JP7475123B2 - 光検出装置 - Google Patents
光検出装置 Download PDFInfo
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- JP7475123B2 JP7475123B2 JP2019175945A JP2019175945A JP7475123B2 JP 7475123 B2 JP7475123 B2 JP 7475123B2 JP 2019175945 A JP2019175945 A JP 2019175945A JP 2019175945 A JP2019175945 A JP 2019175945A JP 7475123 B2 JP7475123 B2 JP 7475123B2
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- 238000001514 detection method Methods 0.000 claims description 30
- 230000003287 optical effect Effects 0.000 claims description 5
- 238000000098 azimuthal photoelectron diffraction Methods 0.000 description 197
- 239000004065 semiconductor Substances 0.000 description 152
- 239000012535 impurity Substances 0.000 description 45
- 239000000758 substrate Substances 0.000 description 22
- 230000007613 environmental effect Effects 0.000 description 13
- 238000000034 method Methods 0.000 description 11
- 238000005468 ion implantation Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 150000002500 ions Chemical class 0.000 description 6
- 238000002161 passivation Methods 0.000 description 6
- 230000000087 stabilizing effect Effects 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- 101100077717 Mus musculus Morn2 gene Proteins 0.000 description 2
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052795 boron group element Inorganic materials 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229910052696 pnictogen Inorganic materials 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J1/44—Electric circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/1443—Devices controlled by radiation with at least one potential jump or surface barrier
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/0214—Constructional arrangements for removing stray light
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J1/4228—Photometry, e.g. photographic exposure meter using electric radiation detectors arrangements with two or more detectors, e.g. for sensitivity compensation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/1446—Devices controlled by radiation in a repetitive configuration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
- H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02016—Circuit arrangements of general character for the devices
- H01L31/02019—Circuit arrangements of general character for the devices for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02027—Circuit arrangements of general character for the devices for devices characterised by at least one potential jump barrier or surface barrier for devices working in avalanche mode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035272—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
- H01L31/102—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier
- H01L31/107—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier working in avalanche mode, e.g. avalanche photodiodes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J1/44—Electric circuits
- G01J2001/444—Compensating; Calibrating, e.g. dark current, temperature drift, noise reduction or baseline correction; Adjusting
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J1/44—Electric circuits
- G01J2001/4446—Type of detector
- G01J2001/446—Photodiode
- G01J2001/4466—Avalanche
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Light Receiving Elements (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Description
Claims (5)
- アバランシェフォトダイオードと、
各々が第一及び第二電極を有すると共に、前記アバランシェフォトダイオードよりも低い互いに異なるブレークダウン電圧を有する複数の温度補償用ダイオードと、
前記複数の温度補償用ダイオードのいずれかをブレークダウン状態とする回路部と、を備え、
前記回路部は、各々が互いに異なる前記温度補償用ダイオードの前記第二電極に接続される複数の第一端子と、前記アバランシェフォトダイオードと各前記温度補償用ダイオードの前記第一電極とに電気的に接続される第二端子とを含む、光検出装置。 - 前記回路部は、対応する前記温度補償用ダイオードに電気的に接続されている共に、前記対応する温度補償用ダイオードが通電可能な状態と通電不可能な状態とを切り替える少なくとも1つのスイッチを有し、
前記複数の温度補償用ダイオードは、第一温度補償用ダイオードと、前記第一温度補償用ダイオードよりも高いブレークダウン電圧を有する第二温度補償用ダイオードと、を含み、
前記スイッチは、前記第一温度補償用ダイオードに電気的に接続されている、請求項1に記載の光検出装置。 - 前記少なくとも1つのスイッチは、対応する前記第一端子に接続されている、請求項2に記載の光検出装置。
- 前記回路部は、前記第一温度補償用ダイオードが通電可能な状態であるか否かに関わらず、前記第二温度補償用ダイオードを通電可能な状態とする、請求項2又は3に記載の光検出装置。
- 前記複数の温度補償用ダイオードは、前記第一温度補償用ダイオードのブレークダウン電圧よりも高くかつ前記第二温度補償用ダイオードのブレークダウン電圧よりも低いブレークダウン電圧を有する第三温度補償用ダイオードをさらに含み、
前記スイッチは、前記第三温度補償用ダイオードに電気的に接続されており、
前記回路部は、前記第一温度補償用ダイオードが通電不可能な状態において、前記スイッチによって、前記第三温度補償用ダイオードを通電可能な状態と通電不可能な状態との間で切り替える、請求項4に記載の光検出装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201980056994.XA CN113167640A (zh) | 2018-12-12 | 2019-11-29 | 光检测装置 |
PCT/JP2019/046900 WO2020121854A1 (ja) | 2018-12-12 | 2019-11-29 | 光検出装置 |
EP19897484.2A EP3896412A4 (en) | 2018-12-12 | 2019-11-29 | LIGHT DETECTION DEVICE |
US17/311,756 US11513002B2 (en) | 2018-12-12 | 2019-11-29 | Light detection device having temperature compensated gain in avalanche photodiode |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018232892 | 2018-12-12 | ||
JP2018232892 | 2018-12-12 | ||
JP2018232895 | 2018-12-12 | ||
JP2018232895 | 2018-12-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020095015A JP2020095015A (ja) | 2020-06-18 |
JP7475123B2 true JP7475123B2 (ja) | 2024-04-26 |
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ID=70166526
Family Applications (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019111529A Active JP7455520B2 (ja) | 2018-12-12 | 2019-06-14 | 光検出装置 |
JP2019111528A Active JP7454917B2 (ja) | 2018-12-12 | 2019-06-14 | 光検出装置 |
JP2019175945A Active JP7475123B2 (ja) | 2018-12-12 | 2019-09-26 | 光検出装置 |
JP2019175948A Active JP6681509B1 (ja) | 2018-12-12 | 2019-09-26 | 光検出装置 |
JP2019175941A Active JP6681508B1 (ja) | 2018-12-12 | 2019-09-26 | 決定方法、及び光検出装置 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
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JP2019111529A Active JP7455520B2 (ja) | 2018-12-12 | 2019-06-14 | 光検出装置 |
JP2019111528A Active JP7454917B2 (ja) | 2018-12-12 | 2019-06-14 | 光検出装置 |
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JP2019175948A Active JP6681509B1 (ja) | 2018-12-12 | 2019-09-26 | 光検出装置 |
JP2019175941A Active JP6681508B1 (ja) | 2018-12-12 | 2019-09-26 | 決定方法、及び光検出装置 |
Country Status (8)
Country | Link |
---|---|
US (2) | US11561131B2 (ja) |
EP (3) | EP3988909A4 (ja) |
JP (5) | JP7455520B2 (ja) |
KR (2) | KR20210098524A (ja) |
CN (5) | CN113167641B (ja) |
DE (2) | DE112019006173T5 (ja) |
TW (1) | TW202044569A (ja) |
WO (2) | WO2020121855A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2020121852A1 (ja) * | 2018-12-12 | 2020-06-18 | 浜松ホトニクス株式会社 | 光検出装置 |
JP7455520B2 (ja) | 2018-12-12 | 2024-03-26 | 浜松ホトニクス株式会社 | 光検出装置 |
JPWO2022269982A1 (ja) * | 2021-06-21 | 2022-12-29 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002204149A (ja) | 2000-12-28 | 2002-07-19 | Sanken Electric Co Ltd | 電子回路装置及びこれを使用したスィチング回路装置 |
JP7027607B1 (ja) | 2021-10-01 | 2022-03-01 | 株式会社杉原クラフト | ウエイトトレーニングマシン |
JP7063854B2 (ja) | 2019-07-03 | 2022-05-09 | 本田技研工業株式会社 | ソフトウェア更新装置、サーバ装置、ソフトウェア更新方法、およびプログラム |
Family Cites Families (81)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1582850A (ja) | 1968-03-29 | 1969-10-10 | ||
JPS5062389A (ja) | 1973-10-01 | 1975-05-28 | ||
GB1535824A (en) | 1976-02-11 | 1978-12-13 | Standard Telephones Cables Ltd | Avalanche photodetector biassing system |
GB1532262A (en) | 1976-04-03 | 1978-11-15 | Ferranti Ltd | Photodiode circuit arrangements |
US4181863A (en) * | 1976-04-03 | 1980-01-01 | Ferranti Limited | Photodiode circuit arrangements |
GB1503088A (en) | 1976-07-22 | 1978-03-08 | Standard Telephones Cables Ltd | Avalanche photodetector |
JPS5341280A (en) * | 1976-09-27 | 1978-04-14 | Nippon Telegr & Teleph Corp <Ntt> | Photodetecting system of multiplication constant control |
JPS5916812Y2 (ja) * | 1978-06-27 | 1984-05-17 | キヤノン株式会社 | カメラの測光回路 |
JPS6017051B2 (ja) * | 1978-11-20 | 1985-04-30 | 東京光学機械株式会社 | アバランシェ・ダイオ−ドの温度補償方法 |
JPS55127082A (en) | 1979-03-23 | 1980-10-01 | Nec Corp | Bias voltage generating circuit of avalanche photodiode |
SE417145B (sv) | 1979-05-30 | 1981-02-23 | Asea Ab | Lavinfotodiodanordning med en lavindiod och med organ for styrning av diodens multiplikationsfaktor |
US4464048A (en) | 1981-03-25 | 1984-08-07 | Barr & Stroud Limited | Laser rangefinders |
JPS60178673A (ja) | 1984-02-24 | 1985-09-12 | Nec Corp | アバランシフオトダイオ−ド |
JPS60180347A (ja) * | 1984-02-28 | 1985-09-14 | Fujitsu Ltd | アバランシエフオトダイオ−ドの温度補償回路 |
JPS60211886A (ja) | 1984-04-05 | 1985-10-24 | Nec Corp | アバランシフオトダイオ−ドの製造方法 |
JPS6138975U (ja) * | 1984-08-09 | 1986-03-11 | 株式会社東芝 | 印刷配線板 |
JPH0799782B2 (ja) * | 1985-06-18 | 1995-10-25 | 株式会社ニコン | 半導体光検出装置 |
JPS62239727A (ja) | 1986-04-11 | 1987-10-20 | Nec Corp | アバランシエホトダイオ−ドの利得制御方式 |
JPS62279671A (ja) * | 1986-05-28 | 1987-12-04 | Mitsubishi Electric Corp | 固体撮像装置 |
JPH0828488B2 (ja) * | 1987-07-07 | 1996-03-21 | 富士通株式会社 | 半導体装置 |
JPH01118714A (ja) | 1987-10-30 | 1989-05-11 | Omron Tateisi Electron Co | 光学式位置検出センサ |
US4948989A (en) | 1989-01-31 | 1990-08-14 | Science Applications International Corporation | Radiation-hardened temperature-compensated voltage reference |
JPH0321082A (ja) | 1989-06-19 | 1991-01-29 | Fujitsu Ltd | 光受信回路 |
JP2838906B2 (ja) * | 1989-08-04 | 1998-12-16 | キヤノン株式会社 | 光電変換装置 |
JPH04111477A (ja) * | 1990-08-31 | 1992-04-13 | Sumitomo Electric Ind Ltd | 受光素子 |
JPH04256376A (ja) * | 1991-02-08 | 1992-09-11 | Hamamatsu Photonics Kk | アバランシェホトダイオード及びその製造方法 |
JPH05235396A (ja) * | 1992-02-24 | 1993-09-10 | Sumitomo Electric Ind Ltd | 半導体受光装置 |
JP3121100B2 (ja) | 1992-03-25 | 2000-12-25 | 株式会社日立製作所 | 固体撮像装置 |
JPH06224463A (ja) | 1993-01-22 | 1994-08-12 | Mitsubishi Electric Corp | 半導体受光装置 |
JPH0763854A (ja) | 1993-06-16 | 1995-03-10 | Kansei Corp | レーザー送受光装置 |
JP2686036B2 (ja) | 1993-07-09 | 1997-12-08 | 浜松ホトニクス株式会社 | アバランシェフォトダイオードのバイアス回路 |
JP3421103B2 (ja) * | 1993-12-20 | 2003-06-30 | 浜松ホトニクス株式会社 | アバランシェフォトダイオードを用いた光検出回路 |
JPH07263653A (ja) | 1994-03-17 | 1995-10-13 | Hamamatsu Photonics Kk | 固体撮像装置 |
JPH08207281A (ja) * | 1995-02-06 | 1996-08-13 | Canon Inc | インクジェット記録ヘッド |
JPH10247717A (ja) * | 1997-03-04 | 1998-09-14 | Matsushita Electron Corp | 半導体装置 |
JPH11275755A (ja) | 1998-03-19 | 1999-10-08 | Fujitsu Ltd | アバランシェフォトダイオード保護回路を有する光受信回路 |
JP2000171295A (ja) * | 1998-12-03 | 2000-06-23 | Nec Corp | Apdバイアス回路 |
JP3668926B2 (ja) | 1999-08-27 | 2005-07-06 | 株式会社ルネサステクノロジ | 光インタコネクション受信モジュール |
US6313459B1 (en) * | 2000-05-31 | 2001-11-06 | Nortel Networks Limited | Method for calibrating and operating an uncooled avalanche photodiode optical receiver |
US20030117121A1 (en) | 2001-12-20 | 2003-06-26 | Prescott Daniel C. | High-side current-sense circuit for precision application |
KR100566197B1 (ko) | 2003-01-02 | 2006-03-29 | 삼성전자주식회사 | Apd 광수신기의 온도 보상 장치 |
JP2004281488A (ja) * | 2003-03-13 | 2004-10-07 | Renesas Technology Corp | 半導体装置及びその製造方法 |
JP4223304B2 (ja) * | 2003-03-19 | 2009-02-12 | 三菱電機株式会社 | 光受信器 |
JP2004303878A (ja) * | 2003-03-31 | 2004-10-28 | Nippon Sheet Glass Co Ltd | 受光素子アレイ |
JP3956923B2 (ja) | 2003-09-19 | 2007-08-08 | 住友電気工業株式会社 | アバランシェフォトダイオードのバイアス電圧制御回路 |
JP4399337B2 (ja) * | 2004-09-13 | 2010-01-13 | 株式会社フューチャービジョン | 平面パターンを有する基板およびそれを用いた表示装置 |
JP2007266251A (ja) * | 2006-03-28 | 2007-10-11 | Nippon Telegr & Teleph Corp <Ntt> | 光半導体装置 |
TWI443817B (zh) | 2006-07-03 | 2014-07-01 | Hamamatsu Photonics Kk | Photodiode array |
CN200950235Y (zh) * | 2006-09-25 | 2007-09-19 | 深圳飞通光电子技术有限公司 | 雪崩光电二极管的温度补偿偏压电路 |
CN200959101Y (zh) * | 2006-10-12 | 2007-10-10 | 宁波中科集成电路设计中心有限公司 | 一种雪崩光电二极管的温度补偿装置 |
JP4791334B2 (ja) | 2006-12-11 | 2011-10-12 | 富士通オプティカルコンポーネンツ株式会社 | 光受信装置および光受信装置のバイアス電圧制御方法 |
JP4642047B2 (ja) * | 2007-06-15 | 2011-03-02 | 三洋電機株式会社 | 半導体装置 |
JP2009038157A (ja) * | 2007-07-31 | 2009-02-19 | Sumitomo Electric Ind Ltd | 受光素子アレイ、一次元受光素子アレイおよび二次元受光素子アレイ |
JP5483544B2 (ja) | 2009-10-21 | 2014-05-07 | 住友電工デバイス・イノベーション株式会社 | 半導体受光装置 |
CN201601136U (zh) | 2010-01-13 | 2010-10-06 | 山东交通职业学院 | 一种用于激光接收电路的温度补偿电路 |
US20120101614A1 (en) | 2010-10-22 | 2012-04-26 | Allan Ghaemi | System and Method for Manufacturing Optical Network Components |
JP5844580B2 (ja) | 2011-09-05 | 2016-01-20 | 浜松ホトニクス株式会社 | 固体撮像素子及び固体撮像素子の実装構造 |
JP5926921B2 (ja) | 2011-10-21 | 2016-05-25 | 浜松ホトニクス株式会社 | 光検出装置 |
JP5791461B2 (ja) | 2011-10-21 | 2015-10-07 | 浜松ホトニクス株式会社 | 光検出装置 |
JP2013164263A (ja) | 2012-02-09 | 2013-08-22 | Mitsubishi Electric Corp | 受光装置及び距離測定装置及び形状測定装置 |
JP5984617B2 (ja) | 2012-10-18 | 2016-09-06 | 浜松ホトニクス株式会社 | フォトダイオードアレイ |
DE102013100696B3 (de) | 2013-01-24 | 2013-11-07 | Sick Ag | Optoelektronischer Sensor und Verfahren zur Erfassung von Objekten in einem Überwachungsbereich |
KR101448393B1 (ko) * | 2013-06-27 | 2014-10-08 | 단국대학교 천안캠퍼스 산학협력단 | 의료용 레이저 수신단의 apd 이득 안정화 방법 |
CN103728030A (zh) | 2013-12-20 | 2014-04-16 | 中国科学院合肥物质科学研究院 | Apd温度自适应近红外单光子探测装置 |
US9541656B2 (en) | 2013-12-20 | 2017-01-10 | General Electric Company | System and method for compensating temperature gain variation in radiation detectors |
JP2016061729A (ja) * | 2014-09-19 | 2016-04-25 | 株式会社東芝 | 光子検出素子、光子検出装置、及び放射線分析装置 |
CN106033225B (zh) | 2015-03-16 | 2017-08-25 | 苏州旭创科技有限公司 | 低功耗apd偏压控制器与偏压控制方法及光电接收器 |
US10203400B2 (en) * | 2015-07-31 | 2019-02-12 | Avago Technologies International Sales Pte. Limited | Optical measurement system incorporating ambient light component nullification |
US9954124B1 (en) * | 2016-01-08 | 2018-04-24 | Board Of Trustees Of The University Of Alabama, For And On Behalf Of The University Of Alabama In Huntsville | Thermo-compensated silicon photo-multiplier with on-chip temperature sensor |
US11374043B2 (en) | 2016-07-27 | 2022-06-28 | Hamamatsu Photonics K.K. | Photodetection device with matrix array of avalanche diodes |
EP3339886B1 (de) * | 2016-12-22 | 2019-02-13 | Sick AG | Lichtempfänger mit einer vielzahl von lawinenphotodiodenelementen und verfahren zur versorgung mit einer vorspannung |
KR102306048B1 (ko) | 2017-01-30 | 2021-09-29 | 메디비콘 아이엔씨. | 확산 반사 보정을 갖는 형광 추적제의 비침습 모니터링 방법 |
JP6696695B2 (ja) * | 2017-03-16 | 2020-05-20 | 株式会社東芝 | 光検出装置およびこれを用いた被写体検知システム |
JP6741703B2 (ja) | 2017-03-31 | 2020-08-19 | 株式会社デンソー | 光検出器 |
KR102544296B1 (ko) | 2018-09-13 | 2023-06-16 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 표면발광레이저 소자 및 이를 구비한 표면발광레이저 장치 |
JP7455520B2 (ja) | 2018-12-12 | 2024-03-26 | 浜松ホトニクス株式会社 | 光検出装置 |
WO2020121854A1 (ja) * | 2018-12-12 | 2020-06-18 | 浜松ホトニクス株式会社 | 光検出装置 |
CN113167643B (zh) | 2018-12-12 | 2024-05-28 | 浜松光子学株式会社 | 光检测装置及光检测装置的制造方法 |
US20220020806A1 (en) | 2018-12-12 | 2022-01-20 | Hamamatsu Photonics K.K. | Light detection device |
WO2020121858A1 (ja) | 2018-12-12 | 2020-06-18 | 浜松ホトニクス株式会社 | 光検出装置及び光検出装置の製造方法 |
US20230083263A1 (en) | 2021-09-15 | 2023-03-16 | Kabushiki Kaisha Toshiba | Light detector, light detection system, lidar device, and mobile body |
-
2019
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002204149A (ja) | 2000-12-28 | 2002-07-19 | Sanken Electric Co Ltd | 電子回路装置及びこれを使用したスィチング回路装置 |
JP7063854B2 (ja) | 2019-07-03 | 2022-05-09 | 本田技研工業株式会社 | ソフトウェア更新装置、サーバ装置、ソフトウェア更新方法、およびプログラム |
JP7027607B1 (ja) | 2021-10-01 | 2022-03-01 | 株式会社杉原クラフト | ウエイトトレーニングマシン |
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