USH1654H - Transfer molding process for encapsulating semiconductor devices - Google Patents

Transfer molding process for encapsulating semiconductor devices Download PDF

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Publication number
USH1654H
USH1654H US08/370,597 US37059795A USH1654H US H1654 H USH1654 H US H1654H US 37059795 A US37059795 A US 37059795A US H1654 H USH1654 H US H1654H
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US
United States
Prior art keywords
pot
liner film
mold
preform
runners
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US08/370,597
Inventor
Nicholas A. Rounds
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BP Corp North America Inc
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US08/370,597 priority Critical patent/USH1654H/en
Assigned to ROHM AND HAAS COMPANY reassignment ROHM AND HAAS COMPANY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ROUNDS, NICHOLAS ANDREW
Assigned to AMOCO CORPORATION reassignment AMOCO CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ROHM AND HAAS COMPANY
Assigned to ROHM AND HAAS COMPANY reassignment ROHM AND HAAS COMPANY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: PLASKON ELECTRONIC MATERIALS, INC.
Application granted granted Critical
Publication of USH1654H publication Critical patent/USH1654H/en
Abandoned legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/462—Injection of preformed charges of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film

Definitions

  • This invention relates to transfer molding methods used to encapsulate semiconductor, electrical and optical devices ("device”) with epoxy or other thermoset resin formulations ("formulation").
  • Transfer molding involves inserting a preform tablet of formulation in a pot, heating the preform, either prior to or after inserting the tablet in the pot, to soften the formulation, using a plunger to transfer the softened formulation from the pot into device cavities in metal molds.
  • the plunger is used to force the soft encapsulating composition along runners into a package cavity in which the device has previously been inserted.
  • the molten formulation surrounds the device in each cavity and encapsulates it.
  • the formulation which constitutes the preform tablets comprises abrasive fillers and mold release agents which cause problems insofar as the metal molds are subjected to wear and to "staining.”
  • This invention provides an improved transfer molding method wherein liner film is provided over the surfaces of the package cavities, runners, and pot prior to inserting the preform tablet in the pot and the devices in the package cavities.
  • FIG. 1 shows a vertical cross-section of an open transfer mold having a top portion and a bottom portion, in open position.
  • FIG. 2 shows a vertical cross-section of the transfer mold in closed position with the preform tablet inserted and the a device inserted in a package cavity, according to conventional practice.
  • FIG. 3 shows a vertical cross-section of an closed transfer mold after transfer of the formulation from the pot to the cavity, forming an encapsulated device.
  • FIG.4 shows a vertical cross section of an open transfer mold with the surfaces having been covered by liner film prior to insertion of the preform tablet, and prior to closing the mold.
  • FIG. 5 shows a top schematic view of a bottom portion of a gang-pot mold.
  • FIGS. 1, 2, and 3 represent a conventional transfer molding method of encapsulating devices which utilizes apparatus which comprises a mold having a top portion 11 and a bottom portion 13, either of said portions including at least one pot 18 and a plunger 14 in each said pot 18, package cavities 11, and runners 17 connecting said package cavities 11 with said pot 18, each of said pots 18, plungers 14, package cavities 11, and runners 17 having surfaces.
  • a device (not shown)is inserted in each of said package cavities 11, a preform tablet 15 of encapsulating composition is inserted in each said pot 18, and wherein said encapsulating composition becomes soft and said plunger 14 is used to force the soft encapsulating composition along said runners 17 and into said package cavities 11, to encapsulate the device 16.
  • the pot can be in the top portion of the mold.
  • liner film 19 (FIG. 4, representing the invention)is provided over the entire resin transfer portion of the mold, including the pot 18, (including the tops of the plungers 14 in tile pots 18) runners 17 and device cavities 11, before the resin preform tablets 15 and the electrical devices (not shown) are placed in position.
  • the open mold illustrated in FIG. 4 is closed, as shown in FIG. 3 during tile normal transfer of the resin formulation from the pot to the cavities according to this invention, none of the formulation ever contacts the mold surfaces because of the liner film 19.
  • Tile liner film 19 thus protects the mold and allows more formulation latitude in the encapsulating resin since release of the resin from metal surfaces is avoided.
  • liner film is provided for each of the top and bottom portions of the mold.
  • any suitable plastic or rubber film which can withstand a molding temperature of about 175° C. and the abrasiveness of the formulation being used is suitable.
  • One application of liner film can be used for multiple transfers until it either wears out or builds up an unacceptable level of resin stains or deposits.
  • new liner film can be applied to parts or all of the mold before each transfer.
  • preform tablet used in this art is suitable.
  • Preferred preform tablets have high density, preferably above 90%, and low water content, preferably below 0.1%, but preform tablets having other densities and water contents can also be used.
  • the film can be applied to the surfaces by any method, e.g., by vacuum forming the film liner across all of the surfaces (not shown). Contrary to the method of Pas which employs prewrapped pencils of formulation, according to the present invention conventional unwrapped preform tablets are highly preferred. Typical gang-pot molds (FIG. 5) are preferably used.
  • Advantages of this invention are that the mold surfaces are protected, allowing longer mold life and/or use of less precise and less expensive molds; the formulation can be made without mold release agents because the film itself acts as a mold releaser; there is less leakage ("flash” or "bleed") of formulation beyond desired areas, which has been a concern in this art; less mold clean up work is needed since the process results in clean molds; no particulate scrap from cured molding compound and thus no contamination of the apparatus.
  • One preferred method is to use a reel-to-reel supply (not shown).
  • the lining film can serve as a shipping envelope for the molded devices.
  • the devices can be delivered to the assembly station in a continuous spooled container which can be loaded into automated assembly tooling.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

The present invention relates to an improved transfer molding method for encapsulating semiconductor, electrical and optical devices with epoxy or other thermoset resins wherein liner film is provided over the surfaces of the package cavities, runners, and pot prior to inserting the preform tablet in the pot and the devices in the package cavities.

Description

BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to transfer molding methods used to encapsulate semiconductor, electrical and optical devices ("device") with epoxy or other thermoset resin formulations ("formulation").
2. Description of the Prior Art
Transfer molding involves inserting a preform tablet of formulation in a pot, heating the preform, either prior to or after inserting the tablet in the pot, to soften the formulation, using a plunger to transfer the softened formulation from the pot into device cavities in metal molds. The plunger is used to force the soft encapsulating composition along runners into a package cavity in which the device has previously been inserted. The molten formulation surrounds the device in each cavity and encapsulates it.
The formulation which constitutes the preform tablets comprises abrasive fillers and mold release agents which cause problems insofar as the metal molds are subjected to wear and to "staining."
A method is described in Semiconductor Packaging Update, 1994, Vol. 9, No. 6 (ISSN: 0889-9193) in which a special pencil-shaped, film wrapped preform, prepared according to Pas, U.S. Pat. No. 5,098,626, is employed, along with specialized molds which eliminate the conventional pots and runners. Film is drawn into the cavities by vacuum molding. That method has disadvantages in that it requires special preforms, and extensive, complex, and expensive retooling of the molding equipment.
SUMMARY OF THE INVENTION
This invention provides an improved transfer molding method wherein liner film is provided over the surfaces of the package cavities, runners, and pot prior to inserting the preform tablet in the pot and the devices in the package cavities.
DESCRIPTION OF THE DRAWINGS
FIG. 1 shows a vertical cross-section of an open transfer mold having a top portion and a bottom portion, in open position.
FIG. 2 shows a vertical cross-section of the transfer mold in closed position with the preform tablet inserted and the a device inserted in a package cavity, according to conventional practice.
FIG. 3 shows a vertical cross-section of an closed transfer mold after transfer of the formulation from the pot to the cavity, forming an encapsulated device.
FIG.4 shows a vertical cross section of an open transfer mold with the surfaces having been covered by liner film prior to insertion of the preform tablet, and prior to closing the mold.
FIG. 5 shows a top schematic view of a bottom portion of a gang-pot mold.
DETAILED DESCRIPTION OF THE INVENTION AND THE PREFERRED EMBODIMENTS
Referring to the drawings, FIGS. 1, 2, and 3 represent a conventional transfer molding method of encapsulating devices which utilizes apparatus which comprises a mold having a top portion 11 and a bottom portion 13, either of said portions including at least one pot 18 and a plunger 14 in each said pot 18, package cavities 11, and runners 17 connecting said package cavities 11 with said pot 18, each of said pots 18, plungers 14, package cavities 11, and runners 17 having surfaces. A device (not shown)is inserted in each of said package cavities 11, a preform tablet 15 of encapsulating composition is inserted in each said pot 18, and wherein said encapsulating composition becomes soft and said plunger 14 is used to force the soft encapsulating composition along said runners 17 and into said package cavities 11, to encapsulate the device 16. In an alternative embodiment of the apparatus, the pot can be in the top portion of the mold. According to this invention, liner film 19 (FIG. 4, representing the invention)is provided over the entire resin transfer portion of the mold, including the pot 18, (including the tops of the plungers 14 in tile pots 18) runners 17 and device cavities 11, before the resin preform tablets 15 and the electrical devices (not shown) are placed in position. When the open mold illustrated in FIG. 4 is closed, as shown in FIG. 3 during tile normal transfer of the resin formulation from the pot to the cavities according to this invention, none of the formulation ever contacts the mold surfaces because of the liner film 19. Tile liner film 19 thus protects the mold and allows more formulation latitude in the encapsulating resin since release of the resin from metal surfaces is avoided. Usually separate liner film is provided for each of the top and bottom portions of the mold.
Any suitable plastic or rubber film which can withstand a molding temperature of about 175° C. and the abrasiveness of the formulation being used is suitable. One application of liner film can be used for multiple transfers until it either wears out or builds up an unacceptable level of resin stains or deposits. Alternatively, new liner film can be applied to parts or all of the mold before each transfer.
Any preform tablet used in this art is suitable. Preferred preform tablets have high density, preferably above 90%, and low water content, preferably below 0.1%, but preform tablets having other densities and water contents can also be used.
The film can be applied to the surfaces by any method, e.g., by vacuum forming the film liner across all of the surfaces (not shown). Contrary to the method of Pas which employs prewrapped pencils of formulation, according to the present invention conventional unwrapped preform tablets are highly preferred. Typical gang-pot molds (FIG. 5) are preferably used.
Advantages of this invention are that the mold surfaces are protected, allowing longer mold life and/or use of less precise and less expensive molds; the formulation can be made without mold release agents because the film itself acts as a mold releaser; there is less leakage ("flash" or "bleed") of formulation beyond desired areas, which has been a concern in this art; less mold clean up work is needed since the process results in clean molds; no particulate scrap from cured molding compound and thus no contamination of the apparatus.
One preferred method is to use a reel-to-reel supply (not shown). Optionally the lining film can serve as a shipping envelope for the molded devices. Using this process, the devices can be delivered to the assembly station in a continuous spooled container which can be loaded into automated assembly tooling.

Claims (7)

What is claimed is:
1. In a transfer molding method of encapsulating devices which utilizes apparatus which comprises a mold, said mold having a top portion and a bottom portion, either of said portions including at least one pot and a plunger in each said pot, package cavities, and runners connecting said package cavities with said pot, each of said pots, plungers, package cavities, and runners having surfaces, wherein a device is inserted in each of said package cavities, a preform tablet of encapsulating composition is inserted in each said pot, and wherein said encapsulating composition becomes soft and said plunger is used to force the soft encapsulating composition along said runners and into said package cavities;
the improvement comprising using a preform tablet of encapsulating composition having a density Of at least 90% and a water content of 0.1% or less, providing a liner film over the surfaces of said package cavity, runners, and pot prior to inserting said preform tablet in said pot and said device in said package cavity, wherein said liner film is provided for each of said top and bottom portions so as to line all surfaces which come into contact with said soft encapsulating composition, and wherein vacuum is applied to form the liner film to all resin transfer surfaces of the top and bottom portions.
2. Method according to claim 1 wherein a gang-pot mold configuration is used.
3. Method according to claim 1 wherein the liner film is used for one molding cycle and then is replaced with new liner film for each subsequent molding cycle.
4. Method according to claim 1 wherein an application of liner film is used for two or more mold cycles.
5. Method according to claim 1 wherein the liner film is not separated from the molded parts, and is used as a wrap to store or ship said parts.
6. Method according to claim 1 wherein the preform tablets are not pre-wrapped in film.
7. Method according to claim 6 wherein said preform tablets are cylindrically shaped.
US08/370,597 1995-01-10 1995-01-10 Transfer molding process for encapsulating semiconductor devices Abandoned USH1654H (en)

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Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5800841A (en) * 1994-11-24 1998-09-01 Apic Yamada Corporation Resin molding machine
US5846477A (en) * 1994-12-08 1998-12-08 Nitto Denko Corporation Production method for encapsulating a semiconductor device
US5885506A (en) * 1996-05-02 1999-03-23 Texas Instruments Incorporated Pre-packaged molding for component encapsulation
US5891384A (en) * 1994-11-21 1999-04-06 Apic Yamada Corporation Method of operating a molding machine with release film
US5912024A (en) * 1995-05-02 1999-06-15 Texas Instruments Incorporated Sproutless pre-packaged molding for component encapsulation
US5955115A (en) * 1995-05-02 1999-09-21 Texas Instruments Incorporated Pre-packaged liquid molding for component encapsulation
US5961912A (en) * 1997-09-18 1999-10-05 Siliconware Precision Industries Co., Ltd. Encapsulating method of substrate based electronic device
US6048483A (en) * 1996-07-23 2000-04-11 Apic Yamada Corporation Resin sealing method for chip-size packages
US6080354A (en) * 1997-05-01 2000-06-27 Apic Yamada Corporation Resin molding method in which a movable cavity piece allows a direct resin feed
US6187243B1 (en) * 1997-07-11 2001-02-13 Apic Yamada Corporation Method of resin molding
US6436318B1 (en) * 2000-03-30 2002-08-20 Intel Corporation Paper substrates for use in integrated circuit packaging molding processes
US6446933B1 (en) 1998-09-03 2002-09-10 Micron Technology, Inc. Film on a surface of a mold used during semiconductor device fabrication
US6511620B1 (en) * 1999-06-25 2003-01-28 Fujitsu Limited Method of producing semiconductor devices having easy separability from a metal mold after molding
US20030143406A1 (en) * 2002-01-31 2003-07-31 Stmicroelectronics, Inc. System and method for using a pre-formed film in a transfer molding process for an integrated circuit
US6716023B2 (en) * 2000-06-29 2004-04-06 Tachi-S Co., Ltd. Thermal pressure die for forming seat
US20070063335A1 (en) * 2000-08-28 2007-03-22 Micron Technology, Inc. Packaged microelectronic devices with interconnecting units and methods for manufacturing and using the interconnecting units
US20080145472A1 (en) * 2006-12-15 2008-06-19 Nippon Platec Co., Ltd. Injection mold assembly
US20110133366A1 (en) * 2005-02-07 2011-06-09 Henkel Corporation Injection molding process, apparatus and material for forming cured-in-place gaskets
US20120018918A1 (en) * 2005-11-10 2012-01-26 Deutsches Zentrum Fuer Luft-Und Raumfahrt E.V. (Dlr) Tool, arrangement, and method for manufacturing a component, component
US11621181B2 (en) * 2020-05-05 2023-04-04 Asmpt Singapore Pte. Ltd. Dual-sided molding for encapsulating electronic devices

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4442056A (en) * 1980-12-06 1984-04-10 Dusan Slepcevic Encapsulation mold with gate plate and method of using same
US4900501A (en) * 1985-11-08 1990-02-13 Hitachi, Ltd. Method and apparatus for encapsulating semi-conductors
US4956141A (en) * 1989-04-07 1990-09-11 Libbey-Owens-Ford Co. Molding process utilizing a mold release membrane
US4965037A (en) * 1989-07-17 1990-10-23 Libbey-Owens-Ford Co. Method of molding a composite
US4983110A (en) * 1988-03-14 1991-01-08 Hitachi, Ltd. Resin encapsulating apparatus for semiconductor devices
US5052907A (en) * 1989-07-04 1991-10-01 Kabushiki Kaisha Toshiba Resin sealing apparatus for use in manufacturing a resin-sealed semiconductor device
US5098626A (en) * 1988-11-22 1992-03-24 Pas Ireneus J T M Method for packing a measured quantity of thermosetting resin and operating a mold for encapsulating a component
US5164144A (en) * 1989-08-07 1992-11-17 Schlumberger Industries Process for making card bodies and cards incorporating graphic symbols
US5226997A (en) * 1989-08-28 1993-07-13 United Technologies Corporation Mold liners for resin transfer molding
US5302101A (en) * 1991-01-09 1994-04-12 Rohm Co., Ltd. Mold for resin-packaging electronic components
US5350553A (en) * 1990-11-27 1994-09-27 Mannesmann Aktiengesellschaft A Corp Of The Federal Republic Of Germany Method for the manufacture of a decorated chip card
US5401457A (en) * 1992-08-04 1995-03-28 Valyi; Emery I. Process for forming a color coated article

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Publication number Priority date Publication date Assignee Title
US4442056A (en) * 1980-12-06 1984-04-10 Dusan Slepcevic Encapsulation mold with gate plate and method of using same
US4900501A (en) * 1985-11-08 1990-02-13 Hitachi, Ltd. Method and apparatus for encapsulating semi-conductors
US4983110A (en) * 1988-03-14 1991-01-08 Hitachi, Ltd. Resin encapsulating apparatus for semiconductor devices
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US4956141A (en) * 1989-04-07 1990-09-11 Libbey-Owens-Ford Co. Molding process utilizing a mold release membrane
US5052907A (en) * 1989-07-04 1991-10-01 Kabushiki Kaisha Toshiba Resin sealing apparatus for use in manufacturing a resin-sealed semiconductor device
US4965037A (en) * 1989-07-17 1990-10-23 Libbey-Owens-Ford Co. Method of molding a composite
US5164144A (en) * 1989-08-07 1992-11-17 Schlumberger Industries Process for making card bodies and cards incorporating graphic symbols
US5226997A (en) * 1989-08-28 1993-07-13 United Technologies Corporation Mold liners for resin transfer molding
US5350553A (en) * 1990-11-27 1994-09-27 Mannesmann Aktiengesellschaft A Corp Of The Federal Republic Of Germany Method for the manufacture of a decorated chip card
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US5401457A (en) * 1992-08-04 1995-03-28 Valyi; Emery I. Process for forming a color coated article

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Title
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Semiconductor Packaging Update, 1994, vol. 9, No. 6 (ISSN: 0889-9193).

Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5891384A (en) * 1994-11-21 1999-04-06 Apic Yamada Corporation Method of operating a molding machine with release film
US5800841A (en) * 1994-11-24 1998-09-01 Apic Yamada Corporation Resin molding machine
US6444157B1 (en) 1994-11-24 2002-09-03 Apic Yamada Corporation Method of resin molding
US5846477A (en) * 1994-12-08 1998-12-08 Nitto Denko Corporation Production method for encapsulating a semiconductor device
US5912024A (en) * 1995-05-02 1999-06-15 Texas Instruments Incorporated Sproutless pre-packaged molding for component encapsulation
US5955115A (en) * 1995-05-02 1999-09-21 Texas Instruments Incorporated Pre-packaged liquid molding for component encapsulation
US5885506A (en) * 1996-05-02 1999-03-23 Texas Instruments Incorporated Pre-packaged molding for component encapsulation
US6224360B1 (en) 1996-07-23 2001-05-01 Apic Yamada Corporation Resin sealing device for chip-size packages
US6048483A (en) * 1996-07-23 2000-04-11 Apic Yamada Corporation Resin sealing method for chip-size packages
US6080354A (en) * 1997-05-01 2000-06-27 Apic Yamada Corporation Resin molding method in which a movable cavity piece allows a direct resin feed
US6187243B1 (en) * 1997-07-11 2001-02-13 Apic Yamada Corporation Method of resin molding
US6350113B1 (en) * 1997-07-11 2002-02-26 Apic Yamada Corporation Resin molding machine
US5961912A (en) * 1997-09-18 1999-10-05 Siliconware Precision Industries Co., Ltd. Encapsulating method of substrate based electronic device
US6446933B1 (en) 1998-09-03 2002-09-10 Micron Technology, Inc. Film on a surface of a mold used during semiconductor device fabrication
US6523803B1 (en) 1998-09-03 2003-02-25 Micron Technology, Inc. Mold apparatus used during semiconductor device fabrication
US6544466B1 (en) * 1998-09-03 2003-04-08 Micron Technology Surface modification method for molds used during semiconductor device fabrication
US6607173B2 (en) 1998-09-03 2003-08-19 Micron Technology, Inc. Film on a surface of a mold used during semiconductor device fabrication
US6511620B1 (en) * 1999-06-25 2003-01-28 Fujitsu Limited Method of producing semiconductor devices having easy separability from a metal mold after molding
US6436318B1 (en) * 2000-03-30 2002-08-20 Intel Corporation Paper substrates for use in integrated circuit packaging molding processes
US6716023B2 (en) * 2000-06-29 2004-04-06 Tachi-S Co., Ltd. Thermal pressure die for forming seat
US7332376B2 (en) * 2000-08-28 2008-02-19 Micron Technology, Inc. Method of encapsulating packaged microelectronic devices with a barrier
US20070063335A1 (en) * 2000-08-28 2007-03-22 Micron Technology, Inc. Packaged microelectronic devices with interconnecting units and methods for manufacturing and using the interconnecting units
US20030143406A1 (en) * 2002-01-31 2003-07-31 Stmicroelectronics, Inc. System and method for using a pre-formed film in a transfer molding process for an integrated circuit
US7595017B2 (en) * 2002-01-31 2009-09-29 Stmicroelectronics, Inc. Method for using a pre-formed film in a transfer molding process for an integrated circuit
US20110133366A1 (en) * 2005-02-07 2011-06-09 Henkel Corporation Injection molding process, apparatus and material for forming cured-in-place gaskets
US20120018918A1 (en) * 2005-11-10 2012-01-26 Deutsches Zentrum Fuer Luft-Und Raumfahrt E.V. (Dlr) Tool, arrangement, and method for manufacturing a component, component
US9352517B2 (en) * 2005-11-10 2016-05-31 Airbus Deutschland Gmbh Resin-transfer-moulding method
US20080145472A1 (en) * 2006-12-15 2008-06-19 Nippon Platec Co., Ltd. Injection mold assembly
US7648117B2 (en) * 2006-12-15 2010-01-19 Nippon Platec Co., Ltd. Injection mold assembly
US11621181B2 (en) * 2020-05-05 2023-04-04 Asmpt Singapore Pte. Ltd. Dual-sided molding for encapsulating electronic devices

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