JP6275863B2 - 半導体装置及び半導体素子保護用材料 - Google Patents

半導体装置及び半導体素子保護用材料 Download PDF

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JP6275863B2
JP6275863B2 JP2016553906A JP2016553906A JP6275863B2 JP 6275863 B2 JP6275863 B2 JP 6275863B2 JP 2016553906 A JP2016553906 A JP 2016553906A JP 2016553906 A JP2016553906 A JP 2016553906A JP 6275863 B2 JP6275863 B2 JP 6275863B2
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compound
cured product
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weight
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JPWO2017030126A1 (ja
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貴史 西村
貴史 西村
前中　寛
寛 前中
秀 中村
秀 中村
卓司 青山
卓司 青山
小林　祐輔
祐輔 小林
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2016553906A 2015-08-17 2016-08-16 半導体装置及び半導体素子保護用材料 Active JP6275863B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015160674 2015-08-17
JP2015160674 2015-08-17
PCT/JP2016/073934 WO2017030126A1 (ja) 2015-08-17 2016-08-16 半導体装置及び半導体素子保護用材料

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JP2017249182A Division JP6731906B2 (ja) 2015-08-17 2017-12-26 半導体装置及び半導体素子保護用材料

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JPWO2017030126A1 JPWO2017030126A1 (ja) 2017-08-17
JP6275863B2 true JP6275863B2 (ja) 2018-02-07

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JP2017249182A Active JP6731906B2 (ja) 2015-08-17 2017-12-26 半導体装置及び半導体素子保護用材料
JP2020115407A Active JP6905129B2 (ja) 2015-08-17 2020-07-03 半導体装置及び半導体素子保護用材料

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JP2020115407A Active JP6905129B2 (ja) 2015-08-17 2020-07-03 半導体装置及び半導体素子保護用材料

Country Status (5)

Country Link
JP (3) JP6275863B2 (ko)
KR (5) KR101864096B1 (ko)
CN (2) CN111900137A (ko)
TW (1) TWI630230B (ko)
WO (1) WO2017030126A1 (ko)

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CN109890899B (zh) * 2016-09-29 2021-10-26 陶氏东丽株式会社 固化性有机硅组合物、其固化物、及光半导体装置
TWI828621B (zh) * 2017-03-30 2024-01-11 日商味之素股份有限公司 糊狀樹脂組成物
JP7420559B2 (ja) * 2018-01-23 2024-01-23 ナガセケムテックス株式会社 封止用樹脂組成物
JP6981914B2 (ja) * 2018-04-09 2021-12-17 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
WO2019216388A1 (ja) * 2018-05-10 2019-11-14 積水化学工業株式会社 硬化性組成物、半導体素子保護用材料、及び半導体装置
JP6764149B1 (ja) * 2018-11-14 2020-09-30 ナガセケムテックス株式会社 硬化性樹脂組成物および硬化性シート
JP7247003B2 (ja) 2019-04-12 2023-03-28 本田技研工業株式会社 放熱性塗料組成物及び放熱性被膜の製造方法
WO2021131523A1 (ja) * 2019-12-24 2021-07-01 富士フイルム株式会社 内視鏡用接着剤及びその硬化物、並びに内視鏡及びその製造方法
JP7328184B2 (ja) * 2020-08-06 2023-08-16 信越化学工業株式会社 熱伝導性２液付加硬化型シリコーン組成物及びその製造方法
WO2024005037A1 (ja) * 2022-07-01 2024-01-04 三井化学株式会社 表示装置

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JP2817474B2 (ja) 1991-09-25 1998-10-30 信越化学工業株式会社 エポキシ樹脂組成物及び硬化物
JP3821173B2 (ja) 1996-12-19 2006-09-13 信越化学工業株式会社 エポキシ樹脂組成物
JP4190080B2 (ja) * 1999-03-16 2008-12-03 日東電工株式会社 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
JP3847032B2 (ja) * 1999-08-26 2006-11-15 住友ベークライト株式会社 液状封止樹脂組成物及びそれを用いた半導体装置
JP3921630B2 (ja) * 2000-04-05 2007-05-30 株式会社日立製作所 エポキシ樹脂複合材料及びそれを用いた装置
US8017449B2 (en) * 2003-08-08 2011-09-13 Dow Corning Corporation Process for fabricating electronic components using liquid injection molding
JP2005200533A (ja) 2004-01-15 2005-07-28 Kyocera Chemical Corp 半導体封止用エポキシ樹脂組成物および樹脂封止型半導体装置
JP4531578B2 (ja) * 2005-01-27 2010-08-25 ローム株式会社 半導体装置
JP2006232950A (ja) * 2005-02-23 2006-09-07 Matsushita Electric Works Ltd 封止用液状エポキシ樹脂組成物、半導体装置及びその製造方法
JP2007217469A (ja) 2006-02-14 2007-08-30 Kyocera Chemical Corp 封止用エポキシ樹脂組成物および半導体装置
JP4823161B2 (ja) * 2007-07-20 2011-11-24 日本テキサス・インスツルメンツ株式会社 半導体装置
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JP6230363B2 (ja) * 2013-10-08 2017-11-15 ナミックス株式会社 フィルム用樹脂組成物、絶縁フィルムおよび半導体装置
WO2015076457A1 (ko) * 2013-11-21 2015-05-28 주식회사 동부하이텍 씨오에프형 반도체 패키지 및 그 제조 방법
JPWO2016010067A1 (ja) * 2014-07-18 2017-04-27 積水化学工業株式会社 半導体素子保護用材料及び半導体装置
JP5766867B1 (ja) * 2014-11-25 2015-08-19 積水化学工業株式会社 半導体素子保護用材料及び半導体装置

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KR20180013842A (ko) 2018-02-07
KR102460328B1 (ko) 2022-10-28
KR102224210B1 (ko) 2021-03-08
KR20210107160A (ko) 2021-08-31
TW201723071A (zh) 2017-07-01
JP2020170867A (ja) 2020-10-15
JPWO2017030126A1 (ja) 2017-08-17
KR102097004B1 (ko) 2020-04-03
KR102294307B1 (ko) 2021-08-26
WO2017030126A1 (ja) 2017-02-23
KR101864096B1 (ko) 2018-06-01
CN107735859A (zh) 2018-02-23
KR20200037437A (ko) 2020-04-08
CN107735859B (zh) 2020-08-14
JP2018056595A (ja) 2018-04-05
JP6905129B2 (ja) 2021-07-21
JP6731906B2 (ja) 2020-07-29
KR20210027521A (ko) 2021-03-10
TWI630230B (zh) 2018-07-21
KR20180061405A (ko) 2018-06-07
CN111900137A (zh) 2020-11-06

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