368B2 (de) Thermoformvorrichtung zum herstellen von formlingen grosser tiefe aus einem relativ dicken kunststoffband
DE102018007824B3 (de) Verfahren zum Aufbringen eines Etiketts auf ein tiefgezogenes Formteil und Formwerkzeug zum Durchführen des Verfahrens
DE19652028A1 (de) Verfahren und Einrichtung zur Kunststofformteil-Herstellung, insbesondere Minderdruck-Spritzgießverfahren zur Kunststofformteil-Herstellung
DE2528645C3 (de) Vorrichtung zur automatischen Herstellung kastenloser Gießformen
CH442714A (de) Verfahren und Vorrichtung zum Tiefziehen von Hohlkörpern aus Kunststoffolie
DE2344866A1 (de) Verfahren und vorrichtung zum herstellen von formlingen durch thermoformen
DE10111841A1 (de) Vorrichtung zum Thermoformen von Folien

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee