JP6504762B2 - モジュールの製造方法 - Google Patents

モジュールの製造方法 Download PDF

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Publication number
JP6504762B2
JP6504762B2 JP2014159755A JP2014159755A JP6504762B2 JP 6504762 B2 JP6504762 B2 JP 6504762B2 JP 2014159755 A JP2014159755 A JP 2014159755A JP 2014159755 A JP2014159755 A JP 2014159755A JP 6504762 B2 JP6504762 B2 JP 6504762B2
Authority
JP
Japan
Prior art keywords
solder
solder paste
lands
land
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014159755A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016039181A (ja
JP2016039181A5 (enExample
Inventor
片岡　一郎
一郎 片岡
近藤　浩史
浩史 近藤
小坂　忠志
忠志 小坂
幸司 都築
幸司 都築
久種 小森
久種 小森
長谷川　真
真 長谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2014159755A priority Critical patent/JP6504762B2/ja
Priority to US14/817,013 priority patent/US9815133B2/en
Publication of JP2016039181A publication Critical patent/JP2016039181A/ja
Publication of JP2016039181A5 publication Critical patent/JP2016039181A5/ja
Application granted granted Critical
Publication of JP6504762B2 publication Critical patent/JP6504762B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP2014159755A 2014-08-05 2014-08-05 モジュールの製造方法 Active JP6504762B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014159755A JP6504762B2 (ja) 2014-08-05 2014-08-05 モジュールの製造方法
US14/817,013 US9815133B2 (en) 2014-08-05 2015-08-03 Method for producing a module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014159755A JP6504762B2 (ja) 2014-08-05 2014-08-05 モジュールの製造方法

Publications (3)

Publication Number Publication Date
JP2016039181A JP2016039181A (ja) 2016-03-22
JP2016039181A5 JP2016039181A5 (enExample) 2017-09-14
JP6504762B2 true JP6504762B2 (ja) 2019-04-24

Family

ID=55268542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014159755A Active JP6504762B2 (ja) 2014-08-05 2014-08-05 モジュールの製造方法

Country Status (2)

Country Link
US (1) US9815133B2 (enExample)
JP (1) JP6504762B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6905171B2 (ja) * 2016-09-30 2021-07-21 日亜化学工業株式会社 半導体装置用パッケージおよびそれを用いた半導体装置。
JP7136552B2 (ja) * 2017-11-29 2022-09-13 Fdk株式会社 回路基板およびその製造方法
JP7425587B2 (ja) * 2019-12-04 2024-01-31 日立Astemo株式会社 電子制御装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH087655B2 (ja) 1989-03-15 1996-01-29 富士通株式会社 メニュー表示制御装置
JPH03284895A (ja) 1990-03-30 1991-12-16 Taiyo Yuden Co Ltd ペースト状半田の印刷方法
JPH0846343A (ja) 1994-07-27 1996-02-16 Tdk Corp リード端子の半田付け方法とその方法に用いるスクリーン
JPH0878824A (ja) 1994-08-29 1996-03-22 Whitaker Corp:The 被接続板状体
JPH09162504A (ja) * 1995-12-13 1997-06-20 Toshiba Corp プリント回路基板
JP4311774B2 (ja) * 1998-03-11 2009-08-12 富士通株式会社 電子部品パッケージおよびプリント配線板
JP2002290021A (ja) 2001-03-23 2002-10-04 Toshiba Corp 回路基板、回路基板モジュール、及び電子機器
JP2005064206A (ja) 2003-08-11 2005-03-10 Niigata Seimitsu Kk 半導体部品の半田付け方法および半導体部品の実装構造
JP2005210022A (ja) 2004-01-26 2005-08-04 Fujikura Ltd プリント配線板およびその製造方法
JP2005294632A (ja) 2004-04-01 2005-10-20 Hitachi Ltd 表面実装素子の半田付け構造
JP2006287060A (ja) 2005-04-01 2006-10-19 Sony Corp 回路基板、およびチップ部品の半田付け構造
US8022532B2 (en) * 2005-06-06 2011-09-20 Rohm Co., Ltd. Interposer and semiconductor device
JP2008103547A (ja) 2006-10-19 2008-05-01 Murata Mach Ltd 半田ペースト塗布方法及び電子回路基板
JP2008288484A (ja) 2007-05-21 2008-11-27 Mitsubishi Electric Corp 電子部品の実装方法
JP2009224697A (ja) 2008-03-18 2009-10-01 Asmo Co Ltd プリント基板及び電子部品実装基板
JP4985708B2 (ja) 2009-06-02 2012-07-25 Ｎｅｃアクセステクニカ株式会社 電子部品の半田付け方法および電子部品実装用基板
JP2011096819A (ja) * 2009-10-29 2011-05-12 Panasonic Corp 半導体装置および回路基板
JP5581972B2 (ja) * 2010-10-27 2014-09-03 アイシン・エィ・ダブリュ株式会社 電子部品、及び電子装置
JP5640861B2 (ja) * 2011-03-29 2014-12-17 セイコーエプソン株式会社 電子部品の製造方法と配線基板

Also Published As

Publication number Publication date
US20160044796A1 (en) 2016-02-11
JP2016039181A (ja) 2016-03-22
US9815133B2 (en) 2017-11-14

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