TWI630230B - 半導體裝置及半導體元件保護用材料 - Google Patents

半導體裝置及半導體元件保護用材料 Download PDF

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Publication number
TWI630230B
TWI630230B TW105126219A TW105126219A TWI630230B TW I630230 B TWI630230 B TW I630230B TW 105126219 A TW105126219 A TW 105126219A TW 105126219 A TW105126219 A TW 105126219A TW I630230 B TWI630230 B TW I630230B
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TW
Taiwan
Prior art keywords
semiconductor element
semiconductor device
compound
weight
hardened
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TW105126219A
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English (en)
Chinese (zh)
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TW201723071A (zh
Inventor
西村貴史
前中寬
中村秀
青山卓司
小林祐輔
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日商積水化學工業股份有限公司
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Publication of TW201723071A publication Critical patent/TW201723071A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW105126219A 2015-08-17 2016-08-17 半導體裝置及半導體元件保護用材料 TWI630230B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015160674 2015-08-17
JP2015-160674 2015-08-17

Publications (2)

Publication Number Publication Date
TW201723071A TW201723071A (zh) 2017-07-01
TWI630230B true TWI630230B (zh) 2018-07-21

Family

ID=58052215

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105126219A TWI630230B (zh) 2015-08-17 2016-08-17 半導體裝置及半導體元件保護用材料

Country Status (5)

Country Link
JP (3) JP6275863B2 (ko)
KR (5) KR102460328B1 (ko)
CN (2) CN111900137A (ko)
TW (1) TWI630230B (ko)
WO (1) WO2017030126A1 (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6915954B2 (ja) * 2016-09-29 2021-08-11 ダウ・東レ株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
TWI828621B (zh) * 2017-03-30 2024-01-11 日商味之素股份有限公司 糊狀樹脂組成物
US11760870B2 (en) * 2018-01-23 2023-09-19 Nagase Chemtex Corporation Resin composition for encapsulation
JP6981914B2 (ja) * 2018-04-09 2021-12-17 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
WO2019216388A1 (ja) * 2018-05-10 2019-11-14 積水化学工業株式会社 硬化性組成物、半導体素子保護用材料、及び半導体装置
WO2020100345A1 (ja) * 2018-11-14 2020-05-22 ナガセケムテックス株式会社 硬化性樹脂組成物および硬化性シート
JP7247003B2 (ja) 2019-04-12 2023-03-28 本田技研工業株式会社 放熱性塗料組成物及び放熱性被膜の製造方法
JP7273194B2 (ja) * 2019-12-24 2023-05-12 富士フイルム株式会社 内視鏡用接着剤及びその硬化物、並びに内視鏡及びその製造方法
JP7328184B2 (ja) * 2020-08-06 2023-08-16 信越化学工業株式会社 熱伝導性２液付加硬化型シリコーン組成物及びその製造方法
WO2024005037A1 (ja) * 2022-07-01 2024-01-04 三井化学株式会社 表示装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006210612A (ja) * 2005-01-27 2006-08-10 Rohm Co Ltd 半導体装置
JP2013001861A (ja) * 2011-06-20 2013-01-07 Kyocera Chemical Corp 半導体封止用樹脂組成物、その製造方法及び半導体装置
JP2013030637A (ja) * 2011-07-29 2013-02-07 Sumitomo Bakelite Co Ltd 液状樹脂組成物および半導体装置
TW201516088A (zh) * 2013-10-08 2015-05-01 Namics Corp 薄膜用樹脂組成物、絕緣膜及半導體裝置

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2817474B2 (ja) 1991-09-25 1998-10-30 信越化学工業株式会社 エポキシ樹脂組成物及び硬化物
JP3821173B2 (ja) 1996-12-19 2006-09-13 信越化学工業株式会社 エポキシ樹脂組成物
JP4190080B2 (ja) * 1999-03-16 2008-12-03 日東電工株式会社 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
JP3847032B2 (ja) * 1999-08-26 2006-11-15 住友ベークライト株式会社 液状封止樹脂組成物及びそれを用いた半導体装置
JP3921630B2 (ja) * 2000-04-05 2007-05-30 株式会社日立製作所 エポキシ樹脂複合材料及びそれを用いた装置
WO2005017995A1 (en) * 2003-08-08 2005-02-24 Dow Corning Corporation Process for fabricating electronic components using liquid injection molding
JP2005200533A (ja) 2004-01-15 2005-07-28 Kyocera Chemical Corp 半導体封止用エポキシ樹脂組成物および樹脂封止型半導体装置
JP2006232950A (ja) * 2005-02-23 2006-09-07 Matsushita Electric Works Ltd 封止用液状エポキシ樹脂組成物、半導体装置及びその製造方法
JP2007217469A (ja) 2006-02-14 2007-08-30 Kyocera Chemical Corp 封止用エポキシ樹脂組成物および半導体装置
JP4823161B2 (ja) * 2007-07-20 2011-11-24 日本テキサス・インスツルメンツ株式会社 半導体装置
KR101174971B1 (ko) * 2007-09-05 2012-08-17 세키스이가가쿠 고교가부시키가이샤 절연 시트 및 적층 구조체
JP2009263601A (ja) * 2008-04-30 2009-11-12 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び電子部品装置
JP5721416B2 (ja) * 2010-12-13 2015-05-20 積水化学工業株式会社 熱伝導性接着剤
JP6134089B2 (ja) * 2011-02-22 2017-05-24 積水化学工業株式会社 絶縁材料及び積層構造体
JP2012199544A (ja) * 2011-03-09 2012-10-18 Sekisui Chem Co Ltd 異方性導電ペースト、接続構造体及び接続構造体の製造方法
JP2013067673A (ja) * 2011-09-20 2013-04-18 Hitachi Chemical Co Ltd 樹脂ペースト組成物及び半導体装置
JP5913884B2 (ja) * 2011-09-27 2016-04-27 積水化学工業株式会社 絶縁材料及び積層構造体
JP5444315B2 (ja) * 2011-12-07 2014-03-19 積水化学工業株式会社 光半導体装置用ダイボンド材及びそれを用いた光半導体装置
JP2014040538A (ja) 2012-08-23 2014-03-06 Hitachi Chemical Co Ltd ２液タイプのエポキシ樹脂組成物
CN104823276A (zh) * 2013-11-21 2015-08-05 东部Hitek株式会社 覆晶薄膜型半导体封装及其制造方法
KR102383397B1 (ko) * 2014-07-18 2022-04-08 세키스이가가쿠 고교가부시키가이샤 반도체 소자 보호용 재료 및 반도체 장치
JP5766867B1 (ja) * 2014-11-25 2015-08-19 積水化学工業株式会社 半導体素子保護用材料及び半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006210612A (ja) * 2005-01-27 2006-08-10 Rohm Co Ltd 半導体装置
JP2013001861A (ja) * 2011-06-20 2013-01-07 Kyocera Chemical Corp 半導体封止用樹脂組成物、その製造方法及び半導体装置
JP2013030637A (ja) * 2011-07-29 2013-02-07 Sumitomo Bakelite Co Ltd 液状樹脂組成物および半導体装置
TW201516088A (zh) * 2013-10-08 2015-05-01 Namics Corp 薄膜用樹脂組成物、絕緣膜及半導體裝置

Also Published As

Publication number Publication date
WO2017030126A1 (ja) 2017-02-23
KR20210107160A (ko) 2021-08-31
JP6731906B2 (ja) 2020-07-29
KR102294307B1 (ko) 2021-08-26
KR102224210B1 (ko) 2021-03-08
KR20210027521A (ko) 2021-03-10
KR102097004B1 (ko) 2020-04-03
JP6275863B2 (ja) 2018-02-07
JP2020170867A (ja) 2020-10-15
KR101864096B1 (ko) 2018-06-01
CN107735859A (zh) 2018-02-23
JP2018056595A (ja) 2018-04-05
JPWO2017030126A1 (ja) 2017-08-17
KR102460328B1 (ko) 2022-10-28
TW201723071A (zh) 2017-07-01
KR20200037437A (ko) 2020-04-08
CN111900137A (zh) 2020-11-06
JP6905129B2 (ja) 2021-07-21
KR20180013842A (ko) 2018-02-07
CN107735859B (zh) 2020-08-14
KR20180061405A (ko) 2018-06-07

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