WO2009017117A1 - 発光装置、照明装置及び照明装置を備えたクリーンルーム - Google Patents

発光装置、照明装置及び照明装置を備えたクリーンルーム Download PDF

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Publication number
WO2009017117A1
WO2009017117A1 PCT/JP2008/063583 JP2008063583W WO2009017117A1 WO 2009017117 A1 WO2009017117 A1 WO 2009017117A1 JP 2008063583 W JP2008063583 W JP 2008063583W WO 2009017117 A1 WO2009017117 A1 WO 2009017117A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
illuminating apparatus
emitting device
specific wavelength
clean room
Prior art date
Application number
PCT/JP2008/063583
Other languages
English (en)
French (fr)
Inventor
Junzo Kawakami
Taiji Morimoto
Fumio Kokubo
Original Assignee
Sharp Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007197994A external-priority patent/JP4989347B2/ja
Priority claimed from JP2008126141A external-priority patent/JP2009054989A/ja
Application filed by Sharp Kabushiki Kaisha filed Critical Sharp Kabushiki Kaisha
Priority to US12/671,352 priority Critical patent/US20100195322A1/en
Priority to EP08791818.1A priority patent/EP2190035A4/en
Priority to CN2008801010268A priority patent/CN101765925B/zh
Publication of WO2009017117A1 publication Critical patent/WO2009017117A1/ja

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/02Globes; Bowls; Cover glasses characterised by the shape
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/06Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters for filtering out ultraviolet radiation
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30Elements containing photoluminescent material distinct from or spaced from the light source
    • F21V9/32Elements containing photoluminescent material distinct from or spaced from the light source characterised by the arrangement of the photoluminescent material
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • F21V23/026Fastening of transformers or ballasts
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00Planar light sources
    • F21Y2105/10Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00Planar light sources
    • F21Y2105/10Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/12Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Led Device Packages (AREA)

Abstract

 半導体発光素子と、半導体発光素子からの光に励起される蛍光体と、蛍光体を有し半導体発光素子を覆う封止樹脂とを備える発光装置において、封止樹脂が有する蛍光体により、特定の波長に反応する感光性物質が反応しないように、特定の波長成分を抑制する。複数の半導体発光素子を備える照明装置において、特定の波長に反応する感光性物質が感光することを防止するために、特定の波長を抑制する制御部を備える。クリーンルームは、このような照明装置を備えている。
PCT/JP2008/063583 2007-07-30 2008-07-29 発光装置、照明装置及び照明装置を備えたクリーンルーム WO2009017117A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/671,352 US20100195322A1 (en) 2007-07-30 2008-07-29 Light emitting device, illuminating apparatus and clean room equipped with illuminating apparatus
EP08791818.1A EP2190035A4 (en) 2007-07-30 2008-07-29 LIGHT-EMITTING DEVICE, LIGHTING APPARATUS, AND WHITE HALL WITH LIGHTING APPARATUS
CN2008801010268A CN101765925B (zh) 2007-07-30 2008-07-29 发光装置、照明装置及具有照明装置的无尘室

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007-197994 2007-07-30
JP2007197994A JP4989347B2 (ja) 2007-07-30 2007-07-30 照明装置
JP2007-199931 2007-07-31
JP2007199931 2007-07-31
JP2008126141A JP2009054989A (ja) 2007-07-31 2008-05-13 発光装置、照明装置及び当該照明装置を備えたクリーンルーム
JP2008-126141 2008-05-13

Publications (1)

Publication Number Publication Date
WO2009017117A1 true WO2009017117A1 (ja) 2009-02-05

Family

ID=42111891

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/063583 WO2009017117A1 (ja) 2007-07-30 2008-07-29 発光装置、照明装置及び照明装置を備えたクリーンルーム

Country Status (5)

Country Link
US (1) US20100195322A1 (ja)
EP (1) EP2190035A4 (ja)
KR (1) KR20100037163A (ja)
CN (1) CN101765925B (ja)
WO (1) WO2009017117A1 (ja)

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CN102097422A (zh) * 2009-10-30 2011-06-15 东芝照明技术株式会社 发光装置、发光装置的制造方法以及照明装置
CN102129138A (zh) * 2010-01-15 2011-07-20 Lg伊诺特有限公司 图像显示设备及其制造方法
WO2011104256A3 (de) * 2010-02-23 2011-12-01 Zumtobel Lighting Gmbh Anordnung zum betreiben einer led-lichtquelle
US20120037894A1 (en) * 2009-03-13 2012-02-16 Mitsubishi Chemical Corporation Process for producing organic electroluminescence element, organic electroluminescence element, organic el display, and organic el lighting
WO2014172256A1 (en) * 2013-04-17 2014-10-23 Pixi Lighting, Inc. Field-serviceable flat panel lighting device
US9335036B2 (en) 2011-05-17 2016-05-10 Pixi Lighting, Inc. Flat panel lighting device and driving circuitry
US9476552B2 (en) 2013-04-17 2016-10-25 Pixi Lighting, Inc. LED light fixture and assembly method therefor
US9500328B2 (en) 2013-04-17 2016-11-22 Pixi Lighting, Inc. Lighting assembly
US9546781B2 (en) 2013-04-17 2017-01-17 Ever Venture Solutions, Inc. Field-serviceable flat panel lighting device
US9557022B2 (en) 2015-04-30 2017-01-31 Ever Venture Solutions, Inc. Non-round retrofit recessed LED lighting fixture
JP2017204348A (ja) * 2016-05-10 2017-11-16 スターライト工業株式会社 照明器具

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WO2012144126A1 (ja) 2011-04-20 2012-10-26 パナソニック株式会社 発光装置、バックライトユニット、液晶表示装置及び照明装置
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KR102001548B1 (ko) * 2018-11-14 2019-07-19 지엘비텍 주식회사 노광 공정 조명용 백색 광원 및 조명 장치
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Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120037894A1 (en) * 2009-03-13 2012-02-16 Mitsubishi Chemical Corporation Process for producing organic electroluminescence element, organic electroluminescence element, organic el display, and organic el lighting
US8816381B2 (en) 2009-10-30 2014-08-26 Toshiba Lighting & Technology Corporation Light-emitting device, method of manufacturing light-emitting device, and illumination device
CN102097422A (zh) * 2009-10-30 2011-06-15 东芝照明技术株式会社 发光装置、发光装置的制造方法以及照明装置
CN102129138B (zh) * 2010-01-15 2015-06-10 Lg伊诺特有限公司 图像显示设备及其制造方法
CN102129138A (zh) * 2010-01-15 2011-07-20 Lg伊诺特有限公司 图像显示设备及其制造方法
WO2011104256A3 (de) * 2010-02-23 2011-12-01 Zumtobel Lighting Gmbh Anordnung zum betreiben einer led-lichtquelle
US9664365B2 (en) 2011-05-17 2017-05-30 Pixi Lighting, Inc. Flat panel lighting device
US9562678B2 (en) 2011-05-17 2017-02-07 Pixi Lighting, Inc. Flat panel lighting device
US9423113B2 (en) 2011-05-17 2016-08-23 Pixi Lighting, Inc. Flat panel lighting device and driving circuitry
US9441801B1 (en) 2011-05-17 2016-09-13 Pixi Lighting, Inc. Flat panel lighting device and driving circuitry
US9447954B2 (en) 2011-05-17 2016-09-20 Pixi Lighting, Inc. Light fixture having a central wire-way
US9453616B2 (en) 2011-05-17 2016-09-27 Pixi Lighting, Inc. Flat panel lighting device
US10422518B2 (en) 2011-05-17 2019-09-24 Unity Opto Technology Co., Ltd. Flat panel lighting device
US10364974B2 (en) 2011-05-17 2019-07-30 Unity Opto Technology Co., Ltd. Flat panel lighting device and driving circuitry
US9523487B1 (en) 2011-05-17 2016-12-20 Pixi Lighting, Inc. Flat panel lighting device and driving circuitry
US9335036B2 (en) 2011-05-17 2016-05-10 Pixi Lighting, Inc. Flat panel lighting device and driving circuitry
US9976732B2 (en) 2011-05-17 2018-05-22 Unity Opto Technology Co., Ltd. Flat panel lighting device and driving circuitry
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KR20100037163A (ko) 2010-04-08
EP2190035A1 (en) 2010-05-26
CN101765925B (zh) 2012-06-13
CN101765925A (zh) 2010-06-30
EP2190035A4 (en) 2014-01-08

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