JP6617760B2 - 発光装置、液晶表示装置及び照明器具 - Google Patents
発光装置、液晶表示装置及び照明器具 Download PDFInfo
- Publication number
- JP6617760B2 JP6617760B2 JP2017208172A JP2017208172A JP6617760B2 JP 6617760 B2 JP6617760 B2 JP 6617760B2 JP 2017208172 A JP2017208172 A JP 2017208172A JP 2017208172 A JP2017208172 A JP 2017208172A JP 6617760 B2 JP6617760 B2 JP 6617760B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting device
- substrate
- wiring
- sealing member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims description 23
- 238000007789 sealing Methods 0.000 claims description 158
- 239000000758 substrate Substances 0.000 claims description 123
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 description 33
- 238000000034 method Methods 0.000 description 21
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 16
- 239000011295 pitch Substances 0.000 description 16
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 238000010586 diagram Methods 0.000 description 13
- 238000005286 illumination Methods 0.000 description 12
- 239000011521 glass Substances 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000000470 constituent Substances 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 238000000149 argon plasma sintering Methods 0.000 description 3
- 238000005401 electroluminescence Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0016—Processes relating to electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Planar Illumination Modules (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Liquid Crystal (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Description
Device)の発光装置が提案されている。例えば特許文献1には、エッジライト型のバックライトユニットに用いられるSMD型の発光装置が開示されている。
まず、本発明の第1の実施形態に係る発光装置100の概略構成について、図1を用いて説明する。図1は、本発明の第1の実施形態に係る発光装置の概観斜視図である。
次に、本発明の第2の実施形態に係る発光装置200について、図9を用いて説明する。図9の(a)は、本発明の第2の実施形態に係る発光装置の平面図である。また、図9の(b)は、(a)のX−X’線に沿って切断した本発明の第2の実施形態に係る発光装置の断面図(基板長手方向断面)であり、図9の(c)は、(a)のY−Y’線に沿って切断した本発明の第2の実施形態に係る発光装置の断面図(基板短手方向断面)である。
以下、本発明の第1及び第2の実施形態に係る発光装置の適用例について、第3〜第5の実施形態に基づいて説明する。
次に、本発明の第1及び第2の実施形態に係る発光装置を、液晶表示装置に適用した例について、図14を用いて説明する。図14は、本発明の第4の実施形態に係る液晶表示装置の断面図である。
次に、本発明の第1及び第2の実施形態に係る発光装置を、照明装置に適用した例について、図15を用いて説明する。図15は、本発明の第5の実施形態に係る照明装置の一部切り欠き斜視図である。
次に、本発明の第6の実施形態について、図16を用いて説明する。図16は、本発明の第6の実施形態に係る照明装置の概観斜視図である。本実施形態は、上記第1の実施形態に係る発光装置100を照明装置の照明用光源として適用した例である。なお、本実施形態には、第2の実施形態に係る発光装置200を適用することもできる。
2 照明器具
3 取り付け部材
4 ねじ
10、10A、10B、1010 基板
20、1020 LED
30、30A、30B、1030 封止部材
40 配線
41 第1配線
41a、42a 直線部
41b、42b 延出部
42 第2配線
50 保護素子
61、61A、61B 第1電極
62、62A、62B 第2電極
70 ワイヤ
100、200、100A、100B、340、421、520、1000 発光装置
110 発光部
300、420 バックライトユニット
310 筐体
311 開口
312 フランジ部
313 ネジ孔
320 反射シート
330 導光板
350 光学シート群
351 拡散シート
352 プリズムシート
353 偏光シート
360 前面枠
361 ネジ
370 ヒートシンク
400 液晶表示装置
410 液晶表示パネル
430 ハウジング
500 照明装置
510 直管
530 口金ピン
540 口金
600 吐出ノズル
1100 SMD型LED素子
1101 キャビティ
Claims (12)
- 基板と、
前記基板上に配置された複数のLEDと、
前記基板上に配置され、前記複数のLEDを直列接続する配線と、
前記基板上に配置され、前記複数のLEDを並列接続する、第一直線部を有する第一配線、及び第二直線部を有する第二配線と、
前記基板上に配置され、前記第一配線と電気的に接続された第一電極、及び前記第二配線と電気的に接続された第二電極と、
前記LEDを封止する封止部材と、を備え、
前記基板は、セラミックス基板又は金属基板であり、
前記配線と前記複数のLEDとは、前記第一直線部、及び前記第二直線部の直線方向に並んで、前記第一直線部と前記第二直線部との間に配置され、
前記封止部材は、前記直線方向に並んだ前記配線と前記複数のLEDとを一括封止し、且つ、前記第一直線部と前記第二直線部との間に配置されている
発光装置。 - 前記第一配線は、前記第二配線に向かって延びる第一延出部を有し、前記第二配線は、前記第一配線に向かって延びる第二延出部を有し、
前記配線、前記第一延出部、及び前記第二延出部は、前記複数のLEDを直列接続する
請求項1に記載の発光装置。 - 前記基板は、長尺の矩形形状であり、
前記複数のLEDは、前記基板の長手方向に並んでいる
請求項1または2に記載の発光装置。 - 前記第一電極は、前記基板の長手方向の一方の端部に配置され、
前記第二電極は、前記基板の長手方向の他方の端部に配置される
請求項3に記載の発光装置。 - 前記第一電極、及び前記第二電極は、前記基板の短手方向の一方に配置される
請求項3または4に記載の発光装置。 - 前記封止部材は、第一直線部、及び第二直線部の間に配置されている
請求項1から5のいずれか1項に記載の発光装置。 - 前記封止部材は、前記複数のLEDの配列方向に沿って直線状に配置されている
請求項6に記載の発光装置。 - 前記封止部材の線幅は、前記第一配線と前記第二配線との間隔とほぼ同じである
請求項7に記載の発光装置。 - 前記複数のLEDの各々に2本ずつ接続されたワイヤを、さらに備え、
前記複数のLEDの各々において、2本の前記ワイヤの架張方向は、前記LEDの配列方向と同じである
請求項1から8のいずれか1項に記載の発光装置。 - 前記第一電極と前記第二電極とは、前記基板の同じ長辺側に片寄せられて配置されている
請求項1から9のいずれか1項に記載の発光装置。 - 請求項1から10のいずれか1項に記載の発光装置と、
導光板と、を備える
液晶表示装置。 - 請求項1から10のいずれか1項に記載の発光装置と、
点灯回路と、を備える
照明器具。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011094521 | 2011-04-20 | ||
JP2011094521 | 2011-04-20 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015162297A Division JP6436434B2 (ja) | 2011-04-20 | 2015-08-19 | 発光装置、照明装置及び発光装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018046284A JP2018046284A (ja) | 2018-03-22 |
JP6617760B2 true JP6617760B2 (ja) | 2019-12-11 |
Family
ID=47041263
Family Applications (6)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012519648A Pending JPWO2012144126A1 (ja) | 2011-04-20 | 2012-03-12 | 光源、バックライトユニット、液晶表示装置及び照明装置 |
JP2013076098A Active JP5884019B2 (ja) | 2011-04-20 | 2013-04-01 | 発光装置 |
JP2014189426A Active JP6004379B2 (ja) | 2011-04-20 | 2014-09-17 | 光源、バックライトユニット、液晶表示装置及び照明装置 |
JP2014189427A Pending JP2015029122A (ja) | 2011-04-20 | 2014-09-17 | 発光装置 |
JP2015162297A Active JP6436434B2 (ja) | 2011-04-20 | 2015-08-19 | 発光装置、照明装置及び発光装置の製造方法 |
JP2017208172A Active JP6617760B2 (ja) | 2011-04-20 | 2017-10-27 | 発光装置、液晶表示装置及び照明器具 |
Family Applications Before (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012519648A Pending JPWO2012144126A1 (ja) | 2011-04-20 | 2012-03-12 | 光源、バックライトユニット、液晶表示装置及び照明装置 |
JP2013076098A Active JP5884019B2 (ja) | 2011-04-20 | 2013-04-01 | 発光装置 |
JP2014189426A Active JP6004379B2 (ja) | 2011-04-20 | 2014-09-17 | 光源、バックライトユニット、液晶表示装置及び照明装置 |
JP2014189427A Pending JP2015029122A (ja) | 2011-04-20 | 2014-09-17 | 発光装置 |
JP2015162297A Active JP6436434B2 (ja) | 2011-04-20 | 2015-08-19 | 発光装置、照明装置及び発光装置の製造方法 |
Country Status (6)
Country | Link |
---|---|
US (3) | USRE47780E1 (ja) |
EP (1) | EP2701215B1 (ja) |
JP (6) | JPWO2012144126A1 (ja) |
CN (3) | CN105826311B (ja) |
TW (1) | TWI554811B (ja) |
WO (1) | WO2012144126A1 (ja) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2013172040A1 (ja) | 2012-05-18 | 2016-01-12 | 株式会社Joled | 表示パネルと表示パネルの製造方法 |
JP2014135471A (ja) * | 2012-12-10 | 2014-07-24 | Nitto Denko Corp | 発光装置、発光装置集合体および電極付基板 |
JP6116560B2 (ja) * | 2012-06-15 | 2017-04-19 | シャープ株式会社 | 発光装置 |
JP6229261B2 (ja) * | 2012-11-22 | 2017-11-15 | 岩崎電気株式会社 | 発光素子ユニット |
JP6111494B2 (ja) * | 2012-12-05 | 2017-04-12 | パナソニックIpマネジメント株式会社 | 照明器具 |
JP6145917B2 (ja) * | 2013-01-17 | 2017-06-14 | パナソニックIpマネジメント株式会社 | 光源装置及びそれを用いた照明器具 |
KR101658396B1 (ko) * | 2013-03-21 | 2016-09-21 | 엘지디스플레이 주식회사 | 디스플레이 장치 |
JP6344689B2 (ja) * | 2013-07-16 | 2018-06-20 | パナソニックIpマネジメント株式会社 | 基板、発光装置、照明用光源、および照明装置 |
KR102067420B1 (ko) * | 2013-08-30 | 2020-01-17 | 엘지디스플레이 주식회사 | 발광다이오드어셈블리 및 그를 포함한 액정표시장치 |
TWI611722B (zh) * | 2013-09-06 | 2018-01-11 | Leadtrend Technology Corporation | 發光二極體之控制電路 |
TWI599745B (zh) | 2013-09-11 | 2017-09-21 | 晶元光電股份有限公司 | 可撓式發光二極體組件及發光二極體燈泡 |
JP6311364B2 (ja) | 2014-03-10 | 2018-04-18 | セイコーエプソン株式会社 | 印刷サーバー、印刷システム、印刷管理プログラムおよび印刷管理方法 |
JP6316045B2 (ja) * | 2014-03-20 | 2018-04-25 | 三菱電機株式会社 | 照明器具 |
JP6443751B2 (ja) * | 2015-02-12 | 2018-12-26 | パナソニックIpマネジメント株式会社 | 照明装置、照明システム及び移動体 |
US9467190B1 (en) * | 2015-04-23 | 2016-10-11 | Connor Sport Court International, Llc | Mobile electronic device covering |
KR102373025B1 (ko) * | 2015-06-12 | 2022-03-10 | 엘지전자 주식회사 | 광원모듈 및 이를 포함하는 면광원 장치 |
JP2017009725A (ja) * | 2015-06-19 | 2017-01-12 | ソニー株式会社 | 表示装置 |
CN105068313A (zh) * | 2015-08-06 | 2015-11-18 | 北京工业大学 | 一种蓝光ld背光模组及显示装置 |
KR101683771B1 (ko) * | 2016-03-22 | 2016-12-21 | 지스마트 주식회사 | 발광 면적의 확장이 가능한 투명전광판 |
JP6704182B2 (ja) * | 2016-03-24 | 2020-06-03 | パナソニックIpマネジメント株式会社 | 照明装置 |
KR102555407B1 (ko) * | 2016-06-30 | 2023-07-14 | 엘지디스플레이 주식회사 | 플렉서블 유기발광 다이오드 표시장치 |
JP6408516B2 (ja) * | 2016-07-01 | 2018-10-17 | ミネベアミツミ株式会社 | 面状照明装置及び基板 |
CN111720760A (zh) * | 2016-08-26 | 2020-09-29 | 美蓓亚三美株式会社 | 面状照明装置和基板 |
JP6735835B2 (ja) * | 2016-08-30 | 2020-08-05 | 株式会社Fuji | スプライシング装置 |
US11307434B2 (en) * | 2016-09-01 | 2022-04-19 | 3D Live, Inc. | Stereoscopic display apparatus employing light emitting diodes with polarizing film/lens materials |
CN107093658A (zh) * | 2016-09-30 | 2017-08-25 | 深圳市玲涛光电科技有限公司 | 发光元件、背光源模组及电子设备 |
JP6928823B2 (ja) * | 2016-10-17 | 2021-09-01 | パナソニックIpマネジメント株式会社 | 発光モジュール及び照明器具 |
JP2018073950A (ja) * | 2016-10-27 | 2018-05-10 | パナソニックIpマネジメント株式会社 | 発光モジュール及び照明器具 |
TWI606172B (zh) * | 2016-10-28 | 2017-11-21 | 林 招慶 | 電子鎖的背光顯示構造 |
FR3058778B1 (fr) * | 2016-11-15 | 2020-07-31 | Areva Np | Dispositif d'eclairage sous eau pour l'inspection visuelle d'un equipement de reacteur nucleaire et procede associe |
US20210125969A1 (en) * | 2017-09-15 | 2021-04-29 | Lumileds Llc | Flexible light strip |
CN109841165B (zh) * | 2017-11-29 | 2021-11-16 | 利亚德光电股份有限公司 | 小间距led显示模块及其制作方法 |
JP7135316B2 (ja) * | 2017-12-21 | 2022-09-13 | 東芝ライテック株式会社 | 光照射装置 |
KR102253007B1 (ko) * | 2019-07-19 | 2021-05-18 | (주)티디엘 | Led 필름 디스플레이, 및 이의 제조 방법 |
KR20210079898A (ko) * | 2019-12-20 | 2021-06-30 | 엘지디스플레이 주식회사 | 표시장치 |
TWI723921B (zh) * | 2020-07-17 | 2021-04-01 | 聯嘉光電股份有限公司 | 面光源之led裝置 |
JP7502141B2 (ja) | 2020-10-07 | 2024-06-18 | 伊東電機株式会社 | 発光素子モジュール、防爆照明器具、及び発光素子モジュールの製造方法 |
FR3121308B1 (fr) * | 2021-03-23 | 2023-12-22 | Appleton Grp Llc | Moteur de lumière à LED classé ZONE IEC 1 utilisant une optique pré-moulée |
US11906133B2 (en) | 2022-03-31 | 2024-02-20 | Alliance Sports Group, L.P. | Outdoor lighting apparatus |
FR3135511A1 (fr) | 2022-05-16 | 2023-11-17 | Appleton Grp Llc | Moteur de lumière à DEL certifié IEC ZONE utilisant une couche d’encapsulation pré-moulée et une feuille de métal |
Family Cites Families (68)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5257731A (en) | 1975-11-06 | 1977-05-12 | Matsushita Electric Ind Co Ltd | Light source for information reading element |
JPS52120552U (ja) * | 1976-03-02 | 1977-09-13 | ||
JPH0545812U (ja) * | 1991-11-22 | 1993-06-18 | 株式会社小糸製作所 | 車輌用灯具 |
JPH05299702A (ja) * | 1992-04-17 | 1993-11-12 | Stanley Electric Co Ltd | Ledアレイ |
JP3027479B2 (ja) | 1992-10-08 | 2000-04-04 | ローム株式会社 | 発光ダイオード光源 |
JPH06314858A (ja) | 1993-04-30 | 1994-11-08 | Toshiba Lighting & Technol Corp | 配線基板、発光ダイオードアレイ、照明装置および指針 |
JP3616127B2 (ja) | 1994-02-09 | 2005-02-02 | 松下電器産業株式会社 | 発光ダイオード整列光源 |
US20040061220A1 (en) | 1996-03-22 | 2004-04-01 | Chuichi Miyazaki | Semiconductor device and manufacturing method thereof |
WO2000045589A1 (fr) | 1999-01-26 | 2000-08-03 | Rohm Co., Ltd. | Source lumineuse lineaire et appareil de lecture d'image equipe de celle-ci |
JP2002299697A (ja) * | 2001-03-29 | 2002-10-11 | Mitsubishi Electric Lighting Corp | Led光源デバイス及び照明器具 |
JP4356383B2 (ja) | 2003-07-03 | 2009-11-04 | パナソニック電工株式会社 | 発光装置の製造方法 |
JP4543779B2 (ja) | 2004-06-25 | 2010-09-15 | 日亜化学工業株式会社 | 半導体発光装置 |
US20050285926A1 (en) * | 2004-06-29 | 2005-12-29 | Fuji Photo Film Co., Ltd. | Light source assembly, method of producing light source assembly, and color thermal printer |
JP2006179544A (ja) | 2004-12-21 | 2006-07-06 | Matsushita Electric Ind Co Ltd | Led光源 |
WO2006134839A1 (ja) * | 2005-06-13 | 2006-12-21 | Fujikura Ltd. | 発光素子実装用基板、発光モジュール及び照明装置 |
JP5214128B2 (ja) | 2005-11-22 | 2013-06-19 | シャープ株式会社 | 発光素子及び発光素子を備えたバックライトユニット |
TW200742111A (en) * | 2006-04-18 | 2007-11-01 | Harvatek Corp | LED chip encapsulation structure and method |
JP5555971B2 (ja) | 2006-07-18 | 2014-07-23 | 日亜化学工業株式会社 | 線状発光装置およびそれを用いた面状発光装置 |
US8807796B2 (en) | 2006-09-12 | 2014-08-19 | Huizhou Light Engine Ltd. | Integrally formed light emitting diode light wire and uses thereof |
US8052303B2 (en) | 2006-09-12 | 2011-11-08 | Huizhou Light Engine Ltd. | Integrally formed single piece light emitting diode light wire and uses thereof |
US8567992B2 (en) | 2006-09-12 | 2013-10-29 | Huizhou Light Engine Ltd. | Integrally formed light emitting diode light wire and uses thereof |
ES2362804T3 (es) | 2006-09-12 | 2011-07-13 | Paul Lo | Cable luminoso de diodo emisor de luz de una sola pieza formado integralmente. |
JP2008071954A (ja) | 2006-09-14 | 2008-03-27 | Mimaki Denshi Buhin Kk | 光源装置 |
JP2008078401A (ja) | 2006-09-21 | 2008-04-03 | Toshiba Lighting & Technology Corp | 照明装置 |
US20080074884A1 (en) | 2006-09-25 | 2008-03-27 | Thye Linn Mok | Compact high-intensty LED-based light source and method for making the same |
JP5060172B2 (ja) | 2007-05-29 | 2012-10-31 | 岩谷産業株式会社 | 半導体発光装置 |
JP2009010308A (ja) | 2007-05-31 | 2009-01-15 | Toshiba Lighting & Technology Corp | 発光装置 |
JP5601556B2 (ja) * | 2007-06-29 | 2014-10-08 | 東芝ライテック株式会社 | 照明装置および照明器具 |
JP2009032746A (ja) | 2007-07-24 | 2009-02-12 | Harison Toshiba Lighting Corp | 発光装置及び発光ユニット |
WO2009017117A1 (ja) | 2007-07-30 | 2009-02-05 | Sharp Kabushiki Kaisha | 発光装置、照明装置及び照明装置を備えたクリーンルーム |
JP2009038202A (ja) | 2007-08-01 | 2009-02-19 | Fujikura Ltd | 発光素子実装用基板、発光素子モジュール、照明装置、表示装置及び交通信号機 |
JP5097471B2 (ja) * | 2007-08-03 | 2012-12-12 | シャープ株式会社 | 発光装置の製造方法 |
JP5128881B2 (ja) | 2007-08-31 | 2013-01-23 | パナソニック株式会社 | 実装用基板及び発光モジュール |
JP5401025B2 (ja) | 2007-09-25 | 2014-01-29 | 三洋電機株式会社 | 発光モジュールおよびその製造方法 |
JP4893582B2 (ja) | 2007-10-25 | 2012-03-07 | 豊田合成株式会社 | 光源装置 |
US20090140271A1 (en) * | 2007-11-30 | 2009-06-04 | Wen-Jyh Sah | Light emitting unit |
TWI352419B (en) * | 2007-11-30 | 2011-11-11 | Gigno Technology Co Ltd | Light emitting unit |
US8049237B2 (en) | 2007-12-28 | 2011-11-01 | Nichia Corporation | Light emitting device |
JP5119917B2 (ja) | 2007-12-28 | 2013-01-16 | 日亜化学工業株式会社 | 発光装置 |
JP5169263B2 (ja) | 2008-02-01 | 2013-03-27 | 日亜化学工業株式会社 | 発光装置の製造方法及び発光装置 |
JP5216362B2 (ja) | 2008-02-20 | 2013-06-19 | スタンレー電気株式会社 | Led光源ユニット |
TW200939869A (en) * | 2008-03-05 | 2009-09-16 | Harvatek Corp | An LED chip package structure with a high-efficiency heat-dissipating substrate and packaging method thereof |
JP5390516B2 (ja) | 2008-05-19 | 2014-01-15 | 株式会社東芝 | 線状白色光源ならびにそれを用いたバックライトおよび液晶表示装置 |
KR20100003321A (ko) * | 2008-06-24 | 2010-01-08 | 삼성전자주식회사 | 발광 소자, 이를 포함하는 발광 장치, 상기 발광 소자 및발광 장치의 제조 방법 |
JP2010092670A (ja) | 2008-10-06 | 2010-04-22 | Panasonic Corp | 照明装置及び画像表示装置 |
US8342720B2 (en) | 2008-10-10 | 2013-01-01 | Stanley Electric Co., Ltd. | Vehicle light and road illumination device |
JP2010118531A (ja) * | 2008-11-13 | 2010-05-27 | Stanley Electric Co Ltd | 白色照明装置および車輛用灯具 |
JP2010199513A (ja) | 2009-02-27 | 2010-09-09 | Panasonic Corp | 発光装置及びこの発光装置を備えた照明装置 |
JP4801751B2 (ja) * | 2009-02-27 | 2011-10-26 | シャープ株式会社 | Ledモジュール及びled光源装置 |
KR101670981B1 (ko) | 2009-03-31 | 2016-10-31 | 서울반도체 주식회사 | 튜브형 또는 채널형의 led 조명장치 |
JP5275140B2 (ja) | 2009-06-04 | 2013-08-28 | 昭和電工株式会社 | 照明装置及び発光装置 |
TWI381564B (zh) | 2009-08-06 | 2013-01-01 | Everlight Electronics Co Ltd | 發光二極體 |
WO2011025173A2 (en) | 2009-08-27 | 2011-03-03 | Lg Electronics Inc. | Backlight unit and display device |
JP2011061056A (ja) * | 2009-09-11 | 2011-03-24 | Stanley Electric Co Ltd | 線状発光装置、その製造方法並びに面光源装置 |
JP5506313B2 (ja) | 2009-09-30 | 2014-05-28 | スタンレー電気株式会社 | 車両ヘッドライト用発光ダイオード光源 |
TWI394299B (zh) | 2009-11-06 | 2013-04-21 | Semileds Optoelectronics Co | 具有外移式電極之垂直發光二極體 |
CN201788969U (zh) * | 2009-12-30 | 2011-04-06 | 宏齐科技股份有限公司 | 一种具高导热及导光功能的发光模组及应用装置 |
KR100973330B1 (ko) | 2010-01-22 | 2010-07-30 | 주식회사 비에스엘 | Led직관램프용 led패키지 모듈 및 그 제조방법 |
JP4932064B2 (ja) | 2010-03-11 | 2012-05-16 | パナソニック株式会社 | 発光モジュール、光源装置、液晶表示装置および発光モジュールの製造方法 |
US8820950B2 (en) | 2010-03-12 | 2014-09-02 | Toshiba Lighting & Technology Corporation | Light emitting device and illumination apparatus |
JP3161182U (ja) | 2010-05-12 | 2010-07-22 | 雷徳光股▲分▼有限公司 | 発光ダイオードのパッケージ構造 |
JP4909450B2 (ja) | 2010-06-28 | 2012-04-04 | パナソニック株式会社 | 発光装置、バックライトユニット、液晶表示装置及び照明装置 |
CN102315371A (zh) * | 2010-07-05 | 2012-01-11 | 松下电工株式会社 | 发光装置 |
WO2012090350A1 (ja) | 2010-12-27 | 2012-07-05 | パナソニック株式会社 | 発光装置およびランプ |
JP3167034U (ja) | 2011-01-20 | 2011-03-31 | 睿騰光電科技股▲ふん▼有限公司 | 発光ダイオードモジュール構造 |
WO2013073181A1 (ja) | 2011-11-15 | 2013-05-23 | パナソニック株式会社 | 発光モジュールおよびこれを用いたランプ |
US8847251B2 (en) * | 2012-03-13 | 2014-09-30 | Panasonic Corporation | Substrate, light-emitting device, and lighting apparatus having a largest gap between two lines at light-emitting element mounting position |
US20140321109A1 (en) * | 2013-04-27 | 2014-10-30 | GEM Weltronics TWN Corporation | Light emitting diode (led) light tube |
-
2012
- 2012-03-12 CN CN201610213194.2A patent/CN105826311B/zh active Active
- 2012-03-12 US US15/651,187 patent/USRE47780E1/en active Active
- 2012-03-12 JP JP2012519648A patent/JPWO2012144126A1/ja active Pending
- 2012-03-12 CN CN201510808901.8A patent/CN105304800B/zh active Active
- 2012-03-12 TW TW101108215A patent/TWI554811B/zh active
- 2012-03-12 CN CN201280018773.1A patent/CN103493227B/zh active Active
- 2012-03-12 US US14/112,079 patent/US9299743B2/en not_active Ceased
- 2012-03-12 EP EP12774596.6A patent/EP2701215B1/en active Active
- 2012-03-12 WO PCT/JP2012/001698 patent/WO2012144126A1/ja active Application Filing
-
2013
- 2013-04-01 JP JP2013076098A patent/JP5884019B2/ja active Active
-
2014
- 2014-09-17 JP JP2014189426A patent/JP6004379B2/ja active Active
- 2014-09-17 JP JP2014189427A patent/JP2015029122A/ja active Pending
-
2015
- 2015-08-19 JP JP2015162297A patent/JP6436434B2/ja active Active
-
2016
- 2016-02-18 US US15/046,749 patent/US9601669B2/en active Active
-
2017
- 2017-10-27 JP JP2017208172A patent/JP6617760B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
US20160163933A1 (en) | 2016-06-09 |
CN105826311A (zh) | 2016-08-03 |
JP5884019B2 (ja) | 2016-03-15 |
JP6436434B2 (ja) | 2018-12-12 |
US9601669B2 (en) | 2017-03-21 |
JP2013141021A (ja) | 2013-07-18 |
US20140036205A1 (en) | 2014-02-06 |
EP2701215A1 (en) | 2014-02-26 |
US9299743B2 (en) | 2016-03-29 |
JP2015216405A (ja) | 2015-12-03 |
USRE47780E1 (en) | 2019-12-24 |
CN105304800B (zh) | 2019-06-11 |
CN103493227A (zh) | 2014-01-01 |
EP2701215B1 (en) | 2018-01-03 |
JPWO2012144126A1 (ja) | 2014-07-28 |
JP2018046284A (ja) | 2018-03-22 |
JP2015029122A (ja) | 2015-02-12 |
JP6004379B2 (ja) | 2016-10-05 |
CN105826311B (zh) | 2019-06-25 |
WO2012144126A1 (ja) | 2012-10-26 |
EP2701215A4 (en) | 2014-09-03 |
JP2014241448A (ja) | 2014-12-25 |
CN103493227B (zh) | 2016-09-28 |
TWI554811B (zh) | 2016-10-21 |
TW201300908A (zh) | 2013-01-01 |
CN105304800A (zh) | 2016-02-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6617760B2 (ja) | 発光装置、液晶表示装置及び照明器具 | |
US8450929B2 (en) | Light emitting device, backlight unit, liquid crystal display apparatus, and lighting apparatus | |
US8847251B2 (en) | Substrate, light-emitting device, and lighting apparatus having a largest gap between two lines at light-emitting element mounting position | |
JP5793685B2 (ja) | 発光装置、バックライトユニット、液晶表示装置及び照明装置 | |
JP5562383B2 (ja) | ランプ及び照明装置 | |
JP2015038971A (ja) | 基板、発光装置、照明用光源、および照明装置 | |
JP5568418B2 (ja) | 発光装置、バックライトユニット、液晶表示装置及び照明装置 | |
US8872300B2 (en) | Light emitting device module | |
JP2013191667A (ja) | 発光装置及び照明装置 | |
JP5789749B2 (ja) | ランプ及び照明装置 | |
JP5216948B1 (ja) | 基板、発光装置及び照明装置 | |
KR20130013955A (ko) | 발광소자 패키지 모듈 및 이를 포함하는 조명시스템 | |
JP2011077084A (ja) | Led照明装置および液晶表示装置 | |
JP2020035787A (ja) | 発光装置 | |
JP2020035637A (ja) | 発光装置及びそれを備えた照明装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20171117 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20180711 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180821 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20181018 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190326 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190517 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20191023 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20191028 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 6617760 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |