DE69509203T2 - Formvorrichtung und Formverfahren für ein Harz - Google Patents

Formvorrichtung und Formverfahren für ein Harz

Info

Publication number
DE69509203T2
DE69509203T2 DE69509203T DE69509203T DE69509203T2 DE 69509203 T2 DE69509203 T2 DE 69509203T2 DE 69509203 T DE69509203 T DE 69509203T DE 69509203 T DE69509203 T DE 69509203T DE 69509203 T2 DE69509203 T2 DE 69509203T2
Authority
DE
Germany
Prior art keywords
resin
release film
crucible
molding
molds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69509203T
Other languages
German (de)
English (en)
Other versions
DE69509203D1 (de
Inventor
Fumio Miyajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Apic Yamada Corp
Original Assignee
Apic Yamada Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP28942894A external-priority patent/JP3214789B2/ja
Priority claimed from JP12765895A external-priority patent/JP3165350B2/ja
Application filed by Apic Yamada Corp filed Critical Apic Yamada Corp
Application granted granted Critical
Publication of DE69509203D1 publication Critical patent/DE69509203D1/de
Publication of DE69509203T2 publication Critical patent/DE69509203T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0038—Moulds or cores; Details thereof or accessories therefor with sealing means or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/10—Moulds or cores; Details thereof or accessories therefor with incorporated venting means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
DE69509203T 1994-11-24 1995-11-17 Formvorrichtung und Formverfahren für ein Harz Expired - Fee Related DE69509203T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP28942894A JP3214789B2 (ja) 1994-11-24 1994-11-24 樹脂モールド装置及び樹脂モールド方法
JP12765895A JP3165350B2 (ja) 1995-05-26 1995-05-26 樹脂モールド方法及び樹脂モールド装置

Publications (2)

Publication Number Publication Date
DE69509203D1 DE69509203D1 (de) 1999-05-27
DE69509203T2 true DE69509203T2 (de) 1999-10-14

Family

ID=26463556

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69509203T Expired - Fee Related DE69509203T2 (de) 1994-11-24 1995-11-17 Formvorrichtung und Formverfahren für ein Harz

Country Status (7)

Country Link
US (2) US5800841A (enExample)
EP (1) EP0719624B1 (enExample)
KR (1) KR100193591B1 (enExample)
CN (1) CN1057248C (enExample)
DE (1) DE69509203T2 (enExample)
MY (1) MY114536A (enExample)
SG (1) SG96151A1 (enExample)

Families Citing this family (25)

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US6048483A (en) * 1996-07-23 2000-04-11 Apic Yamada Corporation Resin sealing method for chip-size packages
JP2970569B2 (ja) * 1997-01-13 1999-11-02 日本電気株式会社 樹脂封止方法および樹脂封止金型装置
JP3282988B2 (ja) * 1997-05-01 2002-05-20 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置
DE19731780A1 (de) * 1997-07-24 1999-01-28 Inst Mikrotechnik Mainz Gmbh Verfahren zur Herstellung empfindlicher Formteile unter Einsatz einer Folie
JP3017485B2 (ja) * 1998-01-23 2000-03-06 アピックヤマダ株式会社 半導体装置の樹脂封止方法及び樹脂封止装置
US6117382A (en) * 1998-02-05 2000-09-12 Micron Technology, Inc. Method for encasing array packages
US6632457B1 (en) 1998-08-14 2003-10-14 Incept Llc Composite hydrogel drug delivery systems
US6409949B1 (en) * 1999-03-29 2002-06-25 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Method for thickening a polyester resin
JP3510554B2 (ja) * 2000-02-10 2004-03-29 山形日本電気株式会社 樹脂モールド方法、モールド成形用金型及び配線基材
US6770236B2 (en) * 2000-08-22 2004-08-03 Apic Yamada Corp. Method of resin molding
US6700190B2 (en) 2002-07-26 2004-03-02 Stmicroelectronics, Inc. Integrated circuit device with exposed upper and lower die surfaces
US6785137B2 (en) 2002-07-26 2004-08-31 Stmicroelectronics, Inc. Method and system for removing heat from an active area of an integrated circuit device
DE20214006U1 (de) * 2002-09-11 2004-02-12 Marbach Werkzeugbau Gmbh Thermoformwerkzeug
JP2004134591A (ja) * 2002-10-10 2004-04-30 Renesas Technology Corp 半導体集積回路装置の製造方法
JP4577309B2 (ja) * 2004-04-30 2010-11-10 住友ベークライト株式会社 樹脂封止型半導体パッケージの製造方法及び製造装置
US8011917B2 (en) * 2007-05-09 2011-09-06 Asm Technology Singapore Pte Ltd Compression molding of an electronic device
FR2943268B1 (fr) * 2009-03-20 2014-02-28 Arcil Moule de thermofromage a isolation thermique et procede associe.
US7943077B2 (en) * 2009-06-30 2011-05-17 Tyco Healthcare Group Lp Method for manufacturing a catheter having a separated tip configuration
US8439663B2 (en) * 2011-04-28 2013-05-14 Lockheed Martin Corporation De-mold liner based injection tool
US10226417B2 (en) 2011-09-16 2019-03-12 Peter Jarrett Drug delivery systems and applications
WO2013086015A1 (en) 2011-12-05 2013-06-13 Incept, Llc Medical organogel processes and compositions
CN103465419A (zh) * 2013-09-16 2013-12-25 铜陵荣鑫机械有限公司 大功率led球形封装成型机
KR102376487B1 (ko) 2015-02-12 2022-03-21 삼성전자주식회사 반도체 패키지의 제조 장치 및 그 제조 방법
JP6491508B2 (ja) 2015-03-23 2019-03-27 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂成形品の製造方法
WO2022061719A1 (zh) * 2020-09-25 2022-03-31 华为技术有限公司 一种芯片封装结构、电子设备及芯片封装结构的制备方法

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Publication number Priority date Publication date Assignee Title
DE1110855B (de) * 1956-08-13 1961-07-13 Hans Behringer Dr Ing Ziehwerkzeug fuer Folien aus thermoplastischem Kunststoff
US3083408A (en) * 1957-11-21 1963-04-02 Bichl Josef Machine for injection molding of selfhardening resins
US3216060A (en) * 1960-12-05 1965-11-09 Trojanowski George Apparatus for the manufacture of molded articles
US3410699A (en) * 1964-10-21 1968-11-12 Peters Leo Method of and means for embossment and packaging of cold butter
US4442056A (en) * 1980-12-06 1984-04-10 Dusan Slepcevic Encapsulation mold with gate plate and method of using same
US4872825A (en) * 1984-05-23 1989-10-10 Ross Milton I Method and apparatus for making encapsulated electronic circuit devices
JPS61167515A (ja) * 1985-01-21 1986-07-29 Hitachi Ltd モ−ルド装置
DE3930414C2 (de) * 1989-09-12 2002-01-10 Saint Gobain Sekurit D Gmbh Verfahren und Vorrichtung zur Herstellung einer für die Direktverklebung mit dem Befestigungsflansch einer Fensteröffnung vorgesehenen Glasscheibe
JPH01293523A (ja) * 1988-05-20 1989-11-27 Mitsubishi Electric Corp 樹脂封止型半導体装置用封止金型
JPH01299008A (ja) * 1988-05-27 1989-12-01 Mitsubishi Electric Corp モールド装置
NL8802879A (nl) * 1988-11-22 1990-06-18 Ireneus Johannes Theodorus Mar Werkwijze voor het verpakken van een afgepaste, voor het omhullen van een component bestemde hoeveelheid thermohardende kunststof, met deze werkwijze verkregen verpakking, werkwijze voor het bedrijven van een matrijs en matrijs voor het uitvoeren van deze werkwijze.
US5000903A (en) * 1989-04-06 1991-03-19 Libbey-Owens-Ford Co. Method of molding plastic products having chemically bonded protective coatings
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JPH032911A (ja) * 1989-05-30 1991-01-09 Omron Corp 浮力制御装置
US4965037A (en) * 1989-07-17 1990-10-23 Libbey-Owens-Ford Co. Method of molding a composite
EP0437345A3 (en) * 1990-01-10 1992-08-19 Taiyo Manufacturing Works Co., Ltd. Mold used for fabricating thermoplastic resin articles
JPH03234605A (ja) * 1990-02-13 1991-10-18 Toshiba Corp レジン成形装置
JPH0437507A (ja) * 1990-06-02 1992-02-07 Yamada Seisakusho Co Ltd 成形機のエジェクタピン取付構造
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Also Published As

Publication number Publication date
SG96151A1 (en) 2003-05-23
KR100193591B1 (ko) 1999-06-15
MY114536A (en) 2002-11-30
CN1057248C (zh) 2000-10-11
EP0719624A2 (en) 1996-07-03
US5800841A (en) 1998-09-01
EP0719624B1 (en) 1999-04-21
US6444157B1 (en) 2002-09-03
CN1131082A (zh) 1996-09-18
KR960017104A (ko) 1996-06-17
EP0719624A3 (enExample) 1996-07-24
DE69509203D1 (de) 1999-05-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee