JP4823161B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP4823161B2 JP4823161B2 JP2007189775A JP2007189775A JP4823161B2 JP 4823161 B2 JP4823161 B2 JP 4823161B2 JP 2007189775 A JP2007189775 A JP 2007189775A JP 2007189775 A JP2007189775 A JP 2007189775A JP 4823161 B2 JP4823161 B2 JP 4823161B2
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
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- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
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- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
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- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
- H01L2924/1533—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate
- H01L2924/15331—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Description
さらに本発明の目的は、基板の一面に搭載された複数の半導体チップのモールド樹脂を小型化、薄型化することができる半導体装置の製造方法を提供する。
さらに本発明の目的は、モールド樹脂が形成された基板の一面上に他の表面実装型の半導体装置を積層することができる半導体装置およびその製造方法を提供することを目的とする。
また、本発明に係る半導体装置は、一方の面に形成された第1及び第2の接続領域と、他方の面に形成された第3の接続領域とを有し、上記第2の接続領域が上記第1の接続領域の外側に位置する絶縁基板と、上記絶縁基板の一方の面に回路形成面を下にして搭載された半導体チップと、上記半導体チップの回路形成面上の電極と上記第1の接続領域との間に介在してそれらを電気的に接続する導電部材と、上記絶縁基板の一方の面上において、上記半導体チップと上記導電部材と上記第1の接続領域とを封止する矩形状の樹脂とを有し、上記樹脂の隅部に突起部が形成されている。
好ましくは、上記突起部が上記樹脂の四方の隅部に形成されている。好ましくは、上記突起部は樹脂の対角線状に延びている。好ましくは、上記突起部は、上記第2の接続領域から離間されている。好ましくは、上記樹脂の四方の隅部にはチャンファーが形成され、上記突起部は上記チャンファーにそれぞれ接続される。好ましくは、上記矩形状の樹脂の側面が傾斜している。好ましくは、上記第2及び第3の接続領域に設けられた外部接続端子を更に有する。好ましくは、上記第2の接続領域に設けられた外部接続端子の高さが上記樹脂の高さよりも高い。好ましくは、上記樹脂の上方に他の半導体装置が搭載され、当該他の半導体装置が上記第2の接続領域に設けられた外部接続端子に接続されている。好ましくは、上記第3の接続領域に設けられた外部接続端子が半田ボールである。好ましくは、上記第2の接続領域に設けられた外部接続端子が半田ボールである。好ましくは、上記樹脂が金型に設けられた個別のキャビティにより加圧成型される。好ましくは、上記加圧成型が減圧下で行なわれる。好ましくは、上記突起部が上記キャビティの隅部に設けられたエアポケットに対応する。
102、210、304、306:半導体チップ
104、212:ボンディングワイヤ
110:供給部
112:ノズル
114:液状樹脂
130:下部金型
140:上部金型
142:リリースフィルム
144:キャビティ
146:押圧部材
150:吸気孔
152:脚部
160、184、206、410:モールド樹脂
170、186:チャンファー
180:エアポケット
182:ランド
188:突起
200:第1の半導体装置
202:多層配線基板
204:はんだボール
208:ダイアタッチ
300:第2の半導体装置
Claims (12)
- 一方の面に形成された第1及び第2の接続領域と、他方の面に形成された第3の接続領域とを有し、上記第2の接続領域が上記第1の接続領域の外側に位置する絶縁基板と、
上記絶縁基板の一方の面に回路形成面を上にして搭載された半導体チップと、
上記半導体チップの回路形成面上の電極と上記第1の接続領域とを電気的に接続するボンディングワイヤと、
上記絶縁基板の一方の面上において、上記半導体チップと上記ボンディングワイヤと上記第1の接続領域とを封止する矩形状の樹脂と、
を有し、
上記矩形状の樹脂は、凹部が形成された型形成部材を上記絶縁基板の一方の面に当接した際に上記凹部と上記絶縁基板とにより形成される密閉空間のキャビティにより成型され、
上記キャビティのコーナーに、上記絶縁基板の一方の面に沿うようにエアポケットが設けられており、
上記樹脂の隅部に、上記エアポケットに対応して上記絶縁基板の一方の面に接する突起部が形成されている、
半導体装置。 - 一方の面に形成された第1及び第2の接続領域と、他方の面に形成された第3の接続領域とを有し、上記第2の接続領域が上記第1の接続領域の外側に位置する絶縁基板と、
上記絶縁基板の一方の面に回路形成面を下にして搭載された半導体チップと、
上記半導体チップの回路形成面上の電極と上記第1の接続領域との間に介在してそれらを電気的に接続する導電部材と、
上記絶縁基板の一方の面上において、上記半導体チップと上記導電部材と上記第1の接続領域とを封止する矩形状の樹脂と、
を有し、
上記矩形状の樹脂は、凹部が形成された型形成部材を上記絶縁基板の一方の面に当接した際に上記凹部と上記絶縁基板とにより形成される密閉空間のキャビティにより成型され、
上記キャビティのコーナーに、上記絶縁基板の一方の面に沿うようにエアポケットが設けられており、
上記樹脂の隅部に、上記エアポケットに対応して上記絶縁基板の一方の面に接する突起部が形成されている、
半導体装置。 - 請求項1又は2に記載の半導体装置であって、上記突起部が上記樹脂の四方の隅部に形成されている、半導体装置。
- 請求項1又は2に記載の半導体装置であって、上記突起部は樹脂の対角線状に延びる、半導体装置。
- 請求項1乃至4何れか記載の半導体装置であって、上記突起部は、上記第2の接続領域から離間されている、半導体装置。
- 請求項3に記載の半導体装置であって、上記樹脂の四方の隅部にはチャンファーが形成され、上記突起部は上記チャンファーにそれぞれ接続される、半導体装置。
- 請求項3乃至6何れかに記載の半導体装置であって、上記矩形状の樹脂の側面が傾斜している、半導体装置。
- 請求項1乃至7の何れかに記載の半導体装置であって、上記第2及び第3の接続領域に設けられた外部接続端子を更に有する、半導体装置。
- 請求項8に記載の半導体装置であって、上記第2の接続領域に設けられた外部接続端子の高さが上記樹脂の高さよりも高い、半導体装置。
- 上記請求項8又は9に記載の半導体装置であって、上記樹脂の上方に他の半導体装置が搭載され、当該他の半導体装置が上記第2の接続領域に設けられた外部接続端子に接続されている、半導体装置。
- 請求項8乃至10の何れかに記載の半導体装置であって、上記第3の接続領域に設けられた外部接続端子が半田ボールである、半導体装置。
- 請求項11に記載の半導体装置であって、上記第2の接続領域に設けられた外部接続端子が半田ボールである、半導体装置。
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CN107735859B (zh) * | 2015-08-17 | 2020-08-14 | 积水化学工业株式会社 | 半导体装置以及半导体元件保护用材料 |
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US5222014A (en) * | 1992-03-02 | 1993-06-22 | Motorola, Inc. | Three-dimensional multi-chip pad array carrier |
JPH06216181A (ja) * | 1993-01-14 | 1994-08-05 | Sony Corp | 樹脂封止金型 |
JPH0758247A (ja) * | 1993-08-11 | 1995-03-03 | Toshiba Corp | 半導体パッケージ |
JPH07221132A (ja) * | 1993-12-06 | 1995-08-18 | Fujitsu Ltd | 半導体装置及びその製造方法並びに半導体装置ユニット及びその製造方法 |
JPH07283344A (ja) * | 1994-04-13 | 1995-10-27 | Shinko Electric Ind Co Ltd | 半導体装置 |
JP2005333034A (ja) * | 2004-05-21 | 2005-12-02 | Matsushita Electric Ind Co Ltd | 半導体装置、その製造方法および実装方法 |
JP4001608B2 (ja) * | 2005-06-27 | 2007-10-31 | 日本テキサス・インスツルメンツ株式会社 | 半導体装置および半導体装置の製造方法 |
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