JPS5257731A - Light source for information reading element - Google Patents

Light source for information reading element

Info

Publication number
JPS5257731A
JPS5257731A JP13382475A JP13382475A JPS5257731A JP S5257731 A JPS5257731 A JP S5257731A JP 13382475 A JP13382475 A JP 13382475A JP 13382475 A JP13382475 A JP 13382475A JP S5257731 A JPS5257731 A JP S5257731A
Authority
JP
Japan
Prior art keywords
light source
information reading
reading element
increased
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13382475A
Other languages
Japanese (ja)
Inventor
Mikio Murozono
Shohei Fujiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP13382475A priority Critical patent/JPS5257731A/en
Publication of JPS5257731A publication Critical patent/JPS5257731A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Image Input (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

PURPOSE: The outer most side section of two short sides opposing to substrate is made a little higher than the element and wiring lead in order to avoid a direct application of the voltage at assembling time to the element and lead. Thus, working efficiency is increased with increased characteristics stability and dependability.
COPYRIGHT: (C)1977,JPO&Japio
JP13382475A 1975-11-06 1975-11-06 Light source for information reading element Pending JPS5257731A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13382475A JPS5257731A (en) 1975-11-06 1975-11-06 Light source for information reading element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13382475A JPS5257731A (en) 1975-11-06 1975-11-06 Light source for information reading element

Publications (1)

Publication Number Publication Date
JPS5257731A true JPS5257731A (en) 1977-05-12

Family

ID=15113887

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13382475A Pending JPS5257731A (en) 1975-11-06 1975-11-06 Light source for information reading element

Country Status (1)

Country Link
JP (1) JPS5257731A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0465464U (en) * 1990-10-19 1992-06-08
US5278432A (en) * 1992-08-27 1994-01-11 Quantam Devices, Inc. Apparatus for providing radiant energy
JP2015029122A (en) * 2011-04-20 2015-02-12 パナソニックＩｐマネジメント株式会社 Light emitting device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4722179U (en) * 1971-04-03 1972-11-13
JPS4934733A (en) * 1972-07-31 1974-03-30
JPS4940261U (en) * 1972-07-05 1974-04-09
JPS509328A (en) * 1973-05-22 1975-01-30

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4722179U (en) * 1971-04-03 1972-11-13
JPS4940261U (en) * 1972-07-05 1974-04-09
JPS4934733A (en) * 1972-07-31 1974-03-30
JPS509328A (en) * 1973-05-22 1975-01-30

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0465464U (en) * 1990-10-19 1992-06-08
US5278432A (en) * 1992-08-27 1994-01-11 Quantam Devices, Inc. Apparatus for providing radiant energy
JP2015029122A (en) * 2011-04-20 2015-02-12 パナソニックＩｐマネジメント株式会社 Light emitting device
US9299743B2 (en) 2011-04-20 2016-03-29 Panasonic Intellectual Property Management Co., Ltd. Light-emitting apparatus, backlight unit, liquid crystal display apparatus, and illumination apparatus
US9601669B2 (en) 2011-04-20 2017-03-21 Panasonic Intellectual Property Management Co., Ltd. Light-emitting apparatus, backlight unit, liquid crystal display apparatus, and illumination apparatus
USRE47780E1 (en) 2011-04-20 2019-12-24 Panasonic Intellectual Property Management Co., Ltd. Light-emitting apparatus, backlight unit, liquid crystal display apparatus, and illumination apparatus

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