CN111900137A - 半导体装置以及半导体元件保护用材料 - Google Patents

半导体装置以及半导体元件保护用材料 Download PDF

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Publication number
CN111900137A
CN111900137A CN202010712095.5A CN202010712095A CN111900137A CN 111900137 A CN111900137 A CN 111900137A CN 202010712095 A CN202010712095 A CN 202010712095A CN 111900137 A CN111900137 A CN 111900137A
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semiconductor element
cured product
protecting
compound
less
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CN202010712095.5A
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English (en)
Chinese (zh)
Inventor
西村贵史
前中宽
中村秀
青山卓司
小林祐辅
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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Publication of CN111900137A publication Critical patent/CN111900137A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202010712095.5A 2015-08-17 2016-08-16 半导体装置以及半导体元件保护用材料 Pending CN111900137A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015160674 2015-08-17
JP2015-160674 2015-08-17
CN201680033071.9A CN107735859B (zh) 2015-08-17 2016-08-16 半导体装置以及半导体元件保护用材料

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201680033071.9A Division CN107735859B (zh) 2015-08-17 2016-08-16 半导体装置以及半导体元件保护用材料

Publications (1)

Publication Number Publication Date
CN111900137A true CN111900137A (zh) 2020-11-06

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CN201680033071.9A Active CN107735859B (zh) 2015-08-17 2016-08-16 半导体装置以及半导体元件保护用材料
CN202010712095.5A Pending CN111900137A (zh) 2015-08-17 2016-08-16 半导体装置以及半导体元件保护用材料

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Country Link
JP (3) JP6275863B2 (ko)
KR (5) KR102460328B1 (ko)
CN (2) CN107735859B (ko)
TW (1) TWI630230B (ko)
WO (1) WO2017030126A1 (ko)

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WO2018062009A1 (ja) * 2016-09-29 2018-04-05 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
WO2018181737A1 (ja) * 2017-03-30 2018-10-04 味の素株式会社 ペースト状樹脂組成物
US11760870B2 (en) * 2018-01-23 2023-09-19 Nagase Chemtex Corporation Resin composition for encapsulation
JP6981914B2 (ja) * 2018-04-09 2021-12-17 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
WO2019216388A1 (ja) * 2018-05-10 2019-11-14 積水化学工業株式会社 硬化性組成物、半導体素子保護用材料、及び半導体装置
JP6764149B1 (ja) * 2018-11-14 2020-09-30 ナガセケムテックス株式会社 硬化性樹脂組成物および硬化性シート
WO2020138401A1 (ja) 2018-12-28 2020-07-02 株式会社朝日ラバー 低分子シロキサン含有率を低減させた光学部材及びその製造方法
JP7247003B2 (ja) * 2019-04-12 2023-03-28 本田技研工業株式会社 放熱性塗料組成物及び放熱性被膜の製造方法
JP7273194B2 (ja) * 2019-12-24 2023-05-12 富士フイルム株式会社 内視鏡用接着剤及びその硬化物、並びに内視鏡及びその製造方法
JP7328184B2 (ja) * 2020-08-06 2023-08-16 信越化学工業株式会社 熱伝導性２液付加硬化型シリコーン組成物及びその製造方法
WO2024005037A1 (ja) * 2022-07-01 2024-01-04 三井化学株式会社 表示装置
WO2024143115A1 (ja) * 2022-12-27 2024-07-04 パナソニックＩｐマネジメント株式会社 樹脂組成物、樹脂付きフィルム、プリプレグ、樹脂付き金属箔、金属張積層板、及びプリント配線板

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JP2006210612A (ja) * 2005-01-27 2006-08-10 Rohm Co Ltd 半導体装置
JP2006232950A (ja) * 2005-02-23 2006-09-07 Matsushita Electric Works Ltd 封止用液状エポキシ樹脂組成物、半導体装置及びその製造方法
JP2012126762A (ja) * 2010-12-13 2012-07-05 Sekisui Chem Co Ltd 熱伝導性接着剤
JP2012174533A (ja) * 2011-02-22 2012-09-10 Sekisui Chem Co Ltd 絶縁材料及び積層構造体
JP2013030637A (ja) * 2011-07-29 2013-02-07 Sumitomo Bakelite Co Ltd 液状樹脂組成物および半導体装置
CN103013357A (zh) * 2011-09-20 2013-04-03 日立化成工业株式会社 树脂糊剂组合物及半导体装置
JP2015074712A (ja) * 2013-10-08 2015-04-20 ナミックス株式会社 フィルム用樹脂組成物、絶縁フィルムおよび半導体装置
CN104823276A (zh) * 2013-11-21 2015-08-05 东部Hitek株式会社 覆晶薄膜型半导体封装及其制造方法
JP5766867B1 (ja) * 2014-11-25 2015-08-19 積水化学工業株式会社 半導体素子保護用材料及び半導体装置
CN105849187A (zh) * 2014-07-18 2016-08-10 积水化学工业株式会社 半导体元件保护用材料及半导体装置

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Publication number Priority date Publication date Assignee Title
JP2006210612A (ja) * 2005-01-27 2006-08-10 Rohm Co Ltd 半導体装置
JP2006232950A (ja) * 2005-02-23 2006-09-07 Matsushita Electric Works Ltd 封止用液状エポキシ樹脂組成物、半導体装置及びその製造方法
JP2012126762A (ja) * 2010-12-13 2012-07-05 Sekisui Chem Co Ltd 熱伝導性接着剤
JP2012174533A (ja) * 2011-02-22 2012-09-10 Sekisui Chem Co Ltd 絶縁材料及び積層構造体
JP2013030637A (ja) * 2011-07-29 2013-02-07 Sumitomo Bakelite Co Ltd 液状樹脂組成物および半導体装置
CN103013357A (zh) * 2011-09-20 2013-04-03 日立化成工业株式会社 树脂糊剂组合物及半导体装置
JP2015074712A (ja) * 2013-10-08 2015-04-20 ナミックス株式会社 フィルム用樹脂組成物、絶縁フィルムおよび半導体装置
CN104823276A (zh) * 2013-11-21 2015-08-05 东部Hitek株式会社 覆晶薄膜型半导体封装及其制造方法
CN105849187A (zh) * 2014-07-18 2016-08-10 积水化学工业株式会社 半导体元件保护用材料及半导体装置
JP5766867B1 (ja) * 2014-11-25 2015-08-19 積水化学工業株式会社 半導体素子保護用材料及び半導体装置

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KR20180061405A (ko) 2018-06-07
JP2018056595A (ja) 2018-04-05
KR101864096B1 (ko) 2018-06-01
KR20210107160A (ko) 2021-08-31
KR102097004B1 (ko) 2020-04-03
CN107735859A (zh) 2018-02-23
KR20180013842A (ko) 2018-02-07
JP6275863B2 (ja) 2018-02-07
JP2020170867A (ja) 2020-10-15
KR102294307B1 (ko) 2021-08-26
KR102460328B1 (ko) 2022-10-28
JP6731906B2 (ja) 2020-07-29
KR20200037437A (ko) 2020-04-08
JPWO2017030126A1 (ja) 2017-08-17
JP6905129B2 (ja) 2021-07-21
WO2017030126A1 (ja) 2017-02-23
KR102224210B1 (ko) 2021-03-08
CN107735859B (zh) 2020-08-14
TW201723071A (zh) 2017-07-01
TWI630230B (zh) 2018-07-21
KR20210027521A (ko) 2021-03-10

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